公开(公告)号：DE10261410A1

公开(公告)日：2004-07-22

申请号：DE10261410

申请日：2002-12-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  IRSIGLER ROLAND

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H01L23/50

Abstract: Method for assembly of an integrated circuit (5) with a substrate by provision of a packing and substrate with the same number of junction regions, and relieved contact regions on the junction regions. Method for assembly of an integrated circuit (5) ,e.g. a chip, water or hybrid with a substrate by provision of a packing and substrate with the same number of junction regions, and relieved contact regions on the junction regions, forming first and second groups of contact regions, and creation of a connection between the packing and substrate over the relieved regions, where the two groups form rigid and elastic bonds respectively between the packing and substrate. An Independent claim is also included for a switching arrangement providing a connection between the integrated circuit, especially of a chip, wafer or hybrid with a substrate.

公开(公告)号：DE10223738A1

公开(公告)日：2003-12-18

申请号：DE10223738

申请日：2002-05-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  POHL JENS ,  IRSIGLER ROLAND

IPC: H01L21/98 ,  H01L23/31 ,  H01L23/485 ,  H01L25/065 ,  H01L21/60 ,  H01L23/50

Abstract: The second integrated circuit (C2) is mounted above the first integrated circuit (C1) in a housing (VK). The bottom of the housing is closed by a substrate (P) with contacts (PKF) at the bottom. Connectors (80) extend from the first integrated circuit to bonding pads (BP') on the substrate. The space between the first and second integrated circuits is filled with an adhesive material (300). Flexible contacts on the underside of the second integrated circuit touch flexible contacts on the upper side of the first integrated circuit.

公开(公告)号：DE10153609C2

公开(公告)日：2003-10-16

申请号：DE10153609

申请日：2001-11-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  FRANKOWSKY GERD ,  IRSIGLER ROLAND ,  VASQUEZ BARBARA

IPC: H01L21/98 ,  H01L25/065 ,  H01L23/538

公开(公告)号：DE10164800A1

公开(公告)日：2003-08-14

申请号：DE10164800

申请日：2001-11-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  FRANKOWSKY GERD ,  IRSIGLER ROLAND ,  VASQUEZ BABARA

IPC: H01L21/98 ,  H01L25/065 ,  H01L21/58 ,  H01L23/50

公开(公告)号：DE10137346A1

公开(公告)日：2003-02-27

申请号：DE10137346

申请日：2001-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  IRSIGLER ROLAND

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/50

Abstract: An insulating layer (6) is applied to the outer surface, except for in a contact pad region (4). At least one structured trench layer (8) is applied to the insulating layer and comprises at least one trench (10) corresponding to the path of a conductive track (18), and in contact with the contact pad (4). Solder is placed in the trench to form a conductive track. An Independent claim is also included for a method of manufacturing a chip device.

公开(公告)号：DE10130786C1

公开(公告)日：2003-02-13

申请号：DE10130786

申请日：2001-06-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  IRSIGLER ROLAND

IPC: H01L21/82 ,  H01L23/525

Abstract: Laser Programming of Integrated Circuits. The invention relates to the laser adjustment or laser programming of laser fuses of an integrated circuit on a chip, with laser light, the integrated circuit having a plurality of laser fuses and being connected to a plurality of contact pads on the chip, and the chip being covered with a polymer layer which has at least windows on the plurality of contact pads, and comprising at least one wiring interconnect on the polymer layer which is electrically connected to at least one of the plurality of contact pads and ends at a predetermined location on a surface of the chip. To make it possible for integrated circuits to be programmed with laser light as late as possible in the production process, according to the invention the chip is irradiated in a predetermined region with intensive laser light, so that in the wiring interconnect there is created an interconnect opening, in the polymer layer lying thereunder there is created a layer opening and at least one of the plurality of laser fuses is interrupted in the predetermined region.