公开(公告)号：JP2015038996A

公开(公告)日：2015-02-26

申请号：JP2014183354

申请日：2014-09-09

Applicant: 株式会社大真空 ,  Daishinku Corp

Inventor： IIZUKA MINORU ,  KOJO YUKA

IPC: H01L23/12 ,  H01L23/04 ,  H03H9/02

CPC classification number: H05K5/0091 ,  H01L23/053 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/15162 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K3/3431 ,  H05K3/3442 ,  H05K5/0095 ,  H05K2201/09381 ,  H05K2201/10068 ,  H05K2201/10075 ,  Y02P70/613 ,  H01L2924/00

Abstract: 【課題】半田の耐久性を向上させて、パッケージの回路基板への電気的接続の遮断を抑えるパッケージのベース、およびパッケージを提供する。【解決手段】表面実装型の電子部品用パッケージのベース3は、電子部品素子を保持し、半田82を用いて回路基板81に実装するものであり、ベース3には、回路基板81に電気的に接続するための外部接続端子6が他主面32に形成されている。外部接続端子6上に、外部接続端子6よりも小さいバンプ7が形成されている。また、ベース3を回路基板81に実装した際に生じる外部接続端子6上の応力が減衰する応力減衰方向に沿った、外部接続端子6の外周端縁66から、バンプ7の外周端縁72までの距離を距離dとする。距離dは、0.06mm超0.45mm以下に設定される。また、最大ミーゼス応力は、5.00E+11Pa以下である。【選択図】図3

Abstract translation: 要解决的问题：提供一种封装的基座并提供封装，其通过提高焊料的耐久性来抑制封装与电路板的电连接的断开。解决方案：用于表面安装型的封装的基座3 电子部件是通过使用焊料82将电子元件保持在电路板81上的基座。基座3包括：外部连接端子6，其与形成在另一主面32上的电路基板81电连接 ; 以及形成在外部连接端子6上并小于外部连接端子6的凸块7.当假定从外部连接端子6的外周端66到凸块7的外周端72的距离沿着 将基座3安装在电路基板81上时的外部连接端子6的应力衰减的应力衰减方向为d，距离d设定为0.06mm以上且0.45mm以下 ，最大von Mises应力为5.00E + 11 Pa及以下。

公开(公告)号：JP2014078739A

公开(公告)日：2014-05-01

申请号：JP2013258606

申请日：2013-12-13

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： IIZUKA MINORU ,  KISHIMOTO KOICHI ,  SHIBUYA KOZO ,  NAKANISHI KENTARO

IPC: H01L23/04 ,  H01L21/60 ,  H01L23/12 ,  H03H9/02

CPC classification number: H01L23/49838 ,  H01L23/053 ,  H01L23/49822 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for improving the reliability of mounting joint between a package for an electronic component and a circuit board.SOLUTION: A package for an electronic component has a base 1 and a lid 2, and terminal electrodes 12, 13 on a bottom surface of the base 1 and a circuit board 4 are bonded through a conductive bonding member D. The first terminal electrode 12 is disproportionately formed at one corner position on the bottom surface of the base 1, and the second terminal electrode 13 is disproportionately formed at only a diagonal position of one corner position. An other corner position opposed to one corner position in a short side direction of a bottom surface, and a second diagonal position which is a diagonal position of the other corner position on the bottom surface, are defined as electrodeless regions 16, 17 where terminal electrodes 12, 13 are not formed thereon. In the base of the package for the electronic component, castellations C1, C3 are formed from a side surface of the base 1 to its bottom surface, and side surface terminal electrodes 121, 131 connected to terminal electrodes 12, 13, are formed on castellations C1, C3.

Abstract translation: 要解决的问题：提供一种用于提高电子部件用封装和电路基板之间的安装接头的可靠性的方法。解决方案：用于电子部件的封装具有基座1和盖子2以及端子电极12， 并且电路基板4通过导电性接合构件D接合。第一端子电极12不均匀地形成在基座1的底面的一个角位置，第二端子电极13 仅在一个角位置的对角位置不成比例地形成。 与底面的短边方向上的一个角位置相对的另一个角位置和作为底面上的另一个角位置的对角线位置的第二对角位置被定义为无电极区域16,17，其中端子电极 12,13不形成在其上。 在用于电子部件的封装的基部中，从基座1的侧面到其底面形成有蓖合C1，C3，并且与端子电极12,13连接的侧面端子电极121,131形成在cast ations C1，C3。

公开(公告)号：JP2011066922A

公开(公告)日：2011-03-31

申请号：JP2010249160

申请日：2010-11-05

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： MURAKAMI TATSUYA ,  IIZUKA MINORU

IPC: H03H9/02 ,  H03H9/19

Abstract: PROBLEM TO BE SOLVED: To provide a novel chip-type piezoelectric vibration device that can surely hold and hermetically seal a piezoelectric vibration element even if it is microfabricated.
SOLUTION: Excitation electrodes 111 and 112 are individually formed in center areas of main back and front faces of a crystal vibration plate 1. Each of the excitation electrodes is rectangular, formed face to face via the crystal vibration plate, and formed of drawer electrodes 111a and 121a connected to each of the excitation electrodes. Terminal bodies 12 and 13 are connected with the main back and front faces of the crystal vibration plate 11. The terminal bodies 12 and 13 are in rectangular blocks and constituted of an insulator of crystals, ceramic or the like. Cavities C are formed at joint faces 121 and 131 of the terminal bodies.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种新颖的芯片型压电振动装置，其即使是微加工也能够可靠地保持和密封压电振动元件。 解决方案：激励电极111和112分别形成在晶体振动板1的主后表面和前表面的中心区域中。每个激励电极是矩形的，通过晶体振动板面对面地形成，并由 连接到每个激励电极的抽屉电极111a和121a。 端子体12和13与晶体振动板11的主后表面和前表面连接。端子体12和13是矩形块体，由晶体，陶瓷等的绝缘体构成。 在端子体的接合面121,131处形成有空穴C。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2008091971A

公开(公告)日：2008-04-17

申请号：JP2006266945

申请日：2006-09-29

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： MURAKAMI TATSUYA ,  IIZUKA MINORU

IPC: H03H9/19 ,  H03H9/02

Abstract: PROBLEM TO BE SOLVED: To provide a new chip-type piezoelectric vibration device capable of holding and airtightly sealing a piezoelectric vibration element reliably even in subminiaturization.
SOLUTION: Excitation electrodes 111, 112 are formed in the center regions on front and rear main surfaces of a crystal diaphragm 1 each. Each excitation electrode has a rectangular shape, is formed opposingly via the crystal diaphragm, and has formed extraction electrodes 111a, 121a connected to each excitation electrode. Terminal bodies 12, 13 are connected to the front and rear main surfaces of the crystal diaphragm 11. The terminal bodies 12, 13 are in a rectangular parallelepiped block shape, and are composed of crystal, or an insulator, such as ceramics. A cavity C is provided on junction surfaces 121, 131 of the terminal body.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：即使在小型化中也能够提供能够可靠地保持和气密地密封压电振动元件的新型芯片式压电振动装置。 解决方案：激励电极111,112分别形成在晶体振动膜1的前后主表面的中心区域中。 每个激发电极具有矩形形状，通过晶体膜相对地形成，并且形成连接到每个激励电极的引出电极111a，121a。 端子体12,13与晶体振动板11的前后主面连接。端子体12,13呈长方体状，由晶体构成，绝缘体等陶瓷构成。 空腔C设置在终端主体的接合面121,131上。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007120988A

公开(公告)日：2007-05-17

申请号：JP2005310258

申请日：2005-10-25

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： IIZUKA MINORU ,  KUSAI TSUTOMU ,  KOTAKARI SHUJI

IPC: G01R29/22

Abstract: PROBLEM TO BE SOLVED: To inhibit mistakes in discriminating the respective qualities of a plurality of piezoelectric oscillation devices tested simultaneously by inhibiting the defective discrimination of the qualities of the plurality of piezoelectric oscillation devices. SOLUTION: The temperature test device 1 is the temperature test device of an inline system for measuring the performance of the crystal oscillators CR while transferring the crystal oscillators CR along X direction in one temperature bath 11. The temperature test device 1 comprises the discriminator parts 3 for discriminating the carrier C and the crystal oscillators CR mounted on the carrier C, and the measuring parts 5 for measuring the oscillation frequency of the crystal oscillators CR at each temperature accompanied by the temperature change of the crystal oscillators CR. The discriminator parts 3 are arranged along the transferring direction (X direction) of the crystal oscillator CR at the front and the back of the measurement parts 5. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：通过抑制对多个压电振荡器件的质量的不良认定来抑制同时测试的多个压电振荡器件的各种质量的错误。 解决方案：温度测试装置1是用于在一个温度浴11中沿X方向传送晶体振荡器CR的同时测量晶体振荡器CR的性能的在线系统的温度测试装置。温度测试装置1包括 用于鉴别载体C和安装在载体C上的晶体振荡器CR的鉴别器部分3和用于测量伴随晶体振荡器CR的温度变化的每个温度下的晶体振荡器CR的振荡频率的测量部分5。 鉴别器部件3沿着测量部件5的前后的晶体振荡器CR的传送方向（X方向）排列。（C）2007，JPO＆INPIT

公开(公告)号：JP2005237041A

公开(公告)日：2005-09-02

申请号：JP2005139589

申请日：2005-05-12

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： IIZUKA MINORU ,  ISHIHARA HIROMASA ,  OGASAWARA YOSHIKIYO ,  MORI AKIHIRO ,  HIRAO SUSUMU ,  MURAKAMI TATSUYA

IPC: H03H9/10 ,  H03H9/02

Abstract: PROBLEM TO BE SOLVED: To maintain proper adhesion state and adhesive strength, and improve shock-resistance, even if a crystal vibration plate is jointed to the electrode pad of a base, using a silicon-based conductive adhesive.
SOLUTION: The crystal vibration plate, by which a lead-out electrode led out from a driven electrode and each driven electrode has been formed in both the principal planes and the electrode pad formed on the base are electrically connected with the lead-out electrode via the silicon-based conductive adhesives. The electrode pad is sequentially laminated in the order of a metallized layer, a Ni film layer, an Au film layer, an Ag thin-film layer or an Al thin-film layer which comprises tungsten or molybdenum, on the base.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：即使使用硅基导电粘合剂将晶体振动板连接到基座的电极焊盘上，为了保持适当的粘附状态和粘合强度，并且提高抗冲击性。 解决方案：在主平面中形成从驱动电极引出的引出电极和每个驱动电极的晶体振动板与形成在基座上的电极焊盘电连接， 通过硅基导电粘合剂的电极。 电极焊盘按照金属化层，Ni膜层，Au膜层，Ag薄膜层或包含钨或钼的Al薄膜层的顺序依次层叠在基材上。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2004104117A

公开(公告)日：2004-04-02

申请号：JP2003298001

申请日：2003-08-21

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： IIZUKA MINORU ,  KISHIMOTO KOICHI

IPC: H01L23/10 ,  H03H9/02

Abstract: PROBLEM TO BE SOLVED: To provide electronic components and an inexpensive piezoelectric vibrator device having stabilized characteristics, wherein reliability of hermetically sealed jointing between a package and a gap is improved, and hermetically sealed construction dealing also with environment problems is ensured.
SOLUTION: A surface mount quartz vibrator consists of a ceramic package 1, having a recessed opening in its upper portion, of a quartz vibrator plate 3 being a piezoelectric vibration plate accommodated in the package, and of a cap 2 joined with the opening in the package. The cap and the package are hermetically jointed with a zinc phosphate glass jointing member.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2002176116A

公开(公告)日：2002-06-21

申请号：JP2000370726

申请日：2000-12-05

Applicant: DAISHINKU CORP

Inventor： OGASAWARA YOSHIKIYO ,  IIZUKA MINORU

IPC: H01L23/02

Abstract: PROBLEM TO BE SOLVED: To provide an air-tight sealing method of package for electronic component which uses ultra-small size electronic components, reduces manufacturing cost and does not deteriorate electrical characteristics. SOLUTION: A ceramic package, in which a crystal-controlled oscillator 3 is accommodated and a cap 2 is also loaded to the predetermined positions of a component loading portion S, is positioned and disposed using a jig or the like. A press tool T is heated up to the predetermined temperature with a heating portion D2 of a high frequency heater, the component loading portion S is moved upward under this condition, and a contact portion T1 and the cap 2 are pressurized in contact to realize the air-tight sealing.

公开(公告)号：JP2001028484A

公开(公告)日：2001-01-30

申请号：JP20125299

申请日：1999-07-15

Applicant: DAISHINKU CORP

Inventor： MATSUURA HIROYOSHI ,  IIZUKA MINORU

IPC: H05K5/00 ,  H01L23/02 ,  H03H9/10

Abstract: PROBLEM TO BE SOLVED: To provide a package for electronic part which is effective in manufacture. SOLUTION: The package comprises a rectangular substrate 1 in top view, provided with a recess where an element 3 is housed, and a rectangular lid 2 in top view which corresponds to the top surface shape of the substrate and seals it in air-tight, with a sealing material 22 formed at the bonding surface between the lid and the substrate. Here, one corner of the lid is different in shape from other corner. A different-shaped corner of the lid is so arranged as to correspond to a specified corner of the substrate, with the main surface of the lid where a sealing material is formed facing down to contact the bonding surface for the substrate.

公开(公告)号：JP2000278066A

公开(公告)日：2000-10-06

申请号：JP7881499

申请日：1999-03-24

Applicant: DAISHINKU CORP

Inventor： IIZUKA MINORU

IPC: H03H3/04 ,  H03H9/215

Abstract: PROBLEM TO BE SOLVED: To selectively cut an arbitrary part at the tip of a vibration leg part and to execute optimum adjustment by adjusting a characteristic to a prescribed one by means of cutting a part of the tip part of the vibration leg part of a bend vibrator with a laser beam. SOLUTION: A tuning fork-type crystal piece 1 is cut from an X-Y crystal board and it is formed of a pair of vibration leg parts 11 and 12 and a base part 13 connecting the leg parts. Respective facing electrodes are connected in common by the base part 13 so that the vibration leg parts 11 and 12 are caused to execute bend vibration. For efficiently changing the size of the regular vibration leg part, an outer angle part is gradually cut and is adjusted. The laser beam of a wavelength fitted for cutting crystal is developed and a part of it is supplied for practical use. A cut face by the laser beam can be finished to a considerably satisfactory state. Thus, a frequency and a crystal impedance(CI) value are narrowed to a desired range.