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公开(公告)号：KR1020140030889A
公开(公告)日：2014-03-12
申请号：KR1020120097616
申请日：2012-09-04
Applicant: 삼성전기주식회사
IPC: H01L23/28
CPC classification number: H01L23/562 , H01L21/56 , H01L21/565 , H01L23/3121 , H01L2224/48227 , H01L2924/3511
Abstract: The present invention relates to a semiconductor chip package and a method of manufacturing the same. The method of manufacturing a semiconductor chip package includes: mounting a semiconductor chip on a top surface of a PCB, inserting a reinforcing member for preventing bending into an inner ceiling of a mold manufactured to package the PCB mounted on the semiconductor chip; coupling the mold having the ceiling in which the reinforcing member for preventing bending is inserted with a top surface of the PCB on which the semiconductor chip is mounted to surround the PCB; injection-molding a molding material inside the mold and heating and curing the molding material; and manufacturing the semiconductor chip package by removing the mold after curing the molding material. According to the present invention, the reinforcing member for preventing bending is integrally solidified with the molding material by injection-molding the molding material inside the mold to mold the semiconductor chip in a state that the reinforcing member is inserted into the mold, thereby preventing the bending of a package due to the difference in thermal expansion coefficient among the PCB, the semiconductor chip, and the molding material during a curing procedure. [Reference numerals] (AA) Start; (BB) End; (S301) Mount semiconductor chip on top surface of PCB; (S302) Insert anti-bending reinforcing member into inner ceiling of mold manufactured to package PCB on which semiconductor chip is mounted; (S303) Couple mold having ceiling in which anti-bending reinforcing member is inserted with top surface of PCB on which semiconductor chip is mounted to surround PCB; (S304) Injection-mold molding material inside mold and heating and curing molding material; (S305) Manufacture semiconductor chip package by removing mold after curing molding material
Abstract translation: 半导体芯片封装及其制造方法技术领域本发明涉及半导体芯片封装及其制造方法。 制造半导体芯片封装的方法包括：将半导体芯片安装在PCB的顶表面上，将用于防止弯曲的加强构件插入制造成封装安装在半导体芯片上的PCB的模具的内部顶板中; 将具有用于防止弯曲的加强构件的天花板的模具与其上安装有半导体芯片的PCB的顶表面连接在一起以围绕PCB; 在模具内部注塑成型材料并加热和固化成型材料; 并且在固化成型材料之后通过移除模具来制造半导体芯片封装。 根据本发明，用于防止弯曲的加强件通过在模具内部注塑成型模具来模制半导体芯片，使其与模塑材料整体固化，从而在加强件插入模具的状态下防止弯曲 在固化过程中由于PCB，半导体芯片和成型材料之间的热膨胀系数的差异导致的封装弯曲。 （附图标记）（AA）开始; （BB）结束; （S301）将半导体芯片安装在PCB的顶面上; （S302）将防弯曲加强构件插入制造成封装了安装了半导体芯片的PCB的模具的内部天花板中; （S303）具有顶部的模具，其中抗弯曲加强构件插入其上安装有半导体芯片的PCB的顶表面围绕PCB; （S304）模具内注塑成型材料及加热固化成型材料; （S305）通过在固化成型材料后去除模具制造半导体芯片封装
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公开(公告)号：KR101339549B1
公开(公告)日：2013-12-31
申请号：KR1020110084113
申请日：2011-08-23
Applicant: 삼성전기주식회사
CPC classification number: H01L51/5215 , H01L29/1606 , H01L51/529
Abstract: 본 발명은 유기 발광 다이오드 및 이의 제조방법에 관한 것으로, 본 발명은 기판상에 형성된 양극; 상기 양극 상에 형성되며, 그래핀(Graphene)을 포함하는 박막층; 상기 박막층 상에 형성된 발광 고분자층; 및 상기 발광 고분자층 상에 형성된 음극;을 포함하는 유기 발광 다이오드 및 이의 제조방법을 제공한다. 본 발명에 따른 유기 발광 다이오드는 소자에서 발생하는 열을 효과적으로 방출하고, 소자의 안정성을 높이고 수명을 연장하는 효과가 있다.
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公开(公告)号：KR1020130141926A
公开(公告)日：2013-12-27
申请号：KR1020120065049
申请日：2012-06-18
Applicant: 삼성전기주식회사
CPC classification number: B23K3/0623
Abstract: According to an embodiment of the present invention, to achieve the appearance of a solder paste droplet ejection apparatus includes a nozzle cap comprising an electrothermal wire for heating, a nozzle part surrounded to be separated by the nozzle gap, an injection probe surrounded to be separated by the nozzle part, and a transfer part for minute movement formed on the upper part of the nozzle cap. Solder paste supplied between the nozzle and the ejection probe is ejected with droplets along the ejection probe.
Abstract translation: 根据本发明的实施例，为了实现焊膏的外观，液滴喷射装置包括：喷嘴盖，其包括用于加热的电热丝，被喷嘴间隙包围的喷嘴部分，被包围以分离的喷射探针 并且在喷嘴盖的上部形成有微小移动用的转印部。 在喷嘴和喷射探针之间提供的焊膏以喷射探针的液滴喷射。
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公开(公告)号：KR101320173B1
公开(公告)日：2013-10-22
申请号：KR1020110044393
申请日：2011-05-12
Applicant: 삼성전기주식회사
CPC classification number: H01L51/5253 , H01L51/5215
Abstract: 본 발명은 기판상에 형성된 양극; 나노 클레이 및 그래파이트 옥사이드(graphite oxide) 중 적어도 하나를 함유하는 무기재료층이 1층 이상 적층된 보호층; 상기 보호층 상에 형성된 발광 고분자층; 및 상기 발광 고분자층 상에 형성된 음극;을 포함하는 유기 발광 다이오드 및 이의 제조방법을 제공한다. 본 발명에 따른 유기 발광 다이오드는 정공의 주입 농도를 조절하고, 소자의 안정성을 높이고 수명을 연장하는 효과가 있다.
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公开(公告)号：KR1020130107081A
公开(公告)日：2013-10-01
申请号：KR1020120028893
申请日：2012-03-21
Applicant: 삼성전기주식회사
IPC: H01L21/027
CPC classification number: B23K3/0623 , H05K3/1241 , H05K3/3484 , H05K2201/0257 , H01L21/0273 , B82B3/0004 , B82B3/0019
Abstract: PURPOSE: A nanopatterning apparatus, a nanopatterning system having the same, and a control method thereof are provided to mass-produce nanopatterns by forming a series of the nanopatterns. CONSTITUTION: A holder part comprises a transport part and an insulation part. A tip part comprises a flow path. A flow pipe (230) forms a channel for transporting a nanopatterning material. A presser part (240) pressurizes the nanopatterning material. A storage (250) stores the nanopatterning material. [Reference numerals] (240) Presser part; (300) Control part
Abstract translation: 目的：提供一种纳米图案装置，具有该纳滤图形仪的纳米图案化系统及其控制方法，通过形成一系列纳米图案来大量生产纳米图案。 构成：支架部分包括运输部件和绝缘部件。 尖端部分包括流动路径。 流管（230）形成用于输送纳米图形材料的通道。 压紧部分（240）对纳米图形材料加压。 存储（250）存储纳米图案材料。 （附图标记）（240）压脚部; （300）控制部分
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Patent Agency Ranking
公开(公告)号：KR1020130056627A
公开(公告)日：2013-05-30
申请号：KR1020110122340
申请日：2011-11-22
Applicant: 삼성전기주식회사
Abstract: PURPOSE: An electronic element inspecting apparatus is provided to rapidly and accurately detect the structurally defected position of an electronic element and to prevent damage to the defected position of the electronic element. CONSTITUTION: An electronic element inspecting apparatus(100) includes a fixed probe(115) and a moving prove(120). The fixed probe is electrically contacted to an external electrode of a stacked electronic element. The moving probe is electrically contacted to an internal electrode of the stacked electronic element. [Reference numerals] (AA) Measuring part; (BB) Power source part; (CC) Control part
Abstract translation: 目的：提供电子元件检查装置，用于快速且准确地检测电子元件的结构缺陷位置，并防止损坏电子元件的缺陷位置。 构成：电子元件检查装置（100）包括固定探针（115）和移动证明（120）。 固定探针与堆叠的电子元件的外部电极电接触。 移动探针与堆叠的电子元件的内部电极电接触。 （附图标记）（AA）测量部件; （BB）电源部分; （CC）控制部分
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公开(公告)号：KR1020130021694A
公开(公告)日：2013-03-06
申请号：KR1020110084113
申请日：2011-08-23
Applicant: 삼성전기주식회사
CPC classification number: H01L51/5215 , H01L29/1606 , H01L51/529 , H01L51/0034 , H01L51/0037 , H01L51/5088
Abstract: PURPOSE: An organic light emitting diode and a manufacturing method thereof are provided to efficiently discharge heat from a device by forming a graphene multilayer structure with a thickness of a nanometer scale on a hole injection layer. CONSTITUTION: An anode(2) is formed on a substrate(1). A thin film layer(12) including a graphene is formed on the anode. A light emitting polymer layer(4) is formed on the thin film layer. A cathode(6) is formed on the light emitting polymer layer. A hole injection layer(3) is formed between the anode and the thin film layer including the graphene.
Abstract translation: 目的：提供一种有机发光二极管及其制造方法，通过在空穴注入层上形成厚度为纳米级的石墨烯多层结构，有效地从器件排出热量。 构成：在基板（1）上形成阳极（2）。 在阳极上形成包括石墨烯的薄膜层（12）。 在薄膜层上形成发光聚合物层（4）。 在发光聚合物层上形成阴极（6）。 在阳极和包括石墨烯的薄膜层之间形成空穴注入层（3）。
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公开(公告)号：KR1020120081419A
公开(公告)日：2012-07-19
申请号：KR1020110002753
申请日：2011-01-11
Applicant: 삼성전기주식회사
CPC classification number: G01B9/02044 , G01B9/0203 , G01B9/0209 , G01B9/02091 , G01B11/0675 , G01N21/45 , G01N21/8422 , G01N2021/8438
Abstract: PURPOSE: A device and a method for measuring a multi-layered thin film are provided to enhance the performance for measuring properties of a multi-layered thin film in non-destructive method by supplying interferential signals or reflection signals according to an opening/closing of an optical shutter. CONSTITUTION: A device(10) for measuring a multi-layered thin film comprises a light source(100), an interference-reflection unit(200), a sample unit(300), an interference-reflection light detecting unit(400), and a signal processing unit(600). The light source irradiates lights of a sample consisting of a multi-layered thin film. The interference-reflection unit generates interferential signals due to an overlap of reference reflected light reflected in a first beam and sample reflected lights reflected in a second beam when an optical shutter(230) is opened. The interference-reflection unit generates reflection signals due to sample reflected lights reflected in the second beam when the optical shutter is closed. The interference-reflection light detecting unit detects the intensity of the generated interferential signals and reflection signals by dispersing the lights per each wavelength. The signal processing unit controls opening/closing of the optical shutter and transferring of a support stand.
Abstract translation: 目的：提供一种用于测量多层薄膜的装置和方法，以通过提供干涉信号或反射信号来提高用于以非破坏性方法测量多层薄膜的性能的性能，所述干涉信号或反射信号根据 光学快门。 构成：用于测量多层薄膜的装置（10）包括光源（100），干涉反射单元（200），采样单元（300），干涉反射光检测单元（400） 和信号处理单元（600）。 光源照射由多层薄膜组成的样品的光。 当光闸（230）打开时，干涉反射单元由于在第一光束中反射的参考反射光和在第二光束中反射的采样反射光的重叠而产生干涉信号。 当光学快门关闭时，干涉反射单元产生由于在第二光束中反射的样品反射光引起的反射信号。 干涉反射光检测单元通过分散每个波长的光来检测产生的干涉信号和反射信号的强度。 信号处理单元控制光学快门的打开/关闭和支撑台的传送。
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公开(公告)号：KR1020120071148A
公开(公告)日：2012-07-02
申请号：KR1020100132764
申请日：2010-12-22
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A movable component collecting and analyzing device is provided to collect micro-component existing in the inside of a via hole and a surface of a specimen, thereby analyzing the micro-component. CONSTITUTION: A movable component collecting and analyzing device comprises a collecting unit(100), a dichroic object lens(200), a laser light source unit(300), a camera unit(400), and a controlling unit(600). The collecting unit isolate a specimen and collects the vaporized specimen. The dichroic object lens is installed in the collecting unit to be inclined and rotated and irradiates laser beams on an observation spot. The laser source unit is connected to the dichroic object lens and generates laser beam required for evaporation of the specimen. The camera unit is connected to the dichroic object lens and obtains optical images with respect to the observation spot of the specimen. The controlling unit controls operation of the collecting unit, the laser source unit, and the camera unit, thereby irradiating laser beams and controlling a position and an angle of the laser beams and observing the specimen.
Abstract translation: 目的：提供可移动部件收集和分析装置，以收集存在于通孔和样本表面内部的微组件，从而分析微组件。 构成：可动部件收集和分析装置包括收集单元（100），二向色物镜（200），激光光源单元（300），相机单元（400）和控制单元（600）。 收集单元分离样品并收集蒸发的样品。 二向色物镜安装在收集单元中以倾斜和旋转，并在观察点上照射激光束。 激光源单元连接到二向色物镜并产生用于样品蒸发所需的激光束。 相机单元连接到二向色物镜并获得关于样本的观察点的光学图像。 控制单元控制收集单元，激光源单元和相机单元的操作，从而照射激光束并控制激光束的位置和角度并观察样本。
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公开(公告)号：KR1020120012642A
公开(公告)日：2012-02-10
申请号：KR1020100074730
申请日：2010-08-02
Applicant: 삼성전기주식회사
CPC classification number: C07F7/0854 , B82Y20/00 , C07B2200/11 , C08G77/04 , H01L33/501 , H01L33/502 , H01L2224/48091 , H01L2924/00014
Abstract: PURPOSE: A nano-composite and a light emitting element package including the same are provided to improve the affinity to various matrices of the nano-composite and to stabilize nano-particles by including nano-particles and a silicon compound. CONSTITUTION: A nano-composite includes nano-particles and a silicon compound. The silicon compound is bonded to the surface of the nano-particles and is represented by chemical formula 1. In chemical formula 1, the R1, the R2, the R3, the R6, the R7, the R8, and the R9 are respectively methyl group or hydrogen; the R4 and the R5 are respectively aromatic hydrocarbon; the R6 is hydrogen, methyl group, or phenyl group; the Fn is NH_2, SH, COOH, CO(S)H, PPR3, or P(O)PR3; the x and the y are the integer of 1 to 100; and n is the integer of 1 to 100. The molecular weight of the silicon compound is in a range between 200 and 50,000. The nano-particles are one or more selected from silica, carbon black, metal powder, metal oxide, and quantum dots. The light emitting element package includes a light emitting diode element mounted on a substrate and a molding member covering the light emitting diode element and is dispersed with the nano-composite.
Abstract translation: 目的：提供纳米复合材料和包含其的发光元件封装，以提高对纳米复合材料的各种基体的亲和性，并通过纳入纳米颗粒和硅化合物来稳定纳米颗粒。 构成：纳米复合材料包括纳米颗粒和硅化合物。 硅化合物与纳米颗粒的表面结合并由化学式1表示。在化学式1中，R 1，R 2，R 3，R 6，R 7，R 8和R 9分别为甲基 基团或氢; R4和R5分别是芳烃; R6是氢，甲基或苯基; Fn是NH_2，SH，COOH，CO（S）H，PPR3或P（O）PR3; x和y是1到100的整数; n为1〜100的整数。硅化合物的分子量在200〜50,000的范围内。 纳米颗粒是选自二氧化硅，炭黑，金属粉末，金属氧化物和量子点中的一种或多种。 发光元件封装包括安装在基板上的发光二极管元件和覆盖发光二极管元件并与纳米复合材料分散的成型构件。
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