GLASS PROTECTING FILM
    42.
    发明专利

    公开(公告)号:JP2003236995A

    公开(公告)日:2003-08-26

    申请号:JP2002352282

    申请日:2002-12-04

    Abstract: PROBLEM TO BE SOLVED: To provide a glass protecting film suitable for glass protecting applications, especially for the protection of display glass of a flat display, etc. SOLUTION: The glass protecting film has a multi-layer structure of at least two thermoplastic resin layers 3% or below in haze and 40°C or below in difference in glass transition temperatures. The impact strength of the film is 8-40 J. COPYRIGHT: (C)2003,JPO

    FINE BUBBLE-CONTAINING FILM
    43.
    发明专利

    公开(公告)号:JP2003136619A

    公开(公告)日:2003-05-14

    申请号:JP2001334888

    申请日:2001-10-31

    Abstract: PROBLEM TO BE SOLVED: To provide a fine bubble-containing film which has excellent handleability and a high folding wrinkle resistance, excellent whiteness, reflectivity, smoothness, cushionability and the like and which is suitably used as a print accepting base, a light source reflecting member or the like. SOLUTION: The fine bubble-containing film comprises fine bubbles therein. The film comprises three or more fine bubble layers, layers for isolating the bubble layers in such a manner that the layers are alternatively laminated in a thickness direction.

    METHOD FOR HEATING THERMOPLASTIC RESIN SHEET OR METHOD FOR HEATING AND ORIENTING, AND MANUFACTURE OF THE SHEET

    公开(公告)号:JPH11320577A

    公开(公告)日:1999-11-24

    申请号:JP13964298

    申请日:1998-05-21

    Abstract: PROBLEM TO BE SOLVED: To stably heat without staining or damaging a surface of a metal roll or without sticking a thermoplastic resin melt sheet by using the roll made of a metal as a surface material heated to a surface temperature of a glass transition temperature or higher of the sheet in the case of heating the sheet. SOLUTION: In the case of heating a thermoplastic resin melt sheet, the sheet is heated by a metal roll of a metal as a surface material heated to a surface temperature of a glass transition temperature Tg1 or higher of a thermoplastic resin. At this time, a material of the roll is selected from an iron, copper, aluminum, stainless steel or the other. A gas is contained in the resin having a glass transition temperature of Tg0 , and a thermoplastic resin sheet in which the transition temperature is lowered to the Tg1 may be used. At this time, the gas is selected from a carbonic acid gas, oxygen, nitrogen, air and their mixture gases. Further, an orienting temperature of the resin sheet is set to a range of Tg1 to Tg0 , and the sheet may be heated or oriented.

    MANUFACTURE OF THERMOPLASTIC RESIN FILM

    公开(公告)号:JPH11216759A

    公开(公告)日:1999-08-10

    申请号:JP2312798

    申请日:1998-02-04

    Abstract: PROBLEM TO BE SOLVED: To improve moldability of the end part of a cast film in case of film formation of a biaxially oriented film, to decrease fluctuation of physical properties in the neighborhood of the end part of the biaxially oriented film, and to improve productivity by remarkable improvement of film forming speed. SOLUTION: After a molten state thermoplastic resin sheet is molded in such a way that heat transfer coefficient (he) on the end part of the thermoplastic resin sheet and heat transfer coefficient (hc) of the central part of the sheet satisfy the formula 0.36

    EPOXY RESIN COMPOSITION AND CURING AGENT

    公开(公告)号:JPH0812746A

    公开(公告)日:1996-01-16

    申请号:JP9818495

    申请日:1995-04-24

    Abstract: PURPOSE:To obtain a strain-free molding having a low coefficient of thermal expansion, being freed from cracks, and having a high dimensional accuracy because of small molding shrinkage by mixing an epoxy resin with a cured product comprising an aromatic dicarboxylic compound and/or an aromatic dihydroxy compound and forming a liquid crystal in curing. CONSTITUTION:The epoxy resin (A) is a compound represented by formula I, forms a liquid crystal in curing, and is exemplified by a cresol novolak epoxy resin. The curing agent (B) is an aromatic dicarboxylic compound represented by formula II or an aromatic dihydroxy compound represented by formula III. The filler (C) is added in an amount of 60-95vol.% based on the whole epoxy resin composition. The reinforcement (D) (e.g. crystalline silica) is added in an amount of 30-70vol.% based on the whole epoxy resin composition. It is desirable that the mixing ratio of component A to component B be in the range of 0.7-1.3 in terms of chemical equivalent ratio. A curing catalyst may also be used.

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