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    Silane compound, polysiloxane and radiation sensitive resin composition
    3.
    发明专利
    Silane compound, polysiloxane and radiation sensitive resin composition 有权
    硅烷化合物，聚硅氧烷和辐射敏感性树脂组合物

    公开(公告)号：JP2006117621A

    公开(公告)日：2006-05-11

    申请号：JP2004310099

    申请日：2004-10-25

    Applicant: Jsr Corp ,  Jsr株式会社

    Inventor： NISHIMURA ISAO ,  SHIMOKAWA TSUTOMU ,  YAMAHARA NOBORU ,  SUGITA HIKARI ,  TANAKA MASATO ,  EGAWA HIROMI ,  SUGIE NORIHIKO

    IPC: C07F7/18 ,  C08G77/04 ,  G03F7/039 ,  G03F7/075 ,  H01L21/027

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition useful as a chemical amplifying type resist having especially high sensitivity, excellent in pattern formation and depth of focus (DOF), a polysiloxane useful as a resin component as the radiation sensitive resin composition and a silane compound useful as the synthetic raw material, etc., of the polysiloxane. SOLUTION: This silane compound is expressed by formula (I) [wherein, R is an alkoxy or the like; R 1 is H, F, a lower alkyl or the like; A is a divalent (substituted) hydrocarbon group; R 2 is a monovalent dissociative acid group]. The polysiloxane has a structural unit expressed by formula (1), or has the above structural unit and a structural unit expressed by formula (2). The radiation sensitive resin composition contains (A) the polysiloxane having the structural unit expressed by formula (1) and the structural unit expressed by formula (2), and (B) a radiation sensitive acid-forming agent. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：为了提供用作具有特别高的灵敏度，图案形成和焦深（DOF）优异的化学放大型抗蚀剂的辐射敏感性树脂组合物，可用作树脂组分的聚硅氧烷作为辐射敏感性 树脂组合物和可用作聚硅氧烷的合成原料等的硅烷化合物。 解决方案：该硅烷化合物由式（I）表示[其中，R是烷氧基等; R 1是H，F，低级烷基等; A是二价（取代）烃基; R 2 是一价离解酸基]。 聚硅氧烷具有由式（1）表示的结构单元，或具有上述结构单元和由式（2）表示的结构单元。 辐射敏感性树脂组合物含有（A）具有由式（1）表示的结构单元的聚硅氧烷和由式（2）表示的结构单元，和（B）辐射敏感性的酸形成剂。 版权所有（C）2006，JPO＆NCIPI

    Silane compound, polysiloxane and radioactive ray sensitive resin composition
    4.
    发明专利
    Silane compound, polysiloxane and radioactive ray sensitive resin composition 审中-公开
    硅烷化合物，聚硅氧烷和放射性敏感性敏感性树脂组合物

    公开(公告)号：JP2005139169A

    公开(公告)日：2005-06-02

    申请号：JP2004296459

    申请日：2004-10-08

    Applicant: Jsr Corp ,  Jsr株式会社

    Inventor： NISHIMURA ISAO ,  YAMAHARA NOBORU ,  TANAKA MASATO ,  SHIMOKAWA TSUTOMU

    IPC: G03F7/039 ,  C07F7/18 ,  C08G77/04 ,  G03F7/075 ,  H01L21/027

    Abstract: PROBLEM TO BE SOLVED: To obtain a new polysiloxane that is suitable as a resin component in chemically amplified resist particularly having excellent I-D bias and depth of focus (DOF), a new silane compound useful as a raw material for producing the polysiloxane, and a polysiloxane-containing radiation ray-sensitive resin composition. SOLUTION: The silane compound is represented by formula (I). The polysiloxane has a structural unit represented by formula (1) or has the unit (1) and a structural unit represented by formula (2) (wherein R is an alkyl, R 1 and R 2 are each fluorine atom, or a lower alkyl or a lower fluorinated alkyl, (n) and (m) are each 0 or 1, (k) is 1 or 2, (i) is an integer of 0 to 10). The radiation ray-sensitive resin composition contains the polysiloxane and a radiation ray sensitive acid-generating agent. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题为了获得适合作为特别是具有优异的ID偏压和深度聚焦（DOF）的化学放大型抗蚀剂中的树脂组分的新的聚硅氧烷，可用作生产聚硅氧烷的原料的新的硅烷化合物 和含聚硅氧烷的放射线敏感性树脂组合物。 硅烷化合物由式（I）表示。 聚硅氧烷具有由式（1）表示的结构单元或具有单元（1）和由式（2）表示的结构单元（其中R是烷基，R 1 SP＆lt; SP＆gt;和R SP＆ 2是各自的氟原子，或低级烷基或低级氟化烷基，（n）和（m）各自为0或1，（k）为1或2，（i）为0〜 10）。 放射线敏感性树脂组合物含有聚硅氧烷和放射线敏感性的酸产生剂。 版权所有（C）2005，JPO＆NCIPI

    RADIATION SENSITIVE RESIN COMPOSITION
    5.
    发明专利
    RADIATION SENSITIVE RESIN COMPOSITION 失效

    公开(公告)号：JP2001235864A

    公开(公告)日：2001-08-31

    申请号：JP2000046031

    申请日：2000-02-23

    Applicant: JSR CORP

    Inventor： DOUKI KATSUJI ,  YAMAHARA NOBORU ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

    IPC: G03F7/039 ,  C08K5/00 ,  C08K5/12 ,  C08L45/00 ,  C08L101/02 ,  G03F7/004 ,  H01L21/027

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent particularly in pattern shape as a chemical amplification type resist and excellent also in balance of characteristics including sensitivity and resolution. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated, (B) a radiation sensitive acid generating agent and (C) a compound of formula 1, formula 2 or the like.

    POLYSILOXANE
    7.
    发明专利
    POLYSILOXANE 审中-公开

    公开(公告)号：JP2002194085A

    公开(公告)日：2002-07-10

    申请号：JP2001300517

    申请日：2001-09-28

    Applicant: JSR CORP

    Inventor： IWAZAWA HARUO ,  YAMAHARA NOBORU ,  SHIMOKAWA TSUTOMU

    IPC: G03F7/039 ,  C08G77/26 ,  H01L21/027

    Abstract: PROBLEM TO BE SOLVED: To obtain a new polysiloxane, useful as a resin component, or the like, of a resist material, excellent in dryetching resistance, and also excellent in basic physical properties as resist such as a transparency to a radiation, sensibility, resolution and developing property. SOLUTION: This polysiloxane has a structural unit (I) and/or a structural unit (II) expressed by formula (1), and a polystylene-converted weight-average molecular weight of 500-1,000,000 (wherein, in formula (1), each R denotes independently hydrogen atom or methyl group, R' denotes hydrogen atom, methyl group or trifluoromethyl group, X denotes hydrogen atom or a monovalent acid-dissociative group, R" denotes hydrogen atom, a 1-20C hydrocarbon group, a monovalent 1-20C hydrocarbon halide group, a halogen atom or primary, a secondary or a tertiary amino group, and (n) is an integer of 0-3).

    RADIATION SENSITIVE RESIN COMPOSITION
    8.
    发明专利
    RADIATION SENSITIVE RESIN COMPOSITION 失效

    公开(公告)号：JP2002072484A

    公开(公告)日：2002-03-12

    申请号：JP2001108824

    申请日：2001-04-06

    Applicant: JSR CORP ,  IBM

    Inventor： NISHIMURA YUKIO ,  YAMAHARA NOBORU ,  YAMAMOTO MASASHI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU ,  ITO HIROSHI

    IPC: C08K5/00 ,  C08L33/06 ,  C08L35/00 ,  C08L45/00 ,  G03F7/004 ,  G03F7/039 ,  H01L21/027

    Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, having excellent basic properties as a resist, e.g. sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an acid dissociable group-containing resin having a structure of formula (1) (where R1 is H, a monovalent acid dissociable group, an alkyl having no acid dissociable group or an alkylcarbonyl having no acid dissociable group; X1 is a 1-4C linear or branched fluoroalkyl; and R2 is H, a linear or branched alkyl or a linear or branched fluoroalkyl) and (B) a radiation sensitive acid generating agent.

    RADIATION SENSITIVE RESIN COMPOSITION
    9.
    发明专利
    RADIATION SENSITIVE RESIN COMPOSITION 失效

    公开(公告)号：JP2001013688A

    公开(公告)日：2001-01-19

    申请号：JP2000128516

    申请日：2000-04-27

    Applicant: JSR CORP

    Inventor： YAMAHARA NOBORU ,  MURATA KIYOSHI ,  IWANAGA SHINICHIRO ,  ISHII HIROYUKI ,  IWAZAWA HARUO

    IPC: G03F7/039 ,  C08F232/00 ,  C08K5/00 ,  C08L33/14 ,  C08L35/00 ,  C08L45/00 ,  H01L21/027

    Abstract: PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin composition excellent in physical properties such as transparency to radiation, dry etching resistance, sensitivity and resolution, shelf stability and adhesion by incorporating a specified alkali- insoluble or slightly alkali-soluble resin which is made alkali-soluble when an acid dissociable group is dissociated and a radiation sensitive acid generating agent. SOLUTION: The radiation sensitive resin composition contains an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated and a radiation sensitive acid generating agent. The resin is selected from a copolymer having repeating units of formulae I, II and III-1 and a copolymer having repeating units of formulae I, II and III-2. In the formulae, A and B are each H or a

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