Abstract:
PROBLEM TO BE SOLVED: To enable development with an aqueous alkali solution and to attain a very high rate of a residual film by incorporating a polymer having specified structural units as a main component and a specified quinonediazido compound. SOLUTION: The positive type photosensitive resin precursor composition contains a polymer having a structural unit of formula I as a main component and a quinonediazido compound of formula II. In the formula I, R1 is a >=2C di- to octavalent organic group, R2 is a >=2C di- to hexavalent organic group, R3 is H or a 1-20C organic group, (n) is an integer of 10-10,000, (m) is an integer of 0-2 and (p) and (q) are each an integer of 0-4. In the formula II, R4 and R6 are each a 1-20C monovalent organic group, R5 is a >=2C di- to octavalent organic group and b+d and c+e are each an integer of 0-4.
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin precursor composition developable in alkali in a short time and small in erosion due to development in unexposed areas by incorporating polymer composed essentially of a specified structural units and at least one of specified quinone diazide compounds. SOLUTION: The color photosensitive resin composition contains the polymer composed essentially of structural units represented by formula I and at least one of the quinonediazide compounds each represented by formula II and in formulae I and II, R1 is a >=2C divalent organic group; R2 is a >=2C 3- to 6- valent organic group; (n) is an integer of 1-100,000; (m) is 0, 1, or 2; (q) is an integer of 1-4; (x) is 0, 1, or 2; and all of plural Q are not an H atom at the same time.
Abstract:
A display device having a polyimide insulating layer is disclosed. The display device has a first electrode formed on a substrate, the polyimide insulating layer formed on the first electrode in such a way that the first electrode is partially exposed, and a second electrode facing the first electrode, wherein the polyimide insulating layer is a positive-type photosensitive polyimide.
Abstract:
A positive photosensitive resin precursor composition characterized by comprising (a) a polymer consisting mainly of structural units bonded to each other in the manner shown by general formula (1) and (b) a photo-acid generator, being capable of forming a pattern through light irradiation and subsequent development, and having a total carboxyl group content of 0.02 to 2.0 mmol per g of the polymer. It provides a photosensitive resin composition which is capable of alkali development and is highly sensitive. (R represents a tri- to octavalent C2+ organic group; R represents a di- to hexavalent C2+ organic group; R represents hydrogen or a C1-20 organic group; n is an integer of 3 to 100,000; m is 1 or 2; and p and q each is an integer of 0 to 4, provided that p+q>0).