公开(公告)号：KR100686318B1

公开(公告)日：2007-02-26

申请号：KR1020050096395

申请日：2005-10-13

Applicant: 성균관대학교산학협력단

Inventor： 한전건 ,  명현식

IPC: B05C1/08 ,  B82Y30/00

Abstract: An apparatus for coating a nanostructure of conductive carbon is provided to produce a coating in which the hardness and the electrical resistivity are controlled to a predetermined value and the residual stress is reduced more than 50%. The apparatus for coating a nanostructure of conductive carbon includes a vacuum chamber(110), a material to be coated, a power supply(190), a first and second magnetron source(160,170) equipped with a first and second target(140,150) which contains a target material for synthesizing a conductive nano-structural carbon layer on the material to be coated, respectively and a power control part(200). The power control part(200) controls the power supply(190) to supply the first and second target(140,150) with direct current bias voltage(-) so that the target material can be sputtered. The sputtered target material is synthesized on the material to be coated which is rotated by the rotatable zig(180) to form a conductive nano-structural carbon layer.

Abstract translation: 提供一种用于涂覆导电碳的纳米结构的设备以产生其中硬度和电阻率被控制到预定值并且残余应力被降低超过50％的涂层。 用于涂覆导电碳纳米结构的设备包括真空室（110），待涂覆材料，电源（190），配备有第一和第二靶（140,150）的第一和第二磁控管源（160,170），其中 包含分别在待涂覆材料上合成导电纳米结构碳层的目标材料和功率控制部件（200）。 功率控制部分（200）控制电源（190）向第一和第二目标（140,150）供应直流偏压（ - ），使得目标材料能够被溅射。 溅射靶材合成在被旋转Zig（180）旋转的待涂覆材料上以形成导电纳米结构碳层。

公开(公告)号：KR100675600B1

公开(公告)日：2007-01-30

申请号：KR1020050096251

申请日：2005-10-12

Applicant: 성균관대학교산학협력단

Inventor： 한전건 ,  정윤모 ,  정우성

IPC: H05K3/16

Abstract: A method for manufacturing flexible printed circuit boards is provided to improve an adhesion property between a polyimide film and a metal thin film by using a magnetron sputtering method. A method for manufacturing flexible printed circuit boards includes the steps of: forming a cross-linking layer(110) by ions having high energy, wherein argon ions with high energy and metal ions from a target are collided and impinged into a surface of a polyimide film by a magnetron sputtering device; forming a copper thin film(120) by the metal ions and the sputtered metal neutron particles impinged into the cross-linking layer(110) formed at the above step; and depositing a copper thick layer(130) on the copper thin film(120) formed at the above step by using a sputtering method.

Abstract translation: 提供一种制造柔性印刷电路板的方法，以通过使用磁控溅射方法来提高聚酰亚胺膜和金属薄膜之间的粘附性能。 一种制造柔性印刷电路板的方法包括以下步骤：通过具有高能量的离子形成交联层（110），其中具有高能量的氩离子和来自靶的金属离子相撞并撞击到聚酰亚胺的表面 通过磁控溅射装置进行薄膜; 通过金属离子和溅射的金属中子粒子撞击在上述步骤中形成的交联层（110）形成铜薄膜（120） 以及通过使用溅射方法在上述步骤中形成的铜薄膜（120）上沉积铜厚层（130）。