Abstract:
An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.
Abstract:
Multi-layer optical film (10) comprising optical layers reflecting at least 50 percent of incident UV light over specified wavelength ranges. Embodiments of the multi -layer optical films are useful, for example, as a UV protective covering.
Abstract:
Generally, the present disclosure relates to barrier assemblies that have a reduced transmission of water vapor, and processes for making the barrier assemblies. The barrier assemblies include a substrate and an inorganic layer disposed adjacent the substrate. The inorganic layer has a composition that changes throughout the thickness of the inorganic layer. The composition includes at least a first and a second inorganic material, and the relative proportion of the first and second inorganic material in the composition changes throughout the thickness of the inorganic layer. A process for making the barrier assemblies includes dual AC sputtering of pairs of targets having different elemental compositions.
Abstract:
A process for fabricating an amorphous diamond-like film layer for protection of a moisture or oxygen sensitive electronic device is described. The process includes forming a plasma from silicone oil, depositing an amorphous diamond-like film layer from the plasma, and combining the amorphous diamond-like film layer with a moisture or oxygen sensitive electronic device to form a protected electronic device. Articles including the amorphous diamond-like film layer on an organic electronic device are also disclosed.
Abstract:
A method for forming a color shifting film on a supportand a color shifting film are disclosed, the film comprising a reflective stack disposed adjacent to the support and an image formed in the film such that it may be viewed or illuminated through the reflective stack. The reflective stack comprises an at least partially transparent spacer layer comprising a substituted acrylamide polymer disposed between a partially reflective first layer and a reflective second layer. The acrylamide layer has a thickness sufficient to produce an interference color.
Abstract:
A method for preparing a flexible film substrate with a low glass transition temperature can be used in the production of an article that retains dimensions and improves the surface smoothness after high temperature processing. The invention, for example, would enable low temperature films such as PET and PEN to be dimensionally stable and ultra flat at conditions commonly used in electronic processing which can typically exceed 200°C. More specifically, the methods enable the use of e.g. barrier films based on PET or PEN in OLED/PLED manufacturing.
Abstract:
The present disclosure relates to sterically hindered alkyl amine and sterically hindered oxyalkyl amine compounds, as well as particles, substrates, coatings, and articles including the same.
Abstract:
Urethane (multi)-(meth)acrylate (multi)-silane compositions, and articles including a (co)polymer reaction product of at least one urethane (multi)-(meth)acrylate (multi)-silane precursor compound. The disclosure also articles including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer; and a protective (co)polymer layer on the oxide layer, the protective (co)polymer layer including the reaction product of at least one urethane (multi) (meth)acrylate (multi)-silane precursor compound. The substrate may be a (co)polymeric film or an electronic device such as an organic light emitting device, electrophoretic light emitting device, liquid crystal display, thin film transistor, or combination thereof. Methods of making urethane (multi)-(meth)acrylate (multi)-silane precursor compounds and their use in composite multilayer barrier films are also described. Methods of using such barrier films in articles selected from a solid state lighting device, a display device, and combinations thereof, are also described
Abstract:
An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.