公开(公告)号：EP2368262A1

公开(公告)日：2011-09-28

申请号：EP09797035.4

申请日：2009-12-18

Applicant: 3D Plus

Inventor： VAL, Christian ,  COUDERC, Pascal ,  VAL, Alexandre

IPC: H01L21/68 ,  H01L21/60

CPC classification number: H01L21/6835 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/96 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/13139 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/141 ,  H05K1/185 ,  H05K3/321 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/0401

Abstract: The invention relates to a method for the collective production of CMS electronic modules from a wafer (2') with metallised outputs having electronic components (22, 23, 24) moulded in the resin (28) and, on one surface, the outer outputs (26) of the electronic components on which a non-oxidisable metal or alloy (21) is deposited and a printed circuit (1) provided with pads (11) of a non-oxidisable metal or alloy. The method comprises the following steps: cutting the wafer (2') according to predetermined patterns for obtaining reconfigured moulded components (30) including at least one electronic component, assembling the reconfigured components (30) on the printed circuit (1), the metallised outer outputs of the reconfigured components being arranged opposite the metallised pads (11) of the printed circuit, and connecting, without any brazing additives, said outer outputs to the metallised pads of the printed circuit using a material (10) containing an electrically conductive ink or glue.

Abstract translation: 用于CMS电子模块的晶片级制造的工艺从具有金属化输出的晶片开始，包括以树脂模制的电子部件，以及在一侧上沉积有不可氧化的金属或合金的电子部件的外部输出，以及 设置有可氧化金属或合金接触垫的印刷电路。 在该过程中，以预定图案切割晶片以获得包括至少一个电子部件的重新配置的模制部件; 重新组装的组件被组装在印刷电路上，重新配置的组件的金属化外部输出端与印刷电路的金属化接触焊盘相对放置; 并且这些外部输出通过基于导电粘合剂或墨水的材料无焊地连接到印刷电路的金属化接触焊盘。

公开(公告)号：EP1792526B1

公开(公告)日：2009-07-15

申请号：EP05782605.9

申请日：2005-09-07

Applicant: 3D Plus

Inventor： VAL, Christian ,  LIGNIER, Olivier ,  BOCAGE, Régis

IPC: H05K1/02 ,  H05K3/34 ,  H05K3/44 ,  H05K7/20 ,  H01L23/498 ,  H01L23/34

CPC classification number: H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0201 ,  H05K1/111 ,  H05K1/112 ,  H05K3/4641 ,  H05K2201/09718 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2203/165 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to an electronic device provided with a heat spreader, in particular to plastic box-like devices comprising one or several stages of components. The inventive electronic device, for example a box-like, is provided with external connection pads (11) which are distributed on a connecting surface (22), comprises a heat-conductive plate (23) which is disposed in a parallel position with respect to said connecting surface and whose non-uniform structure, when the device is exposed to a given external temperature, makes it possible to carry out a controlled heat supply to each external connection pad according to the position thereof on the connecting surface. When the device is embodied in the form of a box comprising a support (20) in the form of a printed circuit, the conductive plate advantageously forms the internal layer thereof.

公开(公告)号：EP1955374A1

公开(公告)日：2008-08-13

申请号：EP06830256.1

申请日：2006-11-30

Applicant: 3D Plus

Inventor： VAL, Christian ,  LIGNIER, Olivier

IPC: H01L23/538

CPC classification number: H05K1/144 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/19041 ,  H01L2924/3512 ,  H05K1/185

Abstract: The subject of the invention is a 3D electronic module comprising a stack (100) of at least a first slice (10) and a second slice (30), the first slice (10) having on a face (101) at least one set (4) of electrically conducting bumps (41), and the second slice (30) comprising at least one zone (61) of electrically insulating material, passing through the thickness of the slice. The second slice (30) comprises at least one electrically conducting element (3) passing through the said slice in a zone (61) of electrically insulating material, capable of receiving a set (4) of bumps (41) of the first slice (10).

Abstract translation: 该模块具有两个片（10,30）的堆叠（100），其中片（10）在其表面上具有一组导电凸起。 切片（30）包括通过切片（30）的厚度的电绝缘材料区（61）和穿过该区中的切片（30）的导电元件（3）。 导电元件和凸块由具有确定的硬度的材料制成。 元件（3）的材料的硬度低于凸起材料的硬度，使得凸块穿透导电元件。

公开(公告)号：EP1792526A1

公开(公告)日：2007-06-06

申请号：EP05782605.9

申请日：2005-09-07

Applicant: 3D Plus

Inventor： VAL, Christian ,  LIGNIER, Olivier ,  BOCAGE, Régis

IPC: H05K1/02 ,  H05K3/34 ,  H05K3/44 ,  H05K7/20 ,  H01L23/498 ,  H01L23/34

CPC classification number: H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0201 ,  H05K1/111 ,  H05K1/112 ,  H05K3/4641 ,  H05K2201/09718 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2203/165 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to an electronic device provided with a heat spreader, in particular to plastic box-like devices comprising one or several stages of components. The inventive electronic device, for example a box-like, is provided with external connection pads (11) which are distributed on a connecting surface (22), comprises a heat-conductive plate (23) which is disposed in a parallel position with respect to said connecting surface and whose non-uniform structure, when the device is exposed to a given external temperature, makes it possible to carry out a controlled heat supply to each external connection pad according to the position thereof on the connecting surface. When the device is embodied in the form of a box comprising a support (20) in the form of a printed circuit, the conductive plate advantageously forms the internal layer thereof.