Patent search ap:("INFINEON TECHNOLOGIES AG") AND inv:"WOLLANKE ALEXANDER" Page 1

1.

发明专利
未知

公开(公告)号：DE102006005645A1

公开(公告)日：2007-03-29

申请号：DE102006005645

申请日：2006-02-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOLLANKE ALEXANDER , DOBRITZ STEPHAN , MEYER THORSTEN

IPC: H01L21/50 , H01L25/065

Abstract: The present invention generally relates to a method for fabricating a stackable packaged device and a method for producing a packaged device stack utilizing stackable packaged devices. The present invention further refers to a stackable packaged device and a packaged device stack.

2.

发明专利
Wiring system for electronic component containing material interface on surface of wafer supporting wiring system, consists of conductive tracks, in which at least one track continuously surmounts interface(s) between different materials 未知

公开(公告)号：DE102004050177A1

公开(公告)日：2006-04-20

申请号：DE102004050177

申请日：2004-10-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER TORSTEN , LUHMANN CLAUDIA , WOLLANKE ALEXANDER

IPC: H01L23/50 , H01L21/48 , H01L21/60

Abstract: Wiring system for electronic component consists of conductive tracks on component surface (5), containing at least one interface (4), in its plane, between different materials. One conductive track (6) surmounts continuously interface. In junction region (8) on interface, which extends over both adjacent materials, conductive track is mechanically decoupled from surface of component. Preferably, width of junction region is rated according to temperature region, to which component will be exposed, as well as to difference of linear expansion coefficients of interface materials. Independent claims are included for method for forming wiring system.

3.

发明专利
Process for solder-stop structuring protrusions on wafers such as three dimensional contact structures for improving integration comprises depositing a resist on the three dimensional structure, and further processing 未知

公开(公告)号：DE10241589A1

公开(公告)日：2004-03-25

申请号：DE10241589

申请日：2002-09-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRINTZINGER AXEL , UHLENDORF INGO , SCHENK ANDRE , WOLLANKE ALEXANDER

IPC: H01L21/44 , H01L21/60 , H01L23/485

Abstract: Process for solder-stop structuring protrusions on wafers (3) such as three dimensional contact structures (1) in the form of elastic or flexible contact bumps comprises depositing a resist on the tip of the three dimensional structure, depositing a solder-stop layer over a metallization including the resist, and removing the resist on the tip of the three dimensional structure including the solder-stop layer covering it.

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