PASSIVATION FILM FOR MOS SEMICONDUCTOR DEVICE USE

    公开(公告)号:JPH02302065A

    公开(公告)日:1990-12-14

    申请号:JP12408289

    申请日:1989-05-16

    Abstract: PURPOSE:To stabilize a leakage current, to prevent a wiring part from being corroded and to prevent a crack of an interlayer insulating film, at low costs, by a method wherein a passivation film is composed of a polyimide which is provided with a main dispersion (alpha dispersion) by measuring its dynamic viscoelasticity and with a subdispersion (beta dispersion) caused at a temperature lower than that at the main dispersion and whose temperature at the beta dispersion is a post-curing temperature or lower of a sealing resin. CONSTITUTION:A polyimide used as a passivation film is composed of a polyimide which is provided with a main dispersion (alpha dispersion) by measuring its dynamic viscoelasticity and with a subdispersion (beta dispersion) caused at a temperature lower than that at said main dispersion and whose temperature at the dispersion is a post- curing temperature or lower of a sealing resin; preferably, a specific tetracarboxylic acid and a specific diamine compound are combined selectively; they react in a polar solvent to form a varnish; after that, a semiconductor chip is coated with this varnish. A peak of a loss modulus by the beta dispersion means that a stress is relaxed in this temperature region; a temperature of this leak lowers a post-curing temperature of the sealing resin; it ispossible to relax a strain caused at a molding operation while the sealing resin is post-cured.

    SURFACE-MOUNTING TYPE RESIN-SEALED SEMICONDUCTOR DEVICE

    公开(公告)号:JPH02302064A

    公开(公告)日:1990-12-14

    申请号:JP12408189

    申请日:1989-05-16

    Abstract: PURPOSE:To prevent a resin crack without executing a specific treatment before a surface mounting operation by a method wherein a polyimide which forms a stress-absorbing film is provided with a main dispersion by measuring its dynamic viscoelasticity and with a subdispersion which is caused at a temperature lower than that at the main dispersion. CONSTITUTION:An integrated circuit is formed on a semiconductor substrate such as a silicon substrate or a gallium arsenide substrate; a passivation film such as, e.g. silicon nitride of an inorganic film is formed on its surface in order to prevent moisture and an ion component from creeping from the outside. A polyimide which forms a stress-absorbing film is provided with a main dispersion (alpha dispersion) by measuring its dynamic viscoelasticity and with a subdispersion (beta dispersion) which is caused at a temperature lower then that at the main dispersion; the temperature of the beta dispersion is a post-curing temperature or lower of a sealing resin. When a peak temperature is made lower than the post-curing temperature of the sealing resin, it is possible to relax a strain which is caused at a molding operation while the sealing resin is post-cured.

    PRODUCTION OF WATERLESS PLANOGRAPHIC PRINTING PLATE

    公开(公告)号:JPH01158451A

    公开(公告)日:1989-06-21

    申请号:JP21281188

    申请日:1988-08-26

    Abstract: PURPOSE:To permit utilization of a waterless planographic printing plate for negative working as the printing plate for positive working as well by using a light source which has no transparent plate for shielding UV rays on the plate surface and projecting active rays contg. UV rays of a specific wavelength to the printing plate. CONSTITUTION:A planographic printing master disk is subjected to image exposing by using the light source having no transparent plate for shielding UV rays and projecting the active rays contg. the UV rays of

    PROCESSING SOLUTION FOR PROCESSING WATERLESS PLANOGRAPHIC PLATE

    公开(公告)号:JPS63217353A

    公开(公告)日:1988-09-09

    申请号:JP5016487

    申请日:1987-03-06

    Abstract: PURPOSE:To prolong the service life of a processing soln. for a waterless planographic plate obtd. by laminating a photosensitive layer contg. a substance contg. the structure of quinone diazide as a constituent and a silicone ribber layer on a supporting body by adding a quat. phosphonium compd. represented by a specified formula to the processing soln. CONSTITUTION:A quat. phosphonium compd. represented by the formula (where each of R1-R4 may be the same or different with each other, and is 1-15C alkyl, aryl or aralkyl group and Hal is halogen atom) is added to a processing soln. for a waterless planographic plate obtd. by successively laminating a photosensitive layer contg. a substance ontg. the structure of quinone diazide as a constituent and a silicone rubber layer on a supporting body. The quat. phosphonium chloride has high compatibility with a processing solvent such as water or alcohol used in the processing soln., superior stability and low toxicity. In the formula, each of R1-R4 is preferably 1-10C, especially preferably 1-7C alkyl, aryl or aralkyl group. Unlike amine the effective component in the processing soln. is hardly consumed, so the service life of the processing soln. is considerably prolonged.

    PRINTING PRESS
    45.
    发明专利

    公开(公告)号:JPS63130392A

    公开(公告)日:1988-06-02

    申请号:JP27770986

    申请日:1986-11-20

    Abstract: PURPOSE:To enhance mountability of a printing plate onto a plate cylinder, to prevent partial elongation or positional deviations from occurring and thereby to enhance the accuracy of a printing position and dimensional accuracy, by providing a coated film of a silicone rubber obtained by crosslinking a linear diorganopolysiloxane having a specified number average molecular weight in a specified film thickness on the peripheral surface of the plate cylinder. CONSTITUTION:A coated film of a silicone rubber obtained by crosslinking a linear diorganopolysiloxane having a number average molecular weight of 3,000-40,000 is provided in a film thickness of 0.5-50mum on the surface of a plate cylinder. The surface of the film has a 180 deg. peel strength controlled to within the range of 0.1-3g/cm, whereby both of contradictory characteristics of the adhesion between the plate cylinder and a printing plate and the releasability of the printing plate at the time of dismounting the plate can be obtained. If the film thickness is less than 0.5mum, nonuniform coating or the like is liable to occur, and it is impossible to obtain a stable pressure sensitive adhesive surface. If the film thickness exceeds 50mum, the durability in a slipping direction is decreased with an increase in the film thickness, thereby impairing accuracy of printing.

    INK COMPOSITION FOR WATER-FREE LITHO PRINTING

    公开(公告)号:JPS6225182A

    公开(公告)日:1987-02-03

    申请号:JP16395485

    申请日:1985-07-26

    Abstract: PURPOSE:The titled composition having improved scomming resistance, containing a modified phenolic resin obtained by reacting an alpha,beta-unsaturated dicarboxylic acid derivative with a rosin modified phenolic resin. CONSTITUTION:The aimed ink composition containing a modified phenolic resin obtained by reacting (A) 100pts.wt. rosin modified phenolic resin with (B) 0.5-100pts.wt. alpha,beta-unsaturated dicarboxylic acid derivative containing one or more hydroxyl groups, carboxyl groups or epoxy groups in (C) a (semi)drying oil component.

    DEVELOPING SOLUTION FOR USE IN LITHOGRAPHIC PLATE REQUIRING NO DAMPENING WATER

    公开(公告)号:JPS5713448A

    公开(公告)日:1982-01-23

    申请号:JP8779580

    申请日:1980-06-30

    Abstract: PURPOSE:To obtain a lithographic plate superior in reproducibility of fine dots in a short developing time, and small in numbers of scratches, defects, etc., by adding a propylene oxide derivative to the developing solution for use in the lithographic plate in the title. CONSTITUTION:A propylene oxide derivative, such as polypropylene oxide, 0.1- 100pts.wt. is contained in a 100pts.wt. developing solution used for the developing step of a lithographic plate requiring no dampening water using a silicone rubber layer as an ink-repelling layer. For example, a solvent consisting of a paraffinic hydrocarbon, such as pentane or hexane is used and the propylene oxide derivative is added to this solvent to give the developing solution. Appliction of this developing solution permits developing performance to be enhanced, and a printing plate capable of reproducing even extremely fine dots easily in a time shorter than that required for the conventional method.

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