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    LASER POWER CONTROL ARRANGEMENTS IN ELECTRO-OPTICAL READERS
    42.
    发明申请
    LASER POWER CONTROL ARRANGEMENTS IN ELECTRO-OPTICAL READERS 审中-公开
    电光读取器中的激光功率控制装置

    公开(公告)号：WO2008039963A3

    公开(公告)日：2008-08-07

    申请号：PCT/US2007079815

    申请日：2007-09-28

    Applicant: SYMBOL TECHNOLOGIES INC ,  GUREVICH VLADIMIR ,  ZHANG HENG ,  TSI-SHI DAVID

    Inventor： GUREVICH VLADIMIR ,  ZHANG HENG ,  TSI-SHI DAVID

    IPC: G06K7/10

    CPC classification number: G06K7/10584

    Abstract: Laser power control arrangements interrupt power to a laser used in electro-optical readers upon detection of operating conditions not conforming to preestablished standards, and adjust power to enhance reader performance without violating prevalent safety standards. Dual monitors are used to independently monitor the output power of the laser.

    Abstract translation: 激光功率控制装置在检测到不符合预先建立的标准的工作条件时，中断电光读取器中的激光的电源，并且在不违反普遍安全标准的情况下调整功率以提高读取器性能。 双显示器用于独立监控激光器的输出功率。

    AXICON-BASED IMAGING LENS ASSEMBLY IN IMAGING READER
    43.
    发明申请
    AXICON-BASED IMAGING LENS ASSEMBLY IN IMAGING READER 审中-公开
    基于AXICON的成像镜头组件成像读取器

    公开(公告)号：WO2008016508A3

    公开(公告)日：2008-05-22

    申请号：PCT/US2007016592

    申请日：2007-07-23

    Applicant: SYMBOL TECHNOLOGIES INC

    Inventor： GUREVICH VLADIMIR ,  VINOGRADOV IGOR ,  SHI DAVID TSI

    IPC: G06K7/10

    CPC classification number: G06K7/10702

    Abstract: An imaging lens assembly focuses light from indicia in a working range of distances along an optical path onto a solid-state imager of an imaging reader. The lens assembly includes an axicon and an aperture stop that together are operative for extending the working range.

    Abstract translation: 成像透镜组件将来自沿着光路的距离的工作范围中的标记的光聚焦到成像读取器的固态成像器上。 该镜头组件包括一个轴棱镜和一个孔径光阑，它们一起用于延伸工作范围。

    SCAN MODULE
    45.
    发明申请
    SCAN MODULE 审中-公开
    扫描模块

    公开(公告)号：WO2006096336A2

    公开(公告)日：2006-09-14

    申请号：PCT/US2006006304

    申请日：2006-02-21

    Applicant: SYMBOL TECHNOLOGIES INC ,  SHEPARD HOWARD ,  DRZYMALA MARK ,  BARKAN EDWARD ,  ZHANG HENG ,  GUREVICH VLADIMIR

    Inventor： SHEPARD HOWARD ,  DRZYMALA MARK ,  BARKAN EDWARD ,  ZHANG HENG ,  GUREVICH VLADIMIR

    IPC: G06K7/10

    CPC classification number: G06K7/10702 ,  G06K7/10633 ,  G06K7/10653 ,  G06K7/10683

    Abstract: ABSTRACT Methods and apparatus for providing a relatively miniature scan module, for example, a small retroreflective scan engine. An exemplary scan module comprises a chassis, a drive coil, a scan motor, a laser, a mirror module and a sensor. The mirror module can comprise, in an embodiment, a single piece fold/collection mirror module. Additionally, in an embodiment, the scan motor can comprise a molded spring module.

    Abstract translation: 摘要用于提供相对微型扫描模块的方法和装置，例如小型回射式扫描引擎。 示例性扫描模块包括底盘，驱动线圈，扫描马达，激光，镜模块和传感器。 在一个实施例中，镜模块可以包括单件折叠/收集镜模块。 另外，在一个实施例中，扫描电机可以包括模制弹簧模块。

    Scan module for optical scanner
    48.
    发明公开
    Scan module for optical scanner 失效
    为光检拾的扫描模块

    公开(公告)号：EP0731417A3

    公开(公告)日：1998-10-21

    申请号：EP96301314

    申请日：1996-02-27

    Applicant: SYMBOL TECHNOLOGIES INC

    Inventor： STERN MIKLOS ,  KATZ JOSEPH ,  CAMPANELLI JOSEPH ,  DVORKIS PAUL ,  METLITSKY BORIS ,  GUREVICH VLADIMIR ,  KRICHEVER MARK ,  MCGLYNN DANIEL R

    IPC: G06K7/10 ,  H01S5/183 ,  H01S5/42

    CPC classification number: G06K7/10742 ,  G06K7/10574 ,  G06K7/10643 ,  G06K7/10722 ,  G06K7/10811 ,  H01S5/423

    Abstract: An integrated optical module for an optical scanner has a lens (24) spaced from a vertical-cavity surface-emitting laser (VCSEL) (28) by a spacer (62). The module, in an alternative embodiment, may include a wafer frame (12), a suspended mirror (14) mounted for oscillation on the frame, a wafer substrate (108) bonded beneath the frame and a wafer cover (109) bonded above the frame. The cover includes a mirror travel stop (116) to protect the mirror against shock. A VCSEL mounted to the wafer cover produces a beam which is shaped and deflected by a diffractive optical element (22,24) onto the oscillating mirror. The reflected beam passes out of the module toward an indicia to be read. Large numbers of such devices may be fabricated relatively cheaply using wafer-scale processing and assembly technology. Three large wafers (1100,1102,1104) are fabricated corresponding respectively to arrays of substrates, frames and covers. The large wafers are bonded together in a sandwich arrangement, and are then diced to produce the individual scan modules. The modules may provide either one-dimensional or two-dimensional scanning.

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