公开(公告)号：KR101100381B1

公开(公告)日：2011-12-30

申请号：KR1020090069392

申请日：2009-07-29

Applicant: 도레이첨단소재 주식회사

Inventor： 김우석 ,  문기정 ,  전해상

IPC: C09J133/08 ,  C09J163/00 ,  C09J7/02

Abstract: 본 발명은 할로겐프리 커버레이 필름용 접착제 조성물 및 이를 도포한 커버레이 필름에 관한 것으로서, 보다 상세하게는 일반적으로 커버레이 접착제의 바인더로 적용되고 있는 니트릴부타디엔 고무(NBR)를 적용하지 않고, 하이드록시기와 카르복실기를 포함하고 있는 아크릴 공중합체를 적용하여 노출되는 습기에도 접착력 및 내열성이 저하되지 않는 할로겐프리 커버레이 필름용 접착제 조성물 및 이를 도포한 커버레이 필름에 관한 것이며, 이를 위해 본 발명에 따른 할로겐프리 커버레이 필름용 접착제 조성물은, (1) 하이드록시기와 카르복실기가 포함하고, 중량평균분자량이 300,000 ~ 800,000 이며, 25℃에서의 점도가 800 ~ 10,000 cP인 아크릴 수지와, (2) 페놀 수지와, (3) 다관능성 에폭시 수지와, (4) 경화제와, (5) 경화 촉진제와, (6) 비할로겐계 난연제와, (7) 무기 입자 및 (8) 가교제를 포함하는 것을 특징으로 한다.
아크릴 수지, 커버레이, 할로겐 프리

公开(公告)号：KR1020110076383A

公开(公告)日：2011-07-06

申请号：KR1020090133079

申请日：2009-12-29

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  전해상 ,  문기정 ,  김우석

IPC: C09J109/02 ,  C09J179/08 ,  C09J163/00 ,  C09J7/02

CPC classification number: C09J109/02 ,  C09J7/22 ,  C09J7/35 ,  C09J11/06 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326

Abstract: PURPOSE: An adhesive composition for electronic application is provided to ensure excellent adhesive property and heat resistance and good heat dispersibility. CONSTITUTION: An adhesive composition for electronic application includes, based on 100 parts by weight of a nitrile-butadiene polymer, 1-100 parts by weight of an imide resin, 1-100 parts by weight of an epoxy resin, and 1-50 parts by weight of a phenoxy resin and 1-10 parts by weight of flame retardant. The adhesive composition further includes 1-5 parts by weight of polyhedral oligomeric silsesquioxane represented by chemical formula 1. In chemical formula 1, R is independently a hydrogen atom, halogen atom, C1-10 linear or branched alkyl group, cyclic alkyl group, aralkyl group, alkenyl group, oxalic acid, aryl group or aniline group.

Abstract translation: 目的：提供用于电子应用的粘合剂组合物，以确保优异的粘合性能和耐热性以及良好的热分散性。 构成：用于电子应用的粘合剂组合物包括基于100重量份的腈 - 丁二烯聚合物，1-100重量份的酰亚胺树脂，1-100重量份的环氧树脂和1-50重量份 的苯氧基树脂和1-10重量份的阻燃剂。 粘合剂组合物还包含1-5重量份由化学式1表示的多面体低聚倍半硅氧烷。在化学式1中，R独立地为氢原子，卤素原子，C 1-10直链或支链烷基，环烷基，芳烷基 基团，烯基，草酸，芳基或苯胺基。

公开(公告)号：KR1020110019006A

公开(公告)日：2011-02-25

申请号：KR1020090076537

申请日：2009-08-19

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  전해상 ,  문기정 ,  김우석

IPC: C09J133/08 ,  C09J163/00 ,  C09J7/02

CPC classification number: C09J7/385 ,  C09J11/06 ,  C09J133/06 ,  C09J2203/326

Abstract: PURPOSE: An adhesive tape composition for electronic components is provided to ensure enough thermal resistance in case of adhering electronic components and to prevent corrosion of a lead frame and adhesive. CONSTITUTION: An adhesive tape composition for electronic components contains 1-200 weight parts of epoxy resin composition, 0.1-100 weight parts of phenoxy, 0.01-10 weight parts of corrosion inhibitor, and 5-20 weight parts of hardener. The phenoxy resin is selected from bisphenol A type, bisphenol F type, phosphorous-based phenoxy, bisphenol S type, PKHB, PKHC, PKHH, PKHJ, PKFE, PKHP-200, PKHS-30, PKHM-30, LER derivative, SER-10, SER-25, and LEN-HB.

Abstract translation: 目的：提供一种用于电子部件的胶带组合物，用于在粘附电子部件的情况下确保足够的热阻，并防止引线框和粘合剂的腐蚀。 构成：电子部件用胶带组合物含有1-200重量份环氧树脂组合物，0.1-100重量份苯氧基，0.01-10重量份防腐蚀剂和5-20重量份硬化剂。 苯氧基树脂选自双酚A型，双酚F型，磷类苯氧基，双酚S型，PKHB，PKHC，PKHH，PKHJ，PKFE，PKHP-200，PKHS-30，PKHM-30，LER衍生物，SER- 10，SER-25和LEN-HB。

公开(公告)号：KR1020100097247A

公开(公告)日：2010-09-03

申请号：KR1020090016091

申请日：2009-02-26

Applicant: 도레이첨단소재 주식회사

Inventor： 홍승우 ,  김우석 ,  문기정 ,  전해상

IPC: C08L63/00 ,  C08L69/00 ,  C08J5/18 ,  H01L21/60

CPC classification number: H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83192

Abstract: PURPOSE: A resin composition for a no-flow underfill, and a no-flow underfill film using thereof are provided to secure the excellent crack resistance of the underfill film, and to rapidly hardening the composition at the soldering process temperature. CONSTITUTION: A resin composition for a no-flow underfill contains the following: 100 parts of epoxy resin by weight; 5~80 parts of thermally depolymerizable resin by weight containing an acid catalyst; 1~110 parts of hardener and curing accelerator by weight; 3~80 parts of modifying thermoplastic resin by weight; and 0.01~0.10 parts of fusion material by weight.

Abstract translation: 目的：提供用于无流动底部填充剂的树脂组合物和使用其的无流动底部填充膜，以确保底部填充膜的优异的抗裂性，并且在焊接工艺温度下快速硬化组合物。 构成：用于无流动底部填充物的树脂组合物含有：100重量份的环氧树脂; 5〜80份含有酸催化剂的热解聚树脂; 1〜110份硬化剂和固化促进剂重量; 3〜80份改性热塑性树脂重量份; 和0.01〜0.10份重量的熔融材料。

公开(公告)号：KR1020100095195A

公开(公告)日：2010-08-30

申请号：KR1020090014348

申请日：2009-02-20

Applicant: 도레이첨단소재 주식회사

Inventor： 배연웅 ,  김우석 ,  문기정 ,  전해상

IPC: C09J163/00 ,  C09J109/02

CPC classification number: C09J163/00 ,  B32B15/08 ,  C08K5/02 ,  C08L9/02 ,  C08L13/00 ,  C09J9/00 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08

Abstract: PURPOSE: An adhesive composition is provided to prevent the generation of harmful gas in combustion without including halogen and to be used as a coverlay film by improving permittivity and anti-migration when the adhesive composition is applied to a conductive substrate. CONSTITUTION: An adhesive composition comprises: 50-80 parts by weight of an acrylic rubber containing a carboxylic group; 15-20 parts by weight of a polyfunctional hardening agent; 20-100.0 parts by weight of flame retardant; and 5-20 parts by weight of a fluorine-based compound based on 100.0 parts by weight of a non-halogen epoxy resin. The viscosity of the adhesive composition is 200-1,000 cps. A method for forming a coverlay film includes a step of forming an adhesive layer(20) by spreading the adhesive composition on an insulating film(10) and a step of laminating a release substrate(30) on the adhesive layer.

Abstract translation: 目的：提供粘合剂组合物以防止在不包括卤素的情况下燃烧中产生有害气体，并且当将粘合剂组合物应用于导电基材时，通过提高介电常数和抗迁移性来用作覆盖膜。 构成：粘合剂组合物包含：50-80重量份的含有羧基的丙烯酸橡胶; 15-20重量份的多官能硬化剂; 20-100.0重量份阻燃剂; 和基于100.0重量份的非卤素环氧树脂的5-20重量份的氟基化合物。 粘合剂组合物的粘度为200-1,000cps。 形成覆盖层膜的方法包括通过将粘合剂组合物铺展在绝缘膜（10）上形成粘合剂层（20）的步骤和将粘合剂层（30）层压到粘合剂层上的步骤。

公开(公告)号：KR1020090077590A

公开(公告)日：2009-07-15

申请号：KR1020080003622

申请日：2008-01-11

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  전해상 ,  문기정 ,  김우석

IPC: C09J113/00

CPC classification number: C09J113/00 ,  C08K5/132 ,  C08K5/17 ,  C09J9/00 ,  C09J11/06 ,  C09J161/04 ,  C09J163/00

Abstract: A liquid adhesive for electronic parts is provided to ensure excellent adhesive force, enough heat resistance and reliability in the adhesion between neighboring parts of a lead frame of a semiconductor device or other electronic components. A liquid adhesive(10) for electronic parts comprises a thermosetting resin, a thermoplastic resin and a hardener. The thermoplastic resin is NBR including a carboxyl group, contains a carboxyl group of 1~20 weight% and has weight average molecular weight of 10,000~300,000. Based on NBR 150 parts by weight containing the carboxyl group, the liquid adhesive comprises a multifunctional phenol resin 20~400 parts by weight and a multifunctional epoxy resin 3~300 parts by weight as a thermosetting resin; and triethylenetetramine 5 parts by weight and benzophenonetetracarboxylic anhydride 5 parts by weight as a hardener.

Abstract translation: 提供了用于电子部件的液体粘合剂以确保优异的粘合力，足够的耐热性和半导体器件的引线框架的相邻部件之间的粘合力的可靠性或其他电子部件。 用于电子部件的液体粘合剂（10）包括热固性树脂，热塑性树脂和硬化剂。 热塑性树脂是包含羧基的NBR，含有1〜20重量％的羧基，重均分子量为10,000〜30万。 基于含有羧基的NBR 150重量份，液体粘合剂包含20〜400重量份的多官能酚醛树脂和3〜300重量份的多官能环氧树脂作为热固性树脂; 和三亚乙基四胺5重量份，二苯甲酮四羧酸酐5重量份作为硬化剂。

公开(公告)号：KR100802560B1

公开(公告)日：2008-02-14

申请号：KR1020060075270

申请日：2006-08-09

Applicant: 도레이첨단소재 주식회사

Inventor： 전해상 ,  문기정 ,  김우석 ,  이승우

IPC: C09J133/20 ,  C09J7/02 ,  C09J7/00

CPC classification number: C09J7/35 ,  C09J2201/128 ,  C09J2203/326

Abstract: A thermosetting double-sided adhesive film for a bonding sheet used in the lamination of a flexible printed circuit board is provided to improve fast curing property and workability. A thermosetting double-sided adhesive film comprises a releasing paper(30); an adhesive layer(20) formed on the one side of the releasing paper; and a stripping film(10) laminated on the adhesive layer, wherein the adhesive layer is laminated with an adhesive composition which comprises an acrylonitrile-butadiene rubber having a weight average molecular weight of 2,000-200,000, an acrylonitrile content of 10-60 wt% and a carboxyl group content of 1-20 wt%; at least one curing agent selected from a multifunctional epoxy resin, a multifunctional phenolic resin, an amine-based compound or acid anhydride; and a siloxane compound.

Abstract translation: 提供了一种用于柔性印刷电路板层压的接合片的热固性双面粘合膜，以提高快速固化性能和可加工性。 热固性双面粘合膜包括脱模纸（30）; 形成在所述脱模纸一侧的粘合剂层（20） 和层压在粘合剂层上的剥离膜（10），其中粘合剂层与包含重均分子量为2,000-200,000的丙烯腈 - 丁二烯橡胶，丙烯腈含量为10-60重量％的粘合剂组合物层压， 羧基含量为1-20重量％; 选自多官能环氧树脂，多官能酚醛树脂，胺类化合物或酸酐中的至少一种固化剂; 和硅氧烷化合物。

公开(公告)号：KR1020060035285A

公开(公告)日：2006-04-26

申请号：KR1020040084712

申请日：2004-10-22

Applicant: 도레이첨단소재 주식회사

Inventor： 김상필 ,  전해상 ,  김우석 ,  차세영

IPC: C09J163/00

CPC classification number: C08L13/00 ,  C08L61/06 ,  C08L63/00 ,  C08L2666/04 ,  C09J163/00 ,  Y10T428/1476 ,  Y10T428/266 ,  Y10T428/31721 ,  Y10T428/31938 ,  C08L2666/02

Abstract: The present invention pertains to an adhesive tape composition for electronic components used for bonding electronic components used in semiconductor devices, e.g., leads, PRH, semiconductor chips, die pads, etc. In particular, the present invention concerns an adhesive tape composition excellent in electric reliability, adhesive strength and taping workability. The adhesive tape composition according to the present invention is characterized in that it contains acrylonitrile butadiene rubber (NBR) containing the carboxyl functional group at the end thereof, epoxy resin, phenol resin and one or more sorts of hardener selected from amine and acid anhydride hardeners.

Abstract translation: 另外，本发明涉及对用于构成半导体装置的电子部件，并且在电可靠性特别优异的接合电子元件，和粘合性，胶带可加工性，如铅，散热器，半导体芯片，芯片焊盘的胶带组合物 具有优异性能的胶带组合物。

公开(公告)号：KR1020040009616A

公开(公告)日：2004-01-31

申请号：KR1020020043621

申请日：2002-07-24

Applicant: 도레이첨단소재 주식회사

Inventor： 김우석

IPC: C09J7/02

CPC classification number: C09J9/00 ,  C08L9/02 ,  C08L61/06 ,  C09J11/04 ,  C09J11/06 ,  C09J109/02 ,  C09J161/06 ,  C09J2203/326

Abstract: PURPOSE: A heat resistant adhesive tape for electronic parts is provided, to improve adhesive strength, heat resistance, workability and aging stability of an adhesive tape used for fixing a lead frame. CONSTITUTION: The heat resistant adhesive tape comprises a heat resistant film(10); an adhesive layer(20) which comprises an acrylonitrile butadiene rubber containing a carboxyl group and a phenol novolac resin and is coated on at least one surface of the heat resistant film; and optionally a release film(30) laminated on the surface of the adhesive layer. Preferably the content of the phenol novolac resin is 50-300 parts by weight based on 100 parts by weight of the acrylonitrile butadiene rubber. Preferably the adhesive layer comprises further 3-20 parts by weight of a vulcanizing agent, and/or 5-200 parts by weight of an organic particle and an inorganic particle with a diameter of 0.1-10 micrometers based on 100 parts by weight of the acrylonitrile butadiene rubber.

Abstract translation: 目的：提供用于电子部件的耐热粘合带，以提高用于固定引线框架的胶带的粘合强度，耐热性，可加工性和老化稳定性。 构成：耐热胶带包括耐热膜（10）; 粘合剂层（20），其包含含有羧基的丙烯腈丁二烯橡胶和苯酚酚醛清漆树脂，并且涂布在所述耐热膜的至少一个表面上; 和任选的层压在粘合剂层的表面上的脱模膜（30）。 基于100重量份的丙烯腈丁二烯橡胶，苯酚酚醛清漆树脂的含量优选为50-300重量份。 优选地，粘合剂层还包含3-20重量份的硫化剂和/或5-200重量份的有机颗粒和直径为0.1-10微米的无机颗粒，基于100重量份的 丙烯腈丁二烯橡胶。

公开(公告)号：KR1020170093006A

公开(公告)日：2017-08-14

申请号：KR1020160014418

申请日：2016-02-04

Applicant: 도레이첨단소재 주식회사

Inventor： 배연웅 ,  김우석 ,  조재필 ,  박수형

IPC: C08J5/24 ,  C08L63/00 ,  B29C70/50 ,  B29C63/04 ,  B29D22/00 ,  F16J12/00 ,  F17C1/16

Abstract: 본발명은에폭시수지조성물의점도가낮아토우프레그제조시 용매를사용할필요가없어압력용기혹은섬유강화복합재료제조시 강도발현율이뛰어나고, 신율과유리전이온도가동시에우수하여특히압축수소가스압력용기에적용가능한저점도액상에폭시수지조성물이적용된토우프레그또는토우프리프레그와이를사용하여제조되는강도발현율및 내압특성이우수한압력용기의제조방법에관한것이다

Abstract translation: 本发明消除了对溶剂的制造的需要，环氧树脂组合物低的粘度，脚趾压压力容器或纤维增强的具有优异的强度表达，断裂伸长率和玻璃化转变温度的制造复合材料优异，同时，特别是压缩氢气压力容器 在适用本发明的低粘度液态环氧树脂组合物的半固化片或丝束预浸料以及制造强度发展速率和耐压特性优异的压力容器的方法中，