公开(公告)号：NO20020140D0

公开(公告)日：2002-01-11

申请号：NO20020140

申请日：2002-01-11

Applicant: INPUT OUTPUT INC

Inventor： YU DULI ,  YU LIANZHONG ,  GOLDBERG HOWARD D ,  SCHMIDT MARTIN A ,  RIED ROBERT P

IPC: G02B26/10 ,  B81B3/00 ,  G02B7/182 ,  G02B26/08 ,  G06K7/10 ,  G02B

Abstract: A micro machined mirror assembly is provided that includes a micro machined top cap, mirror, and bottom cap mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T-shaped hinges and includes travel stops that limit motion of the mirror in the z-direction. The top and bottom micro machined caps also include travel stops that limit motion of the mirror in the z-direction.

公开(公告)号：NO20014469A

公开(公告)日：2001-10-24

申请号：NO20014469

申请日：2001-09-14

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  MARSH JAMES L ,  GOLDBERG HOWARD D ,  YU DULI ,  STALNAKER W MARC

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00

CPC classification number: G01P1/023 ,  B81B3/001 ,  B81B3/0072 ,  B81B7/0016 ,  B81B2201/0235 ,  G01D11/245 ,  G01D18/008 ,  G01N2001/021 ,  G01P15/0802 ,  G01P15/13 ,  G01P21/00 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/181 ,  G01V1/186 ,  H01L2224/48472 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：NO20014464D0

公开(公告)日：2001-09-14

申请号：NO20014464

申请日：2001-09-14

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  GOLDBERG HOWARD D ,  YU DULI ,  IP MATTHEW ,  SCHMIDT MARTIN A ,  MARSH JAMES L ,  FUNG BING-FAI ,  SIMON PHILIP

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00 ,  G01P

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

公开(公告)号：CA2378736A1

公开(公告)日：2001-01-18

申请号：CA2378736

申请日：2000-07-13

Applicant: INPUT OUTPUT INC

Inventor： RIED ROBERT P ,  SCHMIDT MARTIN A ,  YU DULI ,  YU LIANZHONG ,  GOLDBERG HOWARD D

IPC: G02B26/10 ,  B81B3/00 ,  G02B7/182 ,  G02B26/08 ,  G06K7/10

Abstract: A micro machined mirror assembly is provided that includes a micro machined top cap (205), mirror (210), and bottom cap (215) mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T - shaped hinges and includes travel stops that limit motion of the mirror in t he x-, y-, and z-directions. The top and bottom micro machined caps also includ e travel stops that limit motion of the mirror in the z-direction.

公开(公告)号：AU4503500A

公开(公告)日：2000-10-04

申请号：AU4503500

申请日：2000-03-16

Applicant: INPUT/OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  GOLDBERG HOWARD D ,  YU DULI ,  IP MATTHEW ,  SCHMIDT MARTIN A ,  MARSH JAMES L ,  FUNG BING-FAI ,  SIMON PHILIP

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

公开(公告)号：EP1192419A4

公开(公告)日：2004-12-08

申请号：EP00915012

申请日：2000-03-17

Applicant: INPUT OUTPUT INC

Inventor： RUSHEFSKY LARRY ,  SIGMAR AXEL ,  GOLDBERG HOWARD D ,  STALNAKER W MARC ,  RINNE RAY ,  BALDERES DEMETRIOS ,  LEMKE AL ,  IP MATTHEW ,  BEHN LAWRENCE P ,  DOMAGALSKI KLAUS ,  YU LIANZHONG ,  SELVAKUMAR ARJUN ,  YU DULI ,  MARSH JAMES L ,  MAXWELL PETER ,  MORGAN DAVID ,  BUIE THOMAS ,  FABER KEES ,  ALTMAN SJOERD ,  LAROO RICHARD

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00 ,  G01D21/00 ,  G01P15/00

CPC classification number: G01P1/023 ,  B81B3/001 ,  B81B3/0072 ,  B81B7/0016 ,  B81B2201/0235 ,  G01D11/245 ,  G01D18/008 ,  G01N2001/021 ,  G01P15/0802 ,  G01P15/13 ,  G01P21/00 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/181 ,  G01V1/186 ,  H01L2224/48472 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system for acquiring environnemental information measurements. The 5 system (100) utilizes a sensor, (205) a front-end circuit, (310) a loop filter (315), a switch controller (206), and a recuced-oder loop control circuit to provide reliable data measurements while providing robust system behavior. The system further includes a sensor simulator (330) for simulating the operation of the sensor (205) and testing the operation of the front-end circuit (310) nd the loop filter (315).

公开(公告)号：EP1208385A4

公开(公告)日：2002-11-27

申请号：EP00926518

申请日：2000-03-16

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  GOLDBERG HOWARD D ,  YU DULI ,  IP MATTHEW ,  SCHMIDT MARTIN A ,  MARSH JAMES L ,  FUNG BING-FAI ,  SIMON PHILIP

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00 ,  B81B3/00 ,  B81B7/00 ,  G01P1/00

CPC classification number: G01P1/023 ,  B81B3/001 ,  B81B3/0072 ,  B81B7/0016 ,  B81B2201/0235 ,  G01D11/245 ,  G01D18/008 ,  G01N2001/021 ,  G01P15/0802 ,  G01P15/13 ,  G01P21/00 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/181 ,  G01V1/186 ,  H01L2224/48472 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system for acquiring environnemental information measurements. The 5 system (100) utilizes a sensor, (205) a front-end circuit, (310) a loop filter (315), a switch controller (206), and a recuced-oder loop control circuit to provide reliable data measurements while providing robust system behavior. The system further includes a sensor simulator (330) for simulating the operation of the sensor (205) and testing the operation of the front-end circuit (310) nd the loop filter (315).

公开(公告)号：CA2413965C

公开(公告)日：2011-01-11

申请号：CA2413965

申请日：2001-06-21

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  YU DULI ,  YU LIANZHONG ,  JONES BEN W

IPC: G01P15/00 ,  B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  G01V1/18

Abstract: An accelerometer comprising a measuring mass (1405) for detecting acceleration, including a housing having a cavity, one or more spring mass assemblies (1400) positioned within the cavity, wherein each spring mass assembly (1400) includes a support structure (1410), including one or more resilient folded beams (1415a-1415d) coupled to the support structure (1410) and the measuring mass (1405) is coupled to the resilent folded beams (1415a-1415d), wherein one or more electrode patterns are coupled to the spring mass assembly (1400), wherein a top cap wafer, including a top capacitor electrode, is coupled to the measurement mass (1405), and a bottom cap wafer, including a bottom capacitor electrode, is also coupled to measurement mass (1405).

公开(公告)号：CA2378736C

公开(公告)日：2010-03-23

申请号：CA2378736

申请日：2000-07-13

Applicant: INPUT OUTPUT INC

Inventor： YU DULI ,  YU LIANZHONG ,  GOLDBERG HOWARD D ,  SCHMIDT MARTIN A ,  RIED ROBERT P

IPC: G02B7/182 ,  G02B26/10 ,  B81B3/00 ,  G02B26/08 ,  G06K7/10

Abstract: A micro machined mirror assembly is provided that includes a micro machined top cap (205), mirror (210), and bottom cap (215) mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T-shaped hinges and includes travel stops that limit motion of the mirror in the x-, y-, and z-directions. The top and bottom micro machined caps also include travel stops that limit motion of the mirror in the z-direction.

公开(公告)号：CA2367983C

公开(公告)日：2008-11-25

申请号：CA2367983

申请日：2000-03-15

Applicant: INPUT OUTPUT INC

Inventor： STALNAKER W MARC ,  GOLDBERG HOWARD D ,  YU DULI ,  SELVAKUMAR ARJUN ,  MARSH JAMES L

IPC: G01P21/00 ,  H05K5/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  G02B7/00 ,  H01L21/60 ,  H01L29/84

Abstract: A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to t he housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.