Abstract:
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of α-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
Abstract:
A circuit board includes a board body, a signal conductor, a power supply conductor, and a first reference conductor. The signal conductor is in the board body and a high frequency signal is transmitted through the signal conductor. The power supply conductor is in the board body and is connected to a power supply potential. The power supply conductor extends along at least a portion of the signal conductor. The first reference conductor is in the board body and is insulated from the signal conductor and the power supply conductor.
Abstract:
A suspension board with circuit includes a metal supporting layer, a base insulating layer disposed at one side in a thickness direction of the metal supporting layer, a conductive pattern including a wire disposed at one side in the thickness direction of the base insulating layer and a terminal exposed from the metal supporting layer and the base insulating layer when viewed from the other side in the thickness direction, a piezoelectric element disposed at the other side in the thickness direction with respect to the terminal and including an element terminal electrically connected to the terminal, and a solder layer disposed between the terminal and the element terminal. The solder layer has a solder composition containing Sn, Ag, and Cu, and the solder layer has a thickness in the thickness direction of 50 μm or less.
Abstract:
To provide a copper foil that the transmission loss is favorably controlled even when the copper foil is used in a high-frequency circuit board and that adhesion to a resin is favorable.A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.
Abstract:
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
Abstract:
An imprinted micro-structure includes a substrate having a first layer in relation thereto. First, second, and third micro-channels are imprinted in the first layer and have first, second, and third micro-wires respectively located therein. A second layer is adjacent to and in contact with the first layer. Imprinted first and second connecting micro-channels including first and second connecting micro-wires are in contact with the first and second micro-wires respectively and are isolated from the third micro-wire. A third layer is adjacent to and in contact with the second layer and has an imprinted bridge micro-channel with a bridge micro-wire contacting the first and second connecting micro-wires and separate from the third micro-wire so that the first and second micro-wires are electrically connected and electrically isolated from the third micro-wire.
Abstract:
A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.
Abstract:
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of α-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
Abstract:
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.