ANTISTATISCHE POLYOXYMETHYLENFORMMASSEN

    公开(公告)号:DE50101994D1

    公开(公告)日:2004-05-19

    申请号:DE50101994

    申请日:2001-06-22

    Applicant: BASF AG

    Abstract: The invention relates to thermoplastic molding compounds, comprising at least (A) 10 to 99.99 wt.-% of a polyoxymethylene homopolymer or copolymer, at least (B) 0.01 to 5 wt.-% of a polyethylenimine homopolymer or copolymer, at least (C) 0.1 to 15 wt.-% of a polyalkylene glycol or polyalkylene glycolamine or the mixtures thereof, (D) 0 to 70 wt.-% of further additives, whereby the sum of the weight percentages of components (A) to (D) always adds up to 100%.

    44.
    发明专利
    未知

    公开(公告)号:DE50101923D1

    公开(公告)日:2004-05-13

    申请号:DE50101923

    申请日:2001-06-22

    Applicant: BASF AG

    Inventor: DAMES BURKHARDT

    Abstract: Thermoplastic molding compositions comprising, as substantive components,A) from 5% by weight to (99.99% by weight minus 1 ppb), based on components A) to D), of a polyoxymethylene homo- or copolymer,B) from 1 ppb to 1% by weight, based on the molding composition made from A) to D), of at least one polyethyleneimine homo- or copolymer,C) from 0.01 to 15% by weight of carbon black, andD) from 0 to 80% by weight of other additives,where the total of percentages by weight of components A) to D) is always 100%.

    46.
    发明专利
    未知

    公开(公告)号:DE10030635A1

    公开(公告)日:2002-01-10

    申请号:DE10030635

    申请日:2000-06-29

    Applicant: BASF AG

    Inventor: DAMES BURKHARDT

    Abstract: The invention relates to thermoplastic moulding substances containing A) 5 to (99,99 wt. % minus 1 ppb), in relation to constituents A) to D), of a polyoxymethylene homopolymer or copolymer, B) 1 ppb to 1 wt. %, in relation to moulding materials A) to D), of at least one polyethylene imine homopolymer or copolymer, C) 0.01 to 15 wt. % carbon black, and D) 0 to 80 wt. % of further additives, as the essential constituents thereof. The sum of the weight percent of constituents A) to D) amounts to 100 % in every case.

    STABILIZED POLYOXYMETHYLENE MOULDING MATERIALS

    公开(公告)号:PL345265A1

    公开(公告)日:2001-12-03

    申请号:PL34526599

    申请日:1999-06-15

    Applicant: BASF AG

    Abstract: Thermoplastic polyoxymethylene molding materials containingA) from 10 to 99.98% by weight of a polyoxymethylene homo- or copolymerB) from 0.005 to 2% by weight of a sterically hindered phenolC) from 0.001 to 2% by weight of a polyamideD) from 0.002 to 2% by weight of an alkaline earth metal silicate or of an alkaline earth metal glycerophosphateE) from 0.01 to 5% by weight of at least one ester or amide of saturated or unsaturated aliphatic carboxylic acids of 10 to 40 carbon atoms with polyols or aliphatic saturated alcohols or amines of 2 to 40 carbon atoms or an ether which is derived from alcohols and ethylene oxideF) from 0 to 5% by weight of a melamine/formaldehyde condensateG) from 0 to 74% by weight of further additives, the sum of the percentages by weight of the components A) to G) being 100% in each case.

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