SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF

    公开(公告)号:US20180070457A1

    公开(公告)日:2018-03-08

    申请号:US15664300

    申请日:2017-07-31

    CPC classification number: H05K3/34 H05K1/0296 H05K1/18 H05K2201/09209

    Abstract: A suspension board with circuit includes a metal supporting layer, a base insulating layer disposed at one side in a thickness direction of the metal supporting layer, a conductive pattern including a wire disposed at one side in the thickness direction of the base insulating layer and a terminal exposed from the metal supporting layer and the base insulating layer when viewed from the other side in the thickness direction, a piezoelectric element disposed at the other side in the thickness direction with respect to the terminal and including an element terminal electrically connected to the terminal, and a solder layer disposed between the terminal and the element terminal. The solder layer has a solder composition containing Sn, Ag, and Cu, and the solder layer has a thickness in the thickness direction of 50 μm or less.

    Imprinted multi-layer micro-structure
    36.
    发明授权
    Imprinted multi-layer micro-structure 有权
    印刷多层微结构

    公开(公告)号:US09078360B2

    公开(公告)日:2015-07-07

    申请号:US14012195

    申请日:2013-08-28

    Abstract: An imprinted micro-structure includes a substrate having a first layer in relation thereto. First, second, and third micro-channels are imprinted in the first layer and have first, second, and third micro-wires respectively located therein. A second layer is adjacent to and in contact with the first layer. Imprinted first and second connecting micro-channels including first and second connecting micro-wires are in contact with the first and second micro-wires respectively and are isolated from the third micro-wire. A third layer is adjacent to and in contact with the second layer and has an imprinted bridge micro-channel with a bridge micro-wire contacting the first and second connecting micro-wires and separate from the third micro-wire so that the first and second micro-wires are electrically connected and electrically isolated from the third micro-wire.

    Abstract translation: 压印的微结构包括具有与之相关的第一层的衬底。 第一,第二和第三微通道印在第一层中,并且分别位于其中的第一,第二和第三微细线。 第二层与第一层相邻并与第一层接触。 包括第一和第二连接微线的印刷的第一和第二连接微通道分别与第一和第二微线接触并与第三微线隔离。 第三层与第二层相邻并与第二层接触,并且具有印刷桥微通道,桥接微线与第一和第二连接微线接触并与第三微线分离,使得第一和第二 微线电连接并与第三微线电隔离。

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