Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition capable of forming microlenses excellent in thickness, resolution, pattern shape, heat resistance, transparency, heat discoloration resistance, solvent resistance, and also capable of having good storage stability. SOLUTION: The radiation sensitive resin composition comprises: (A) an alkali-soluble copolymer obtained by polymerizing 100 wt.%, in total, of 10-50 wt.% of a polymerizable unsaturated compound (a) having an acidic functional group, 20-60 wt.% of a polymerizable unsaturated compound (b) having an alicyclic hydrocarbon group but not having an acidic functional group and 5-40 wt.% of another polymerizable unsaturated compound (c); (B) a polymerizable unsaturated compound including a polymerizable unsaturated compound having an alicyclic hydrocarbon group but not having an acidic functional group as an essential component; and (C) a photopolymerization initiator. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition preferably used to simultaneously form projections and spaces in vertical aligned liquid crystal display elements. SOLUTION: The radiation-sensitive resin composition for simultaneously forming projections and spaces in vertical aligned liquid crystal display elements contains [A] (a1) ethylenic unsaturated carboxylic acid and/or ethylenic unsaturated carboxylic anhydride, (a2) a copolymer with an ethylenic unsaturated compound other than (a1), [B] a polymerized compound with ethylenic unsaturated bonds, and [C] a photopolymerization initiator. [C] The photopolymerization initiator is contained 0.1-5 in [B] 100 in weight. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition preferably used for simultaneously forming a projection and a spacer of a vertical alignment liquid crystal display element. SOLUTION: The radiation-sensitive resin composition for simultaneously forming the projection and the spacer of the vertical alignment liquid crystal display element contains: [A] (a1) unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride, (a2) a tetrahydrofuran frame, a furan frame, a tetrahydropyran frame, a pyran frame, an unsaturated compound containing at least one frame selected from a group of the frames denoted by formula (1) (in the formula (1), R is a hydrogen atom or a methyl group, and n is an integer of 2 to 10), and (a3) a copolymer obtained to copolymerize the other unsaturated compound except for components of (a1) to (a2); [B] a polymerization unsaturated compound; and [C] a radiation-sensitive polymerization initiator. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of faithfully reproducing the design size of a mask pattern with high sensitivity, excellent in adhesion to a substrate, making it possible to obtain a satisfactory spacer shape and thickness under an exposure energy of ≤150 mJ/cm 2 , and capable of forming spacers for a display panel excellent in strength, heat resistance, etc. SOLUTION: The radiation sensitive composition contains [A] a copolymer of (a1) an ethylenically unsaturated carboxylic acid and/or an ethylenically unsaturated carboxylic acid anhydride, (a2) an epoxy group-containing ethylenically unsaturated compound and (a3) another ethylenically unsaturated compound, [B] a polymerizable compound having an ethylenically unsaturated bond and [C] a photopolymerization initiator comprising a compound represented by formula (1) wherein one of R 1 and R 2 is an alkyl group, an alicyclic group, an oxygen-containing heterocyclic group, a nitrogen-containing heterocyclic group, an oxygen-containing heterocyclic group or a sulfur-containing heterocyclic group; and R 3 -R 6 each represent H or an alkyl group. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting composition suitable for forming an antihalation film which can effectively inhibit diffused reflection from a base substrate and has high transmittance of visible light and a high heat resistance. SOLUTION: The thermosetting composition contains a copolymer of a monomer mixture containing (a1) an epoxy group-containing unsaturated compound, (a2) a radiation-absorbing radically polymerizable compound and (a3) (a3-1) a polymerizable unsaturated carboxylic acid and/or a polymerizable unsaturated polycarboxylic acid anhydride or (a3-2) a polymerizable unsaturated compound having at least one structure chosen from an acetal ester structure of a carboxylic acid, a ketal ester structure of an carboxylic acid and a t-butyl ester structure of a carboxylic acid. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method which can remove easily the resist material and the planarizing material, without damaging an insulating film, after a fine pattern is formed in an interlayer insulating film of low permittivity on a substrate, in a manufacturing process of a semiconductor device. SOLUTION: In the manufacturing process of a semiconductor device, the process for removing the resist material and/or the planarizing material exfoliates them from the substrate 20 while leaving the insulating film 21 on the substrate 20, by integrating an adhesive member 1 in a body with the resist material and/or the planarizing material 26, after the resist material and/or the planarizing material 26 left on the substrate 20 after working of the interlayer insulating film 21 of low permittivity are covered with the adhesive member 1. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation and superior developability, excellent in adhesiveness to a substrate as well as in basic solid state properties as a resist, e.g. sensitivity, resolution and pattern shape, causing no development defects in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) a copolymer having repeating units of formula (1) [wherein R1-R3 are each H, a 1-4C alkyl, a monovalent O-containing polar group or a monovalent N-containing polar group; R4-R6 are each H, a 1-6C alkyl, a 1-6C alkoxy or a 2-7C alkoxycarbonyl; and (n) and (m) are each an integer of 0-2] as essential units and (B) a radiation sensitive acid generating agent.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation as a chemical amplification type positive type resist, excellent in basic solid state properties as the resist, e.g. sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin having a lactone ring structure of formula (1) [where (a) is an integer of 1-3; (b) is an integer of 0-9; and R1 is a monovalent organic group] and made alkali-soluble when the acid dissociable group is dissociated and (B) a radiation sensitive acid generating agent.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent particularly in pattern shape as a chemical amplification type resist and excellent also in balance of characteristics including sensitivity and resolution. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated, (B) a radiation sensitive acid generating agent and (C) a compound of formula 1, formula 2 or the like.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent in dry etching resistance, sensitivity, resolution, etc., as a chemical amplification type resist, capable of avoiding a change of the line width of a resist pattern due to a change of the time elapsed from exposure to post-exposure heating and having superior process stability. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin typified by copolymer of 8-methyl-8hydroxytetracyclo[4.4.0.12,5'.17,10]dodec-3-ene, itaconic anhydride and t-butyl (meth)acrylate and (B) a radiation sensitive acid generating agent. The resin A is made alkali-soluble when the acid dissociable group is dissociated.