Abstract:
An example automatic gain control (AGC) circuit (206) includes a base current-gain circuit (302) having a programmable source degeneration resistance (304) responsive to first bits of an AGC code word. The AGC circuit further includes a programmable current-gain circuit (308), coupled between an input (328) and an output (330) of the base current-gain circuit, having a programmable current source (312) responsive to second bits of the AGC code word. The AGC circuit further includes a bleeder circuit (314), coupled to the output of the base current-gain circuit, having a programmable current source (316) responsive to logical complements of the second bits of the AGC code word. The AGC circuit further includes a load circuit (318) coupled to the output of the base current-gain circuit.
Abstract:
An input/output circuit (102) implemented in an integrated circuit (100) is described. The input/output circuit comprises an input/output pad (202, 204) and a voltage control circuit (229) coupled to the input/output pad. The voltage control circuit sets a voltage at the input/output pad at a first voltage when the input/output pad is implemented as an input pad (RX Mode control: high) and at a second voltage when the input/output pad is implemented as an output pad (RX Mode Control: low). Methods of implementing input/output circuits in an integrated circuit are also described.
Abstract:
An inductor structure implemented within a semiconductor integrated circuit (IC) includes a coil (105) of conductive material including at least one turn and a current return (130, 500) encompassing the coil. The current return is formed of a plurality of interconnected metal layers (510, 515, 520, 525) of the semiconductor integrated circuit.
Abstract:
A resonator circuit enabling temperature compensation includes an inductor (104) coupled between a first node (108) and a second node (1 10) of the resonator circuit; a capacitor circuit (106) coupled between the first node and the second node; and a temperature compensation circuit (1 12) coupled between the first node and the second node. The temperature compensation circuit comprises a varactor (302) coupled to receive a temperature control signal (304) that sets the capacitance of the varactor. A method of generating a resonating output is also disclosed.
Abstract:
An inductor structure (105, 500, 900) implemented within a semiconductor integrated circuit (IC) can include a coil (205, 505, 905) of conductive material that includes a center terminal (140, 510, 910) located at a midpoint of a length of the coil. The coil can be symmetrical with respect to a centerline (225, 535, 935) bisecting the center terminal. The coil can include a first differential terminal (210, 515, 915) and a second differential terminal (215, 520, 920). The inductor structure can include a return line (155, 560, 960) of conductive material positioned on the center line. The inductor structure can include an isolation ring (220, 525, 945) surrounding the coil. The inductor structure can include a patterned ground shield comprising a plurality of fingers (935, 1035) implemented within an IC process layer located between the coil (905) and a substrate (955) of the IC. The inductor structure can include an isolation wall (1 150) comprising a high conductive material formed to encompass the coil and the patterned ground shield. The isolation wall can be coupled to one end of each finger of the patterned ground shield.
Abstract:
An example clock generator circuit includes a fractional reference generator configured to generate a reference clock in response to a base reference clock and a phase error signal, the reference clock having a frequency that is a rational multiple of a frequency of the base reference clock. The clock generator circuit includes a digitally controlled delay line (DCDL) that delays the reference clock based on a first control code, and a pulse generator configured to generate pulses based on the delayed reference clock. The clock generator circuit includes a digitally controlled oscillator (DCO) configured to generate an output clock based on a second control code, the DCO including an injection input coupled to the pulse generator to receive the pulses. The clock generator circuit includes a phase detector configured to compare the output clock and the reference clock and generate the phase error signal, and a control circuit configured to generate the first and second control codes based on the phase error signal.
Abstract:
A common mode logic buffer device includes a current source configured to provide a source current. An input stage includes a first MOS transistor pair configured to generate, from the source current and based upon an input differential voltage, a differential current between two output paths. An output stage includes a second MOS transistor pair configured to generate an output differential voltage based upon an effective impedance provided for the each of the two output paths. An adjustment circuit is configured to adjust, in response to a control signal, the effective impedance of the second MOS transistor pair.