公开(公告)号：DE10153609A1

公开(公告)日：2003-05-15

申请号：DE10153609

申请日：2001-11-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  FRANKOWSKY GERD ,  IRSIGLER ROLAND ,  VASQUEZ BARBARA

IPC: H01L21/98 ,  H01L25/065

Abstract: Production of electronic component comprises: forming first planar chip arrangement by arranging functional chips at a distance from each other in a grid and filling the gaps with a filler; forming and/or arranging a further planar chip arrangement on the first chip arrangement; optionally applying interconnecting elements; and forming electronic components by removing frames of chip arrangements. Production of an electronic component comprises: forming a first planar chip arrangement by arranging functional chips at a distance from each other in a grid and filling the gaps with a filler to form a frame for isolating the chips and for forming an electrical contact to another chip of another chip arrangement; forming and/or arranging a further planar chip arrangement as in the first step on the first chip arrangement so that the chips and the frames of the arrangements lie over each other and the contact elements of both chip arrangements are connected together for a chip-chip contact; optionally repeating the previous step; optionally applying interconnecting elements according to use; and forming electronic components by removing the frames of the chip arrangements. An Independent claim is also included for the electronic component produced. Preferred Features: The first chip arrangement is produced using a support on which the chips are fixed using an adhesive. The support is a self-adhesive foil or strip or a passivated silicon support.

公开(公告)号：DE10141591A1

公开(公告)日：2003-03-13

申请号：DE10141591

申请日：2001-08-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRANKOWSKY GERD ,  HEDLER HARRY ,  MEYER THORSTEN ,  VASQUEZ BARBARA

IPC: H01L23/525 ,  H01L23/50

Abstract: An electronic memory chip has layers (9,10) covering an integrated circuit on which are contact electrodes (3) to bond pads (2) and wiring (4). Laser-induced correction is by means of vias having a conductive layer (6) covered by a thin dielectric layer (7) which penetrable by laser.

公开(公告)号：DE10145382A1

公开(公告)日：2003-01-09

申请号：DE10145382

申请日：2001-09-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRANKOWSKY GERD ,  MEYER THORSTEN ,  HEDLER HARRY ,  IRSIGLER ROLAND ,  VASQUEZ BARBARA

IPC: H01L21/56 ,  H01L21/66 ,  H01L21/68 ,  H01L23/31 ,  H01L23/32 ,  H01L21/58 ,  H01L21/60 ,  H01L21/78

Abstract: The method involves producing a number of separate components, especially chips, from a wafer, separating the components, arranging at least some in a raster at larger separations than on the wafer, filling the spaces to form a mounting frame, carrying out wafer-level packaging by making individual component connections and contact elements and/or holding elements near the holding frame and separating the components by dividing the frame. AN Independent claim is also included for the following: an electronic chip manufactured in accordance with the inventive method.

公开(公告)号：DE10125905C1

公开(公告)日：2002-11-28

申请号：DE10125905

申请日：2001-05-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  VASQUEZ BARBARA

IPC: H01L21/52 ,  H01L21/60 ,  H01L21/58 ,  H01L23/32 ,  H01L23/50

Abstract: The releasable coupling uses corresponding mechanical coupling elements provided by the IC chip (1) and the carrier (20) which are interlocked with one another when the coupling is assembled. The mechanical coupling elements of the IC chip (1) and the carrier (20) can be provided on an insulation layer (2) applied to each of the latter, via a structured polymer layer (5), with a contact element (9) applied to a contact pad (4) for providing a separate electrical coupling between the IC chip and the carrier.

公开(公告)号：DE10120928C1

公开(公告)日：2002-10-31

申请号：DE10120928

申请日：2001-04-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  IRSIGLER ROLAND ,  VASQUEZ BARBARA

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H01L21/58

Abstract: The production of a contact joint between a semiconductor chip (C1) and a substrate (MB) comprises preparing a substrate having a first contact surface (MK); preparing the chip having a second contact surface (L1); applying a hardenable conducting adhesive on the first contact surface and/or the second contact surface; joining the contact surfaces; and hardening the adhesive to form the contact joint. The adhesive comprises a matrix (K), a filler (F), a hardener and a decomposable component which decomposes either thermally or by irradiation. Preferred Features: The contact surfaces are mechanically separated, the chip removed and a further chip placed on its site through a corresponding contact joint. The filler is made from silver, nickel, gold, copper, aluminum, platinum, silicon or metal-coated particles.