公开(公告)号：KR100885793B1

公开(公告)日：2009-02-26

申请号：KR1020060136216

申请日：2006-12-28

Applicant: 제일모직주식회사

Inventor： 김준숙 ,  황용하 ,  하경진 ,  조재현 ,  서만석 ,  송규석 ,  기희연 ,  정창범

IPC: C09J133/10 ,  C09J133/08 ,  C09J133/06

Abstract: 본 발명은 조성물의 성분이 비닐기를 함유한 아크릴계 점착수지 조성물, 이를 포함하는 광경화형 점착조성물 및 이를 포함하는 점착테이프에 관한 것으로, 본 발명에 의한 광경화형 점착조성물은 우수한 박리력을 갖는 아크릴계 점착수지 조성물을 포함하고 있어, 초기 점착력이 우수하고, 낮은 자외선 에너지에서도 광경화 후 우수한 박리성을 가짐으로써, 낮은 박리력이 요구되는 다이싱용 또는 다이싱 다이본딩용 점착 테이프에 유용하게 사용할 수 있다.
아크릴계 점착수지, 아크릴산, 메타크릴레이트, 부가중합, 광경화형 점착조성물, 점착 테이프

公开(公告)号：KR1020080061198A

公开(公告)日：2008-07-02

申请号：KR1020060136222

申请日：2006-12-28

Applicant: 제일모직주식회사

Inventor： 하경진 ,  황용하 ,  김준숙 ,  조재현 ,  송규석

IPC: C09J175/06 ,  C09J7/02 ,  C09J7/00

CPC classification number: C09J167/00 ,  C09J7/38 ,  C09J167/02

Abstract: An unsaturated polyester adhesive resin is provided to realize excellent adhesion to a substrate film, excellent peel force and low tackiness after photocuring, and to obtain an adhesive tape useful for dicing or dicing die bonding. An unsaturated polyester adhesive resin comprises an unsaturated acid, a saturated acid and glycol, and has a vinyl group-containing binder portion. The unsaturated acid is used in an amount of 5-50 mol% based on the combined molar weight of the unsaturated acid and saturated acid. The adhesive resin preferably comprises 2-22 wt% of the unsaturated acid, 32-55 wt% of the saturated acid and 42-57 wt% of glycol. The adhesive resin has a weight average molecular weight of 100,000-400,000.

Abstract translation: 提供了一种不饱和聚酯粘合树脂，以实现对基底膜的优异的粘附性，优异的剥离力和光固化后的低粘合性，并且获得用于切割或切割模片接合的粘合带。 不饱和聚酯粘合剂树脂包含不饱和酸，饱和酸和二醇，并且具有含乙烯基的粘合剂部分。 基于不饱和酸和饱和酸的组合摩尔浓度，不饱和酸的用量为5-50mol％。 粘合树脂优选包含2-22重量％的不饱和酸，32-55重量％的饱和酸和42-57重量％的二醇。 粘合树脂的重均分子量为100,000-400,000。

公开(公告)号：KR100815383B1

公开(公告)日：2008-03-20

申请号：KR1020060136203

申请日：2006-12-28

Applicant: 제일모직주식회사

Inventor： 조재현 ,  황용하 ,  송규석 ,  김준숙 ,  기희연 ,  정창범

IPC: C08L101/00 ,  C08J5/18 ,  C08F290/06

CPC classification number: H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/83191 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0665 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A photocurable composition for forming an adhesive film is provided to realize excellent pick-up property by virtue of a sufficient drop in the adhesion after UV curing, and to facilitate die bonding on a PCB or lead frame by fixing chips during dicing and easily removing the chips during pick-up. A photocurable composition for forming an adhesive film comprises: (A) 100 parts by weight of a polymer binder resin; 20-150 parts by weight of a UV-curable urethane acrylate oligomer; (C) 5-50 parts by weight of a UV-curable acrylate present in a solid phase at room temperature; (D) 0.1-10 parts by weight of a heat curing agent; and (E) 0.1-5 parts by weight of a photopolymerization initiator based on 100 parts by weight of the UV curable acrylates (B)+(C). The binder polymer resin is at least one resin selected from acrylic, polyester, urethane, silicone and natural rubber resins.

Abstract translation: 提供了一种用于形成粘合剂膜的可光固化组合物，以便通过UV固化后的粘附力充分降低来实现优异的拾取性能，并且通过在切割期间固定芯片便于PCB或引线框架上的裸片接合，并且容易地除去 拾取期间的芯片。 用于形成粘合剂膜的光固化组合物包括：（A）100重量份的聚合物粘合剂树脂; 20-150重量份的可UV固化的氨基甲酸酯丙烯酸酯低聚物; （C）5-50重量份在室温下固相中存在的可UV固化的丙烯酸酯; （D）0.1-10重量份的热固化剂; 和（E）基于100重量份的UV固化丙烯酸酯（B）+（C），0.1-5重量份的光聚合引发剂。 粘合剂聚合物树脂是选自丙烯酸，聚酯，聚氨酯，硅酮和天然橡胶树脂中的至少一种树脂。