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    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF
    43.
    发明专利
    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF 未知

    公开(公告)号：SG182076A1

    公开(公告)日：2012-07-30

    申请号：SG2011090644

    申请日：2011-12-07

    Applicant: GEN ELECTRIC

    Inventor： BEAUPRE RICHARD ALFRED ,  MCCONNELEE PAUL ALAN ,  GOWDA ARUN VIRUPAKSHA ,  GORCZYCA THOMAS BERT

    Abstract: A semiconductor device package includes a semiconductor device having connection pads formed thereon, with the connection pads being formed on first and second surfaces of the semiconductor device with edges of the semiconductor device extending therebetween. A first passivation layer is applied on the semiconductor device and a base dielectric laminate is affixed to the first surface of the semiconductor device that has a thickness greater than that of the first passivation layer. A second passivation layer having a thickness greater than that of the first passivation layer is applied over the first passivation layer and the semiconductor device to cover the second surface and the edges of the semiconductor device, and metal interconnects are coupled to the connection pads, with the metal interconnects extending through vias formed through the first and second passivation layers and the base dielectric laminate sheet to form a connection with the connection pads.Figure 1

    STRESS RESISTANT MICRO-VIA STRUCTURE FOR FLEXIBLE CIRCUITS
    44.
    发明专利
    STRESS RESISTANT MICRO-VIA STRUCTURE FOR FLEXIBLE CIRCUITS 未知

    公开(公告)号：SG173975A1

    公开(公告)日：2011-09-29

    申请号：SG2011012119

    申请日：2011-02-21

    Applicant: GEN ELECTRIC

    Inventor： GORCZYCA THOMAS BERT ,  SAIA RICHARD JOSEPH ,  MCCONNELEE PAUL ALAN

    Abstract: A chip package is disclosed that includes an electronic chip having a plurality of die pads formed on a top surface thereof, with a polyimide flex layer positioned thereon by way of an adhesive layer. A plurality of vias is formed through the polyimide flex layer and the adhesive layer corresponding to the die pads. A plurality of metal interconnects are formed on the polyimide flex layer each having a cover pad covering a portion of a top surface of the polyimide flex layer, a sidewall extending down from the cover pad and through the via along a perimeter thereof, and a base connected to the sidewall and forming an electrical connection with a respective die pad. Each of the base and the sidewall is formed to have a thickness that is equal to or greater than a thickness of the adhesive layer.Figure 4

    45.
    发明专利
    未知

    公开(公告)号：BRPI0413952A

    公开(公告)日：2006-10-31

    申请号：BRPI0413952

    申请日：2004-08-05

    Applicant: GEN ELECTRIC

    Inventor： DENG KUNG-LI ,  GORCZYCA THOMAS BERT ,  GUIDA RENATO ,  NIELSEN MATTHEW CHRISTIAN ,  SHIH MIN-YI ,  TOLLIVER TODD RYAN

    IPC: G02B6/12 ,  G02B6/125 ,  G02B6/138 ,  G02B6/26 ,  G02B6/30 ,  G02B6/32 ,  G02B6/42 ,  G02F1/35

    Abstract: A waveguide (116) fabrication method includes depositing a photodefinable copolymer material (14) comprising methyl methacrylate, tetrafluoropropyl methacrylate, and an epoxy monomer; fixing optical elements (10, 12) relative to the copolymer material; sending light through at least one of the optical elements and copolymer material towards the other; volatilizing uncured monomer. Another waveguide (116) fabrication method includes: fixing optical elements (110, 112) relative to each other, each having an optical surface (11, 13); providing a copolymer blob (114) over the optical surfaces with sufficient surface tension to result in the copolymer blob having a curved surface (15); sending light through each of the optical elements towards the curved surface and the other; volatilizing uncured monomer. An optical path fabrication method comprises: fixing optical elements (70, 76) relative to each other, each having an optical surface (71, 77); translating and rotating a mirror (78) until aligned to optimally direct light from one of the optical elements to the other; securing the aligned mirror in position.

    POLYMER OPTICAL WAVEGUIDES WITH ENHANCED INDEX CONTRAST AND FABRICATION METHOD THEREOF
    46.
    发明专利
    POLYMER OPTICAL WAVEGUIDES WITH ENHANCED INDEX CONTRAST AND FABRICATION METHOD THEREOF 未知

    公开(公告)号：CA2532391A1

    公开(公告)日：2005-02-10

    申请号：CA2532391

    申请日：2004-07-16

    Applicant: GEN ELECTRIC

    Inventor： GORCZYCA THOMAS BERT ,  SHIH MIN-YI

    IPC: G02B6/12 ,  G02B6/10

    Abstract: A method of forming a waveguide including a core region (12), a cladding region (14), and an index contrast region (16) situated therebetween include s depositing a polymerizable composite on a substrate (18) to form a layer (22 ), patterning the layer to define an exposed area (26) and an unexposed area (2 8) of the layer, irradiating the exposed area of the layer, and volatilizing th e uncured monomer to form the waveguide, wherein the polymerizable composite includes a polymer binder and sufficient quantities of an uncured monomer to diffuse into the exposed area of the layer and form the index contrast regio n. The resulting waveguide includes an index contrast region which has a lower index of refraction than that of the core and cladding regions.

    METHOD OF FORMING POLYMERIC OPTICAL DEVICE STRUCTURES
    47.
    发明专利
    METHOD OF FORMING POLYMERIC OPTICAL DEVICE STRUCTURES 未知

    公开(公告)号：AU2003294459A1

    公开(公告)日：2004-06-23

    申请号：AU2003294459

    申请日：2003-11-21

    Applicant: GEN ELECTRIC

    Inventor： GORCZYCA THOMAS BERT

    IPC: G02B3/00 ,  G02B6/138 ,  G03F7/00 ,  G03F7/36 ,  G03F7/40 ,  G02B6/12

    Abstract: A method of forming an optical device structure having a first region and a second region. The method comprises: providing a polymerizable composite comprising a polymer binder and an uncured monomer, depositing the polymerizable composite on a substrate to form a layer, patterning the layer to define an exposed area and an unexposed area of the layer, irradiating the exposed area of layer, and volatilizing the uncured monomer to form the optical device structure. The step of volatilizing the uncured monomer forms a surface topography and a compositional change between the first region and the second region. The compositional change creates a gradient in refractive index between the first region and the second region.

    48.
    发明专利
    未知

    公开(公告)号：ES2203110T3

    公开(公告)日：2004-04-01

    申请号：ES99915336

    申请日：1999-04-08

    Applicant: GEN ELECTRIC

    Inventor： FEIST THOMAS PAUL ,  GORCZYCA THOMAS BERT ,  SAIA RICHARD JOSEPH ,  MCCONNELEE PAUL ALAN

    IPC: B29C45/26 ,  G11B7/26

    Abstract: A method for molding an optical disk comprises: applying a thermally insulative insert coating to at least one thermally insulative mold insert to provide at least one coated mold insert having a reduced surface roughness; positioning the coated mold insert between a thermally conductive mold form and a portion of a thermally conductive mold apparatus; injecting a molten thermoplastic material into the mold apparatus; retaining the material in the mold apparatus for a time sufficient for the molten thermoplastic material to cool below its glass transition temperature to form the optical disk; and ejecting the optical disk from the mold apparatus. In another embodiment, the mold insert is coated or laminated on the mold form with the mold insert having a coefficient of thermal expansion compatible with the coefficient of thermal expansion of the mold form. In another embodiment, the mold insert is fabricated by being applied, cured, and then removed from a release layer.

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