Abstract:
본 발명에 따른 표시 장치용 표시판의 제조 방법은 플라스틱 기판의 외면에 기판 지지대를 접착하는 단계, 플라스틱 기판 내면 위에 복수개의 박막층을 형성하는 단계, 플라스틱 기판으로부터 기판 지지대를 분리하는 단계를 포함하고, 플라스틱 기판과 기판 지지대는 2-에틸헥사아크릴레이트 단량체를 라디칼 중합시켜 제조되는 중합체를 함유하고, 소정 온도 이상의 고온에서 접착력을 잃는 단일 접착제를 사용하여 접착하며, 플라스틱 기판으로부터 기판 지지대를 분리하는 단계는 소정 온도 이상의 온도에서 일정 시간 동안 열 공정을 진행하여 분리한다.
Abstract:
PURPOSE: A forming method of molybdenum thin film patterns is provided to etch a formed molybdenum thin film to make molybdenum thin film patterns, and to cleanly fabricate the molybdenun thin film patterns without residuals, stains or step differences, thereby improving the quality of a substrate. CONSTITUTION: Gate lines consisting of the first gate line layers(221,241) and the second gate line layers(222,242) are formed on an insulating substrate(10). The gate lines include gate lines(22), gate line ends(24), and gate electrodes. Maintenance electrode lines(28) are formed on the insulating substrate(10) in parallel with the gate lines(22). The maintenance electrode lines(28) consist of the first gate line layer(281) and the second gate line layer(282). Data line layers(62,64,68) made of molybdenum-tungsten alloy films are formed on resistive contact layer patterns(55).
Abstract:
PURPOSE: A sample and a method for testing detergency are provided to reduce the time for developing a detergent and to accurately check the properties of a detergent by varying the elements contained in the detergent during a test. CONSTITUTION: A detergency testing sample(100) comprises a substrate(10), a gate electrode(20) formed on the substrate and made of a mono silicon doped with metal or ion, a gate insulating film(30) formed on the gate electrode and made of SiO2, a channel layer(40) formed on the upper face of the gate electrode and made of amorphous silicon or poly silicon, a source electrode(50) placed on the upper face of the channel layer and made of mercury, and a drain electrode(60) placed on the upper face of the channel layer and made of mercury.
Abstract:
PURPOSE: An etchant composition for a liquid crystal display device and a liquid crystal display device prepared by using the composition are provided, to prevent the photoresist attack in etching by controlling the content of nitric acid and acetic acid for obtaining a desired pattern and to allow a Mo/Al-alloy dual layer, a pure Mo single layer and a Mo/Al-alloy/Mo triple layer to be etched at a time. CONSTITUTION: The etchant composition comprises 50-70 wt% of phosphoric acid; 6-7 wt% of nitric acid; 10-16 wt% of acetic acid; and the balance of deionized water. The liquid crystal display device contains the pattern which is etched by using the etchant composition. Optionally the composition comprises further a surfactant.
Abstract:
PURPOSE: A thin film transistor and its fabrication method are provided to form an interconnection line having low resistance. CONSTITUTION: The thin film transistor comprises an insulation substrate, and a gate line(121) which is formed on the insulation substrate to transfer a scanning signal. And a data line is formed to cross with the gate line and transfers an image signal. At least one of the gate line or the data line is formed with a tri-layer where the first molybdenum layer and an aluminum neodymium layer and the second molybdenum layer are stacked in sequence.
Abstract:
PURPOSE: A method for forming a molybdenum-tungsten thin film pattern and a method for manufacturing a TFT(Thin Film Transistor) substrate of an LCD(Liquid Crystal Display) using the same are provided to be capable of supplying optimum condition capable of forming an easily etched molybdenum-tungsten thin film. CONSTITUTION: A sputtering process is carried out for forming a molybdenum-tungsten thin film from the room temperature to 80 °C. At this time, the sputtering process is carried out with a speed of 0.010-0.015 angstrom/Ws. Then, an etching process is carried out at the molybdenum-tungsten thin film for selectively patterning the molybdenum-tungsten thin film. Preferably, the target size of the sputtering process is in the range of 144 ±10 x 660 ±10(mm x mm).
Abstract:
PURPOSE: A method for forming a molybdenum-tungsten thin film and a method for manufacturing thin film transistors of a liquid crystal display using the same are provided to realize a molybdenum-tungsten thin film having high density, large grain size, and low resistance. CONSTITUTION: A first gate wiring layer is formed on a substrate, and MoW is sputtered in a range of 100 to 150 deg. to form a second gate wiring layer. The first gate wiring layer and the second gate wiring layer are etched to form gate patterns including gate lines, gate pads, and gate electrodes. A gate insulating film is deposited on the gate patterns. Semiconductor and resistant contact patterns are formed. MoW is sputtered in a range of 100 to 150 deg. and is patterned to form data wiring. A passivation film is formed and patterned with the gate insulating film for forming contact holes exposing the gate pads, data pads, and drain electrodes. A transparent conductive film is accumulated and etched to form auxiliary gate pads, auxiliary data pads, and pixel electrodes.
Abstract:
PURPOSE: A method for manufacturing a TFT(Thin Film Transistor) substrate is provided to be capable of preventing the generation of residuals by additionally carrying out a wet cleaning process using a cleaning solution containing nitric acid. CONSTITUTION: A gate line(22) and a gate wiring including a gate electrode(26) are formed on an insulating substrate(10). A gate insulating layer(30) is formed on the resultant structure. A semiconductor layer(40) is formed on the gate insulating layer of the gate electrode. A resistive contact layer is formed on the upper portion of the semiconductor layer. The first conductive layer(601) made of chrome and an upper layer(602) are sequentially formed on the resultant structure. A data line, a source electrode(65) and a data wiring including a drain electrode(66) are formed by etching the first conductive layer and the upper layer using an etchant mixed with Ce(NH4)2(NO3)6 of 8-12 %, NH3 of 4-12 %, and deionized water. Preferably, an additional wet cleaning process is carried out using an etchant containing nitric acid of 4-8 % and deionized water after forming the data wiring.