POSITIVE TYPE PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION

    公开(公告)号:JP2000298341A

    公开(公告)日:2000-10-24

    申请号:JP10685599

    申请日:1999-04-14

    Abstract: PROBLEM TO BE SOLVED: To enable development with an aqueous alkali solution and to attain a very high rate of a residual film by incorporating a polymer having specified structural units as a main component and a specified quinonediazido compound. SOLUTION: The positive type photosensitive resin precursor composition contains a polymer having a structural unit of formula I as a main component and a quinonediazido compound of formula II. In the formula I, R1 is a >=2C di- to octavalent organic group, R2 is a >=2C di- to hexavalent organic group, R3 is H or a 1-20C organic group, (n) is an integer of 10-10,000, (m) is an integer of 0-2 and (p) and (q) are each an integer of 0-4. In the formula II, R4 and R6 are each a 1-20C monovalent organic group, R5 is a >=2C di- to octavalent organic group and b+d and c+e are each an integer of 0-4.

    PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION

    公开(公告)号:JP2000194133A

    公开(公告)日:2000-07-14

    申请号:JP28654699

    申请日:1999-10-07

    Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive resin precursor composition developable in alkali in a short time and small in erosion due to development in unexposed areas by incorporating polymer composed essentially of a specified structural units and at least one of specified quinone diazide compounds. SOLUTION: The color photosensitive resin composition contains the polymer composed essentially of structural units represented by formula I and at least one of the quinonediazide compounds each represented by formula II and in formulae I and II, R1 is a >=2C divalent organic group; R2 is a >=2C 3- to 6- valent organic group; (n) is an integer of 1-100,000; (m) is 0, 1, or 2; (q) is an integer of 1-4; (x) is 0, 1, or 2; and all of plural Q are not an H atom at the same time.

    POSITIVE PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION AND PROCESS FOR PRODUCING THE SAME
    46.
    发明公开
    POSITIVE PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION AND PROCESS FOR PRODUCING THE SAME 有权
    PRE一种感光性树脂组合物和方法及其

    公开(公告)号:EP1037112A4

    公开(公告)日:2002-12-18

    申请号:EP99940701

    申请日:1999-09-07

    CPC classification number: G03F7/0233 C08G73/1025 C08L79/08

    Abstract: A positive photosensitive resin precursor composition characterized by comprising (a) a polymer consisting mainly of structural units bonded to each other in the manner shown by general formula (1) and (b) a photo-acid generator, being capable of forming a pattern through light irradiation and subsequent development, and having a total carboxyl group content of 0.02 to 2.0 mmol per g of the polymer. It provides a photosensitive resin composition which is capable of alkali development and is highly sensitive. (R represents a tri- to octavalent C2+ organic group; R represents a di- to hexavalent C2+ organic group; R represents hydrogen or a C1-20 organic group; n is an integer of 3 to 100,000; m is 1 or 2; and p and q each is an integer of 0 to 4, provided that p+q>0).

    Abstract translation: 本发明涉及一种正型感光性树脂前体组合物的所有其特征DASS它含有(a)聚合物,其中主要组分包括其中结构单元之间的键合是通过通式种结构单元(1)和 (b)中光产酸剂,和它可形成由包含在所述聚合物光照射和随后的显影,并且总羧基的图案是从0点02至2.0毫摩尔/ g,且它提供了高灵敏度后者可以是感光性树脂组合物 碱开发。 (R <1>是化合价的有机基团3至8个具有至少2个碳原子,R <2>是化合价的有机基团的2至6具有至少2个碳原子,R <3> 是氢或有机基团具有1至20个碳原子。N + q为> 0至3的整数值至100,000,m是1或2,p和q是从0的值至4的整数且p)

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