公开(公告)号：EP3128043A1

公开(公告)日：2017-02-08

申请号：EP16182479.2

申请日：2016-08-02

Applicant: Rohm and Haas Electronic Materials LLC ,  Dow Global Technologies LLC

Inventor： THORSETH, Matthew ,  ZUHRA, Niazimbetova ,  QIN, Yi ,  WOERTINK, Julia ,  DZIEWISZEK, Joanna ,  REDDINGTON, Erik ,  LEFEBVRE, Mark

IPC: C25D3/38 ,  C25D5/02 ,  C25D7/00

CPC classification number: C25D3/38 ,  C25D5/022 ,  C25D7/00 ,  C25D7/123 ,  H01L24/03 ,  H01L24/06 ,  H01L24/11 ,  H01L24/14 ,  H01L2224/03462 ,  H01L2224/03472 ,  H01L2224/05015 ,  H01L2224/11 ,  H01L2224/11472 ,  H01L2224/13014 ,  H01L2224/13147 ,  H05K1/111 ,  H05K3/064 ,  H05K3/4007 ,  H05K2201/09209 ,  H01L2924/00012

Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of α-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Abstract translation: 电镀方法能够限定光致抗蚀剂特征具有基本上均一的形态的镀覆。 电镀方法包括铜电镀浴用的氨基酸的反应产物和双环氧化物±电镀光刻胶限定的特征。 搜索功能包括支柱，焊盘和线路的空间功能。

公开(公告)号：US20230156910A1

公开(公告)日：2023-05-18

申请号：US18098811

申请日：2023-01-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke KIKUCHI ,  Kosuke NISHIO

IPC: H05K1/02 ,  H01P3/08 ,  H05K1/05

CPC classification number: H05K1/0237 ,  H01P3/08 ,  H05K1/05 ,  H05K2201/09209 ,  H05K2201/10015

Abstract: A circuit board includes a board body, a signal conductor, a power supply conductor, and a first reference conductor. The signal conductor is in the board body and a high frequency signal is transmitted through the signal conductor. The power supply conductor is in the board body and is connected to a power supply potential. The power supply conductor extends along at least a portion of the signal conductor. The first reference conductor is in the board body and is insulated from the signal conductor and the power supply conductor.

公开(公告)号：US20180070457A1

公开(公告)日：2018-03-08

申请号：US15664300

申请日：2017-07-31

Applicant: NITTO DENKO CORPORATION

Inventor： Takatoshi SAKAKURA ,  Tomoaki OKUNO ,  Takahiro TAKANO

IPC: H05K3/34 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K3/34 ,  H05K1/0296 ,  H05K1/18 ,  H05K2201/09209

Abstract: A suspension board with circuit includes a metal supporting layer, a base insulating layer disposed at one side in a thickness direction of the metal supporting layer, a conductive pattern including a wire disposed at one side in the thickness direction of the base insulating layer and a terminal exposed from the metal supporting layer and the base insulating layer when viewed from the other side in the thickness direction, a piezoelectric element disposed at the other side in the thickness direction with respect to the terminal and including an element terminal electrically connected to the terminal, and a solder layer disposed between the terminal and the element terminal. The solder layer has a solder composition containing Sn, Ag, and Cu, and the solder layer has a thickness in the thickness direction of 50 μm or less.

公开(公告)号：US20170303405A1

公开(公告)日：2017-10-19

申请号：US15486899

申请日：2017-04-13

Applicant: JX NIPPON MINING & METALS CORPORATION

Inventor： RYO FUKUCHI

IPC: H05K3/46 ,  B32B27/06 ,  B32B37/14 ,  H05K1/02 ,  B32B15/08 ,  H05K1/09 ,  B32B38/10 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K3/4652 ,  B32B15/08 ,  B32B27/06 ,  B32B37/14 ,  B32B38/10 ,  B32B2457/08 ,  H05K1/0237 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0026 ,  H05K3/022 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2201/09209 ,  H05K2203/107

Abstract: To provide a copper foil that the transmission loss is favorably controlled even when the copper foil is used in a high-frequency circuit board and that adhesion to a resin is favorable.A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.

公开(公告)号：US20170042037A1

公开(公告)日：2017-02-09

申请号：US15220460

申请日：2016-07-27

Applicant: Rohm and Haas Electronic Materials LLC ,  Dow Global Technologies LLC

Inventor： Matthew Thorseth ,  Zuhra Niazimbetova ,  Yi Qin ,  Julia Woertink ,  Joanna Dziewiszek ,  Erik Reddington ,  Mark Lefebvre

IPC: H05K3/06 ,  C25D3/38 ,  H01L23/00 ,  C25D7/12 ,  H05K3/40 ,  H05K1/11 ,  G03F7/40 ,  C25D5/02

CPC classification number: H05K3/064 ,  C25D3/38 ,  C25D5/022 ,  C25D7/00 ,  C25D7/123 ,  G03F7/405 ,  H01L24/03 ,  H01L24/06 ,  H01L24/11 ,  H01L24/14 ,  H01L2224/03462 ,  H01L2224/03472 ,  H01L2224/05015 ,  H01L2224/05147 ,  H01L2224/11 ,  H01L2224/11462 ,  H01L2224/11472 ,  H01L2224/13147 ,  H05K1/111 ,  H05K3/4007 ,  H05K2201/09209 ,  H01L2924/00012

Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Abstract translation: 电镀方法能够镀覆具有基本均匀形态的光致抗蚀剂限定特征。 电镀方法包括具有吡啶基烷基胺和二环氧化物的反应产物的电镀铜电镀以电镀所述光刻胶定义的特征。 这些特征包括支柱，接合垫和线空间特征。

公开(公告)号：US09078360B2

公开(公告)日：2015-07-07

申请号：US14012195

申请日：2013-08-28

Applicant: Ronald Steven Cok

Inventor： Ronald Steven Cok

IPC: H05K1/11 ,  H05K1/00 ,  H05K1/02 ,  H05K3/46 ,  H05K3/12 ,  H05K3/00

CPC classification number: H05K1/0274 ,  H05K1/0298 ,  H05K1/097 ,  H05K3/0041 ,  H05K3/12 ,  H05K3/1258 ,  H05K3/1275 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/465 ,  H05K3/4685 ,  H05K2201/09209 ,  H05K2201/09281 ,  H05K2201/0979 ,  H05K2201/09845 ,  H05K2203/0108

Abstract: An imprinted micro-structure includes a substrate having a first layer in relation thereto. First, second, and third micro-channels are imprinted in the first layer and have first, second, and third micro-wires respectively located therein. A second layer is adjacent to and in contact with the first layer. Imprinted first and second connecting micro-channels including first and second connecting micro-wires are in contact with the first and second micro-wires respectively and are isolated from the third micro-wire. A third layer is adjacent to and in contact with the second layer and has an imprinted bridge micro-channel with a bridge micro-wire contacting the first and second connecting micro-wires and separate from the third micro-wire so that the first and second micro-wires are electrically connected and electrically isolated from the third micro-wire.

Abstract translation: 压印的微结构包括具有与之相关的第一层的衬底。 第一，第二和第三微通道印在第一层中，并且分别位于其中的第一，第二和第三微细线。 第二层与第一层相邻并与第一层接触。 包括第一和第二连接微线的印刷的第一和第二连接微通道分别与第一和第二微线接触并与第三微线隔离。 第三层与第二层相邻并与第二层接触，并且具有印刷桥微通道，桥接微线与第一和第二连接微线接触并与第三微线分离，使得第一和第二 微线电连接并与第三微线电隔离。

公开(公告)号：JP6129769B2

公开(公告)日：2017-05-17

申请号：JP2014045684

申请日：2014-03-07

Applicant: 富士フイルム株式会社

Inventor： 片桐 健介 ,  田尻 新 ,  長谷 明彦

IPC: H01B5/14 ,  B32B7/02 ,  G06F3/041 ,  G06F3/044 ,  H01B13/00

CPC classification number: H05K1/09 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G09F9/00 ,  H01B1/02 ,  H01L51/0021 ,  H05K1/0296 ,  H05K3/027 ,  H05K3/10 ,  H01L51/5212 ,  H05K2201/0364 ,  H05K2201/09209 ,  H05K2203/0502 ,  Y10T29/49155

公开(公告)号：US09818682B2

公开(公告)日：2017-11-14

申请号：US14558864

申请日：2014-12-03

Applicant: International Business Machines Corporation

Inventor： Edmund Blackshear ,  Shidong Li

IPC: B32B3/24 ,  B32B5/16 ,  B32B7/02 ,  B32B15/092 ,  B32B27/04 ,  B32B27/38 ,  B32B37/02 ,  H01L23/48 ,  H01L23/498 ,  B32B3/26 ,  B32B38/00 ,  B32B37/18 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K13/00 ,  H01L21/48 ,  B32B15/20 ,  B32B27/20 ,  B32B3/08 ,  B32B3/10

CPC classification number: H01L23/49833 ,  B32B3/08 ,  B32B3/10 ,  B32B3/266 ,  B32B5/16 ,  B32B7/02 ,  B32B15/092 ,  B32B15/20 ,  B32B27/04 ,  B32B27/20 ,  B32B27/38 ,  B32B37/02 ,  B32B37/182 ,  B32B38/0004 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/10 ,  B32B2264/101 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/734 ,  B32B2363/00 ,  B32B2457/00 ,  B32B2457/14 ,  H01L21/4803 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K2201/0137 ,  H05K2201/0191 ,  H05K2201/0206 ,  H05K2201/0209 ,  H05K2201/09136 ,  H05K2201/09209 ,  H05K2201/0929 ,  H05K2203/06 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/24298 ,  Y10T428/24314 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/25 ,  H01L2924/00

Abstract: A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.

公开(公告)号：US20170037527A1

公开(公告)日：2017-02-09

申请号：US15220472

申请日：2016-07-27

Applicant: Rohm and Haas Electronic Materials LLC ,  Dow Global Technologies LLC

Inventor： Matthew Thorseth ,  Zuhra Niazimbetova ,  Yi Qin ,  Julia Woertink ,  Joanna Dziewiszek ,  Erik Reddington ,  Mark Lefebvre

IPC: C25D3/38 ,  C25D7/12 ,  H01L23/00 ,  H05K3/40 ,  H05K1/11 ,  C25D5/02 ,  H05K3/06

CPC classification number: C25D3/38 ,  C25D5/022 ,  C25D7/00 ,  C25D7/123 ,  H01L24/03 ,  H01L24/06 ,  H01L24/11 ,  H01L24/14 ,  H01L2224/03462 ,  H01L2224/03472 ,  H01L2224/05015 ,  H01L2224/11 ,  H01L2224/11472 ,  H01L2224/13014 ,  H01L2224/13147 ,  H05K1/111 ,  H05K3/064 ,  H05K3/4007 ,  H05K2201/09209 ,  H01L2924/00012

Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of α-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Abstract translation: 电镀方法能够镀覆具有基本均匀形态的光致抗蚀剂限定特征。 电镀方法包括具有α-氨基酸和双环氧化物的反应产物的电镀铜电镀以电镀所述光致抗蚀剂的特征。 这些特征包括支柱，接合垫和线空间特征。

公开(公告)号：US20170037526A1

公开(公告)日：2017-02-09

申请号：US15220467

申请日：2016-07-27

Applicant: Rohm and Haas Electronic Materials LLC ,  Dow Global Technologies LLC

Inventor： Matthew Thorseth ,  Zuhra Niazimbetova ,  Yi Qin ,  Julia Woertink ,  Joanna Dziewiszek ,  Erik Reddington ,  Mark Lefebvre

IPC: C25D3/38 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H05K1/11 ,  C25D5/02 ,  G03F7/40 ,  H05K3/06 ,  H05K3/40 ,  H01L23/00 ,  C25D7/12

CPC classification number: C25D3/38 ,  C25D5/022 ,  C25D7/00 ,  C25D7/12 ,  C25D7/123 ,  G03F7/405 ,  H01L21/76879 ,  H01L23/5226 ,  H01L23/53228 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03462 ,  H01L2224/05147 ,  H01L2224/11 ,  H01L2224/11462 ,  H01L2224/13147 ,  H05K1/11 ,  H05K3/064 ,  H05K3/4007 ,  H05K2201/09209 ,  H01L2924/00012

Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Abstract translation: 电镀方法能够镀覆具有基本均匀形态的光致抗蚀剂限定特征。 电镀方法包括具有咪唑和双环氧化物的反应产物的电镀铜电镀以电镀光刻胶定义的特征。 这些特征包括支柱，接合垫和线空间特征。