公开(公告)号：DE10318078A1

公开(公告)日：2004-11-25

申请号：DE10318078

申请日：2003-04-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRINTZINGER AXEL ,  TROVARELLI OCTAVIO

IPC: H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  H01L23/485 ,  H01L23/50 ,  H01L21/56

Abstract: Protecting the wiring on wafers/chips comprises covering the wafer (1) with the wiring on its whole surface with an organic layer (12) to protect the wiring from corrosion and oxidation and form a sealed coating of the metal surface of the wiring.

公开(公告)号：DE10241589A1

公开(公告)日：2004-03-25

申请号：DE10241589

申请日：2002-09-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRINTZINGER AXEL ,  UHLENDORF INGO ,  SCHENK ANDRE ,  WOLLANKE ALEXANDER

IPC: H01L21/44 ,  H01L21/60 ,  H01L23/485

Abstract: Process for solder-stop structuring protrusions on wafers (3) such as three dimensional contact structures (1) in the form of elastic or flexible contact bumps comprises depositing a resist on the tip of the three dimensional structure, depositing a solder-stop layer over a metallization including the resist, and removing the resist on the tip of the three dimensional structure including the solder-stop layer covering it.