公开(公告)号：EP2780936A1

公开(公告)日：2014-09-24

申请号：EP12849914.2

申请日：2012-11-08

Applicant: Luxvue Technology Corporation

Inventor： BIBL, Andreas ,  HIGGINSON, John A. ,  LAW, Hung-Fai Stephen ,  HU, Hsin-Hua

IPC: H01L21/677 ,  H05K13/04 ,  H05K13/02 ,  B65G49/07 ,  B65G47/91

CPC classification number: H01L29/167 ,  B32B38/18 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2933/0066 ,  Y10T156/1153 ,  Y10T156/17 ,  Y10T156/1705 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  Y10T156/1911 ,  H01L2224/83 ,  H01L2924/00

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

公开(公告)号：EP2997564A1

公开(公告)日：2016-03-23

申请号：EP14734362.8

申请日：2014-06-09

Applicant: Luxvue Technology Corporation

Inventor： BIBL, Andreas ,  MCGRODDY, Kelly

IPC: G09F9/00 ,  H01L25/075 ,  H01L33/50

CPC classification number: H01L25/167 ,  G02F1/133603 ,  G02F1/133617 ,  G02F2001/133614 ,  G09F9/00 ,  G09G3/32 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/322 ,  H01L27/3246 ,  H01L33/38 ,  H01L33/50 ,  H01L33/501 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L51/5281 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.

Abstract translation: 描述了显示器和制造方法。 显示器可以包括包括像素阵列的基板，每个像素包括多个子像素，并且像素内的每个子像素被设计用于不同的颜色发射光谱。 每个子像素中安装有一组微型LED器件对，以提供冗余。 包含荧光体颗粒的波长转换层的阵列形成在微型LED器件对的阵列上，用于可调色彩发射光谱。

公开(公告)号：EP2780954A1

公开(公告)日：2014-09-24

申请号：EP12849508.2

申请日：2012-11-08

Applicant: Luxvue Technology Corporation

Inventor： HU, Hsin-Hua ,  BIBL, Andreas ,  HIGGINSON, John, A. ,  LAW, Hung-Fai, Stephen

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/36

Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.

公开(公告)号：EP2780953A1

公开(公告)日：2014-09-24

申请号：EP12849007.5

申请日：2012-11-08

Applicant: Luxvue Technology Corporation

Inventor： BIBL, Andreas ,  HIGGINSON, John A. ,  LAW, Hung-Fai Stephen ,  HU, Hsin-Hua

IPC: H01L33/36

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract translation: 描述了微发光二极管（LED）和形成用于转移到接收衬底的微型LED阵列的方法。 微LED结构可以包括微p-n二极管和金属化层，金属化层位于微p-n二极管和键合层之间。 共形电介质阻挡层可以跨越微p-n二极管的侧壁。 微型LED结构和微型LED阵列可被拾取并转移到接收基板。

公开(公告)号：EP2997608A1

公开(公告)日：2016-03-23

申请号：EP14736539.9

申请日：2014-06-09

Applicant: Luxvue Technology Corporation

Inventor： BIBL, Andreas ,  GRIGGS, Charles R.

IPC: H01L33/44

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

Abstract translation: 描述了将微型LED器件集成到发光器件中的发光器件和方法。 在一个实施例中，发光器件包括在堤层内的反射堤坝结构，以及位于堤层顶部并在反射堤岸结构上方升高的导电线。 微型LED器件在反射堤结构内，钝化层位于堤层之上，并且侧向围绕反射堤坝结构内的微型LED器件。 微型LED器件的一部分和在堤层顶部的导电线突出于钝化层的顶表面之上。

公开(公告)号：EP2973715A1

公开(公告)日：2016-01-20

申请号：EP14769046.5

申请日：2014-03-06

Applicant: Luxvue Technology Corporation

Inventor： BIBL, Andreas ,  SAKARIYA, Kapil V. ,  GRIGGS, Charles R. ,  PERKINS, James Michael

IPC: H01L27/32 ,  H01L51/52

CPC classification number: H01L25/0753 ,  H01L24/95 ,  H01L27/1214 ,  H01L27/1259 ,  H01L33/0095 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

公开(公告)号：EP2847789A1

公开(公告)日：2015-03-18

申请号：EP13788027.4

申请日：2013-05-01

Applicant: Luxvue Technology Corporation

Inventor： BIBL, Andreas ,  HIGGINSON, John A. ,  HU, Hsin-Hua

IPC: H01L21/677 ,  H01L21/50 ,  B65G49/07

CPC classification number: B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

公开(公告)号：EP2780934A1

公开(公告)日：2014-09-24

申请号：EP12850366.1

申请日：2012-11-07

Applicant: Luxvue Technology Corporation

Inventor： BIBL, Andreas ,  HIGGINSON, John A. ,  LAW, Hung-Fai Stephen ,  HU, Hsin-Hua

IPC: H01L21/58 ,  H01L21/677 ,  H05K13/04

CPC classification number: H01L24/83 ,  B32B37/025 ,  B32B37/06 ,  B32B2457/20 ,  H01L21/67144 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L24/97 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  Y10T156/1153 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  H01L2224/83 ,  H01L2924/00

Abstract: A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.

Abstract translation: 公开了一种微器件转印头和头阵列。 在一个实施例中，微器件转移头包括基底，具有侧壁的台面结构，形成在台面结构之上的电极和覆盖电极的电介质层。 可以向微器件转移头和头阵列施加电压以从载体衬底拾取微器件，并将微器件释放到接收衬底上。