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公开(公告)号：JPH04160705A
公开(公告)日：1992-06-04
申请号：JP28467590
申请日：1990-10-22
Applicant: TORAY INDUSTRIES
Inventor： NAKAWA TAKAHIRO , ITO NOBUAKI
Abstract: PURPOSE:To improve heat resistance, humidity characteristic and strength, and prevent tearing and breaking of the film by including soft aromatic polyamide B at a specified ratio against the total quantity of aromatic polyamide A, B, and furthermore, including inorganic at a specified ratio. CONSTITUTION:In the film made of hard aromatic polyamide A and soft aromatic polyamide B of para-orientation group and inorganic filler having a high dielectric constant, the soft aromatic polyamide B at 2-40wt.% against the total quantity of the aromatic polyamide A, B is included, and the inorganic filler having a high dielectric constant at a ratio more than 30wt.% is included in the film. While such a trouble as excellent heat resistance and mechanical characteristic are thereby maintained, as tearing and breaking of the film or the like is solved, and the excellent characteristic for a capacitor is obtained.
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公开(公告)号：JPH047130A
公开(公告)日：1992-01-10
申请号：JP10982190
申请日：1990-04-24
Applicant: TORAY INDUSTRIES
Inventor： KUROME TAIICHI , ITO NOBUAKI
Abstract: PURPOSE:To obtain industrially a film-excellent in dimensional stability at high temperature by post-treating the aromatic polyamide film with specified thermal characteristics under the condition of specified heat treatment. CONSTITUTION:In order to prevent the flatness of a film from being deteriorated in heat treatment, the aromatic polyamide film which has at most 3.0% of heat-shrinkable ratio and at most 4.5X10 (1/ deg.C) of the thermal expansion coefficient, and is continuously produced, is used, and low heat shrinkable ratio is obtained by the post-treatment under the condition of the heat treatment defined by formulas 1, 2, 3. As the method of heat treatment, the heating method in which a long film in continuously run through the heating furnace such as the dryer of a coating device and is heated, and the heating method in which the film wound up in a roll-shape is directly put and heated in a hot blast oven, etc., are used. Then the tension of the film must be at most 0.5 (kg/mm ). Thus the obtained aromatic polyamide film has sufficient dimensional stability at the temperature of reflow solder as flow solder etc., and it is preferably used as electric insulating material, especially as material for FPC.
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公开(公告)号：JPH03227290A
公开(公告)日：1991-10-08
申请号：JP2280390
申请日：1990-02-01
Applicant: TORAY INDUSTRIES
Inventor： ITO NOBUAKI , NAKAWA TAKAHIRO , OWADA JUN
Abstract: PURPOSE:To provide excellent economy and a high speed printing by providing an ink layer on a film made of aromatic polyamide resin, soluble resin, and conductive filler. CONSTITUTION:An ink layer is provided on a film made of aromatic polyamide resin, soluble resin and conductive filler. The polyamide resin desirably contains polymer containing 50mol% or more desirably 70mol% of repetition structure unit of predetermined composition. The soluble resin is not particularly limited if it dissolved 1wt.% or more of solvent for dissolving the polyamide resin, and desirably amide solvent such as N-methylpryrrolidone or resin dissolved 1wt.% or more in dimethylacetamide. The soluble resin is desirably, for example, polycarbonate, polyethersulfon, polyarylate. The filler is not particularly limited if it has electric conductivity, but carbon black is desirable in view of mutual solubility, dispersibility with the resin and further economy.
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公开(公告)号：JPH0344905B2
公开(公告)日：1991-07-09
申请号：JP15515882
申请日：1982-09-08
Applicant: TORAY INDUSTRIES
Inventor： ASAKURA TOSHUKI , KOBAYASHI HIROAKI , ITO NOBUAKI
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公开(公告)号：JPH03114830A
公开(公告)日：1991-05-16
申请号：JP25618489
申请日：1989-09-29
Applicant: TORAY INDUSTRIES
Inventor： ITO NOBUAKI , KUROME TAIICHI
Abstract: PURPOSE:To enhance the durability and running properties of a film by incorporating inert particles in an aromatic polyamide film or in an aromatic polyimide film and specifying the relationship between the size of the particles and layer thereof, the content of the particles, and the thickness of the layer. CONSTITUTION:The title film is a laminated film comprising an aromatic polyamide or an aromatic polyimide, and the film has an A layer containing inert particles, which is laminated on at least one surface of a B layer of the film. It is specified that the average particle diameter of the inert particles contained in the A layer is 0.1 to 10 times the thickness of the A layer, the content of the particles in the A layer is 0.5 to 50wt.%, and the A layer has a thickness of 0.005 to 3mum. By this method, a film whose surface is hardly flawed and having excellent running and handling properties under the conditions of a high temperature and high humidity can be obtained.
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Patent Agency Ranking
公开(公告)号：JPH02280106A
公开(公告)日：1990-11-16
申请号：JP10201989
申请日：1989-04-21
Applicant: TORAY INDUSTRIES
Inventor： KUROME TAIICHI , ITO NOBUAKI
IPC: G02B6/44
Abstract: PURPOSE:To obtain a low-cost optical fiber cable having superior heat resistance and superior characteristics at low temp. by using a specified arom. polyamide film as a heat resistant film for a coating layer. CONSTITUTION:A coating layer made of a heat resistant film is formed around an assembly composed of coated single- or multi-core optical fibers, a buffer layer and bodies having high tensile strength. The heat resistant film is an arom. polyamide film having 2-20mum thickness, / deg.C coefft. of thermal expansion in the longitudinal direction and
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公开(公告)号：JPH02279331A
公开(公告)日：1990-11-15
申请号：JP10299389
申请日：1989-04-20
Applicant: TORAY INDUSTRIES
Inventor： KUROME TAIICHI , ITO NOBUAKI
IPC: B32B15/08 , B32B15/088 , B32B27/34 , H05K1/03 , H05K3/38
Abstract: PURPOSE:To increase the adhesion between an aromatic polyamide film and a copper membrane layer and to reduce a curl by using an aromatic polyamide film having specific surface roughness (Rp), a specific coefficient of thermal expansion and a specific contact angle of water. CONSTITUTION:At least the single surface of an aromatic polyamide film whose coefficient of thermal expansion is 1.0X10 - 4.0X10 (1/ deg.C) has surface roughness (Rp) of 0.01 - 0.5mum and a contact angle of water of 70 deg. or less a copper membrane layer is laminated to this surface. The surface roughness (Rp) means the max. distance from the center line wherein the unevenness of a surface is averaged to the apex of a surface projection. By this method, a copper deposited aromatic polyamide film high in the adhesion of a copper vapor deposition layer and free from curl can be obtained.
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公开(公告)号：JPH02164592A
公开(公告)日：1990-06-25
申请号：JP31928088
申请日：1988-12-16
Applicant: TORAY INDUSTRIES
Inventor： ITO NOBUAKI
Abstract: PURPOSE:To improve heat resistance and the stabilities of electric characteristics by forming a film having specific surface resistivity and shrinkage stress from an aromatic polyamide or polyimide resin and a conductive filler. CONSTITUTION:A conductive filler is dispersed in a polymer-soluble solvent and this dispersion is added to and mixed with a solvent having an aromatic polyamide or polyimide resin dissolved therein to prepare a film forming raw solution. This raw solution is formed into a film according to a dry/wet method, a dry method or a wet method while the film is biaxially stretched to obtain a conductive film having surface resistivity RSO of 10 -10 OMEGA, surface resistivity RS after heating at 350 deg.C of 0.7 or less and a thickness of 2-30mum. An ink layer is provided to one surface of this conductive film to form a transfer material for thermal recording.
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公开(公告)号：JPH01186381A
公开(公告)日：1989-07-25
申请号：JP1149188
申请日：1988-01-21
Applicant: TORAY INDUSTRIES
Inventor： ITO NOBUAKI , KOBAYASHI HIROAKI , KUROME TAIICHI
Abstract: PURPOSE:To prevent sticking and the stain of a head by a method wherein, the chloroform extraction amount of a film made of a specific substance containing a specific amount of carbon black is determined to be less than or equal to a specific value, and a surface roughness and a shrinkage stress are determined to be specific values. CONSTITUTION:In an aromatic polyamide film or aromatic polyimide film containing 10-40wt.% carbon black, an extraction amount E extracted by a chloroform is 0.5wt.% or less, and a surface roughness Ra of a head-side film surface is in the range of a formula (1). Furthermore, the shrinkage stress of the film is 2kg/mm or less at 100-250 deg.C. A thermal recording transfer body using this film as a substrate and having an ink layer all over the surface eliminates the possibility or problems, such as sticking and head-staining.
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公开(公告)号：JP2003200542A
公开(公告)日：2003-07-15
申请号：JP2002000556
申请日：2002-01-07
Applicant: TORAY INDUSTRIES
Inventor： HORIUCHI MITSUHIRO , TSUKUDA AKIMITSU , ITO NOBUAKI
Abstract: PROBLEM TO BE SOLVED: To provide an aromatic polyamide film showing uniform surface characteristics and an improvement of the shape of the film wound in a roll and the suppression of a generated foreign substance to a minimum level at the time of recycling the film, and a magnetic recording medium showing outstanding output characteristics. SOLUTION: This aromatic polyamide film has a thin resin film with a surface sulfur concentration S/C of 0.003 or less as measured by an X-ray electron spectroscopy on a protuberance forming face and 1×10 6 to 1×10 8 pieces/mm 2 of the protuberance consisting of a particle having an average particle diameter of 10 to 100 nm. In addition, this film shows that the ratio of a mean roughness RaA (nm) of a central area at a scan range angle of 2 μm measured by an interatomic force microscope (AFM) to a mean roughness RaB (nm) of a central area at a scan range angle of 30 μm, satisfies formula (1): 0.5≤RaA/ RaB≤1.0...(1). COPYRIGHT: (C)2003,JPO
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