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    Process for manufacturing a micromechanical structure having a buried area provided with a filter
    31.
    发明授权
    Process for manufacturing a micromechanical structure having a buried area provided with a filter 有权
    具有设置有过滤器的掩埋区域的微机械结构的制造方法

    公开(公告)号：US09061248B1

    公开(公告)日：2015-06-23

    申请号：US14133290

    申请日：2013-12-18

    Applicant: STMicroelectronics S.r.l.

    Inventor： Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

    IPC: H01L21/00 ,  B01D67/00 ,  B01D71/02 ,  B01L3/00 ,  F04B19/00

    CPC classification number: B81C1/00119 ,  B01D67/0062 ,  B01D71/02 ,  B01D2325/021 ,  B01D2325/028 ,  B01L3/502707 ,  B01L3/502753 ,  B01L2300/0681 ,  B81B2201/10 ,  B81C1/00071 ,  B81C1/00087 ,  B81C2201/0133 ,  B81C2201/0157 ,  F04B19/006

    Abstract: A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.

    Abstract translation: 微机械结构的制造方法设想：在半导体材料体内形成通过第一表面层从主体顶表面分离的掩埋腔; 以及形成用于在所述掩埋腔和外部环境之间流体连通的进入管。 该方法设想：在第一进入区域的顶表面上形成蚀刻掩模; 在顶表面和蚀刻掩模上形成第二表面层; 进行蚀刻，以在对应于第一进入区域的位置中移除第二表面层的一部分，以及未被蚀刻掩模覆盖的第一表面层的下面的部分，直到达到掩埋空腔，因此 形成第一进入管道和过滤元件，设置在第一进入管道和相同的掩埋空腔之间。

    Process for manufacturing a micromechanical structure having a buried area provided with a filter
    32.
    发明授权
    Process for manufacturing a micromechanical structure having a buried area provided with a filter 有权
    具有设置有过滤器的掩埋区域的微机械结构的制造方法

    公开(公告)号：US08633553B2

    公开(公告)日：2014-01-21

    申请号：US13190254

    申请日：2011-07-25

    Applicant: Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

    Inventor： Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

    IPC: H01L29/84 ,  H01L21/00

    CPC classification number: B81C1/00119 ,  B01D67/0062 ,  B01D71/02 ,  B01D2325/021 ,  B01D2325/028 ,  B01L3/502707 ,  B01L3/502753 ,  B01L2300/0681 ,  B81B2201/10 ,  B81C1/00071 ,  B81C1/00087 ,  B81C2201/0133 ,  B81C2201/0157 ,  F04B19/006

    Abstract: A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.

    Abstract translation: 微机械结构的制造方法设想：在半导体材料体内形成通过第一表面层从主体顶表面分离的掩埋腔; 以及形成用于在所述掩埋腔和外部环境之间流体连通的进入管。 该方法设想：在第一进入区域的顶表面上形成蚀刻掩模; 在顶表面和蚀刻掩模上形成第二表面层; 进行蚀刻，以在对应于第一进入区域的位置中移除第二表面层的一部分，以及未被蚀刻掩模覆盖的第一表面层的下面部分，直到达到掩埋空腔，因此 形成第一进入管道和过滤元件，设置在第一进入管道和相同的掩埋空腔之间。

    Method For Manufacturing A Membrane In A (111) Surface Of A (100) Silicon Wafer
    35.
    发明申请
    Method For Manufacturing A Membrane In A (111) Surface Of A (100) Silicon Wafer 审中-公开
    在（100）硅晶片的（111）表面中制造膜的方法

    公开(公告)号：US20080020579A1

    公开(公告)日：2008-01-24

    申请号：US10550384

    申请日：2004-03-22

    Applicant: Warner Jurrien Venstra

    Inventor： Warner Jurrien Venstra

    IPC: H01L21/311

    CPC classification number: B81C1/0015 ,  B81B2201/10 ,  B81B2201/12 ,  B81B2203/019 ,  B81C1/00158 ,  B81C2201/0132

    Abstract: The invention relates to a method for the fabrication of a membrane oriented in a (111) plane of a (100) silicon wafer. To this end the method comprises the following steps: applying a mask to both sides of the wafer, wherein portions of the sides are covered by the mask; and the at least partial removal by etching away silicon material from the portions of the two sides of the wafer that are not covered. This method is characterised in that the etching step substantially removes the silicon material forming recesses in the two surfaces of the wafer, such that the walls of the recesses are formed by (111) planes, and in that not covered portions at both sides of the wafer are aligned in relation to one another such that a (111) plane is formed and the distance d between said two planes is less than the thickness of the silicon wafer, so as to form a membrane in the (111) plane having a thickness d. Such a membrane has many application possibilities in the field of MEMS, for example by dividing the membrane into individual cantilevers.

    Abstract translation: 本发明涉及一种用于制造在（100）硅晶片的（111）面中取向的膜的方法。 为此，该方法包括以下步骤：将掩模施加到晶片的两侧，其中边的部分被掩模覆盖; 以及通过从未覆盖的晶片的两侧的部分蚀刻掉硅材料来进行至少部分去除。 该方法的特征在于，蚀刻步骤基本上去除晶片的两个表面中的形成硅材料的凹槽，使得凹部的壁由（111）面形成，并且在该两面的不覆盖部分 晶片相对于彼此对准，使得形成（111）面并且所述两个平面之间的距离d小于硅晶片的厚度，以便在（111）面中形成具有厚度的膜 d。 这种膜在MEMS领域具有许多应用可能性，例如通过将膜分成单独的悬臂。

    Method for fabrication of a molecular filter and apparatus formed by the same
    36.
    发明申请
    Method for fabrication of a molecular filter and apparatus formed by the same 有权
    用于制造分子过滤器的方法及由其形成的装置

    公开(公告)号：US20020173015A1

    公开(公告)日：2002-11-21

    申请号：US09855404

    申请日：2001-05-15

    Inventor： Axel Scherer

    IPC: C12N013/00

    CPC classification number: F16K99/0001 ,  B01D61/18 ,  B01D67/0062 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B01D71/027 ,  B01D2325/04 ,  B01D2325/26 ,  B01L2400/082 ,  B81B1/004 ,  B81B2201/10 ,  B81C1/00087 ,  B81C2201/019 ,  B82Y30/00 ,  F15C5/00 ,  F16K99/0015 ,  F16K99/0042 ,  F16K99/0051 ,  F16K2099/0074 ,  F16K2099/008 ,  Y10S264/48

    Abstract: The invention is a method for fabricating molecular filters which can separate objects approximately 1-5 nm in range, where the filtration size is controlled by using thin films of materials and technologies to form a filtration channel or pore in a middle thin film layer in a multilayered structure. Lithography is used to define two offset arrays of blind holes into the opposing sides of a multi-layer membrane. The blind holes extend across a thin central filtration layer. A selective etch is used to attack the filtration layer to form a communicating channel between the two holes. The only connection between one side of the filter and the other is through the channel in the filter layer, whose thickness, d, determines the largest size object which can traverse the filter.

    Abstract translation: 本发明是一种制造分子过滤器的方法，其可以分离大约1-5nm范围内的物体，其中过滤尺寸通过使用材料和技术的薄膜来控制，以在中间薄膜层中形成过滤通道或孔 多层结构。 使用平版印刷术将盲孔的两个偏移阵列定义在多层膜的相对侧中。 盲孔延伸穿过薄的中央过滤层。 使用选择性蚀刻来攻击过滤层以在两个孔之间形成连通通道。 过滤器一侧之间的唯一连接是通过过滤层中的通道，其厚度d决定可以穿过过滤器的最大尺寸的物体。

    PROCESS FOR MANUFACTURING A MICROMECHANICAL STRUCTURE HAVING A BURIED AREA PROVIDED WITH A FILTER
    39.
    发明申请
    PROCESS FOR MANUFACTURING A MICROMECHANICAL STRUCTURE HAVING A BURIED AREA PROVIDED WITH A FILTER 审中-公开
    制造具有过滤器的烧结区域的微观结构的方法

    公开(公告)号：US20150175410A1

    公开(公告)日：2015-06-25

    申请号：US14133290

    申请日：2013-12-18

    Applicant: STMicroelectronics S.r.l.

    Inventor： Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

    IPC: B81C1/00

    CPC classification number: B81C1/00119 ,  B01D67/0062 ,  B01D71/02 ,  B01D2325/021 ,  B01D2325/028 ,  B01L3/502707 ,  B01L3/502753 ,  B01L2300/0681 ,  B81B2201/10 ,  B81C1/00071 ,  B81C1/00087 ,  B81C2201/0133 ,  B81C2201/0157 ,  F04B19/006

    Abstract: A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.

    Abstract translation: 微机械结构的制造方法设想：在半导体材料体内形成通过第一表面层从主体顶表面分离的掩埋腔; 以及形成用于在所述掩埋腔和外部环境之间流体连通的进入管。 该方法设想：在第一进入区域的顶表面上形成蚀刻掩模; 在顶表面和蚀刻掩模上形成第二表面层; 进行蚀刻，以在对应于第一进入区域的位置中移除第二表面层的一部分，以及未被蚀刻掩模覆盖的第一表面层的下面部分，直到达到掩埋空腔，因此 形成第一进入管道和过滤元件，设置在第一进入管道和相同的掩埋空腔之间。

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