公开(公告)号：JPH0466901B2

公开(公告)日：1992-10-26

申请号：JP8090483

申请日：1983-05-11

Applicant: TORAY INDUSTRIES

Inventor： TANAKA MASAYUKI ,  KISHIMOTO AKIHIKO

IPC: C08L33/00 ,  C08L7/00 ,  C08L21/00 ,  C08L23/00 ,  C08L25/00 ,  C08L25/16 ,  C08L33/02 ,  C08L33/18 ,  C08L33/20 ,  C08L51/00 ,  C08L51/02 ,  C08L51/04 ,  C08L101/00

公开(公告)号：JPH04202556A

公开(公告)日：1992-07-23

申请号：JP33972590

申请日：1990-11-30

Applicant: TORAY INDUSTRIES

Inventor： KAYABA KEIJI ,  OTOMO SHIGERU ,  TANAKA MASAYUKI

IPC: C08K3/34 ,  C08G59/00 ,  C08G59/20 ,  C08G59/24 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To obtain an epoxy resin composition for semiconductor sealing having excellent soldering heat-resistance and thermal conductivity by compounding an epoxy resin having a specific structure with a curing agent and silicon nitride and/or silicon carbide. CONSTITUTION:The objective composition is produced by compounding (A) 4-20wt.% of an epoxy resin containing >=50wt.% of an epoxy resin of formula (R to R are H, halogen or 1-4C alkyl) (e.g. 1,5-diglycidylnaphthalene), (B) 2-15wt.% of a curing agent (e.g. phenolic novolak resin), (C) 1-95wt.% of silicon nitride and/or silicon carbide and (D) 0.1-20wt.% of a styrene-based block copolymer.

公开(公告)号：JPH04202555A

公开(公告)日：1992-07-23

申请号：JP33972390

申请日：1990-11-30

Applicant: TORAY INDUSTRIES

Inventor： KAYABA KEIJI ,  ITO KAZUO ,  TANAKA MASAYUKI

IPC: C08K3/16 ,  C08G59/00 ,  C08K3/22 ,  C08K3/26 ,  C08K3/36 ,  C08K5/02 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To obtain a semiconductor-sealing epoxy resin composition having excellent flame-retardancy and high-temperature reliability and low soft-error generation rate of memory by compounding a specific fused silica, a hydrotalcite compound, etc., in combination with a bromine compound. CONSTITUTION:The objective composition is produced by compounding (A) 5-25wt.% of an epoxy resin containing >=50wt.% of an epoxy resin having a skeleton of formula (R to R are H, 1-4C alkyl or halogen), (B) 2-15wt.% of a curing agent, (C) 75-90wt.% of fused silica having U and Th contents of

公开(公告)号：JPH04202518A

公开(公告)日：1992-07-23

申请号：JP33971990

申请日：1990-11-30

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  TESHIBA TOSHIHIRO ,  TANAKA MASAYUKI

IPC: C08K3/00 ,  C08G59/00 ,  C08G59/20 ,  C08G59/24 ,  C08K3/36 ,  C08L53/00 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03

Abstract: PURPOSE:To obtain the title composition having excellent heat resistance of soldering, thermal cycle properties and reliability of water-vapor resistance, comprising a specific epoxy resin, a curing agent, a filler and a polystyrene- based block copolymer. CONSTITUTION:The objective composition comprising (A) an epoxy resin composed of an epoxy resin (e.g. 1,5-digycidylnaphthalene) shown by the formula (R to R are H, halogen or 1-4C alkyl) as an essential component, (B) a curing agent (e.g. phenolic novolak resin), (C) preferably 75-90wt.% filler (preferably fused silica consisting of 90-40wt.% ground fused silica having

公开(公告)号：JPH04202516A

公开(公告)日：1992-07-23

申请号：JP33972490

申请日：1990-11-30

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  TESHIBA TOSHIHIRO ,  TANAKA MASAYUKI

IPC: C08K3/00 ,  C08G59/00 ,  C08G59/20 ,  C08G59/62 ,  C08K3/36 ,  C08L53/00 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03

Abstract: PURPOSE:To obtain the title composition, not causing cracks in a soldering process, having excellent storage stability at room temperature and excellent reliability of water-vapor resistance by blending a biphenyl skeleton-containing epoxy resin with a curing agent having specific structure. CONSTITUTION:(A) An epoxy resin comprising an epoxy resin essentially containing skeleton shown by formula I (R to R are H, halogen or 1-4C alkyl) is blended with (B) a curing agent essentially containing a compound shown by formula II (R is H, aryl or alkyl) and (C) 75-90wt.% filler (preferably fused silica) to give the objective composition. 4,4'-Bis(2,3-epoxypropoxy)biphenyl is preferable as the epoxy resin shown by formula I. Tris(4-hydroxyphenyl) methane is preferable as the compound shown by formula II.

公开(公告)号：JPH0419250B2

公开(公告)日：1992-03-30

申请号：JP349984

申请日：1984-01-13

Applicant: TORAY INDUSTRIES

Inventor： NAKAGAWA KEIJI ,  TANAKA MASAYUKI ,  KISHIMOTO AKIHIKO

IPC: C08F2/00 ,  C08F2/18 ,  C08F20/00 ,  C08F22/36 ,  C08F212/00 ,  C08F212/08 ,  C08F212/12 ,  C08F220/42 ,  C08F220/44 ,  C08F222/40

公开(公告)号：JPH0415822B2

公开(公告)日：1992-03-19

申请号：JP16509483

申请日：1983-09-09

Applicant: TORAY INDUSTRIES

Inventor： TANAKA MASAYUKI ,  GOTO NORIAKI ,  KISHIMOTO AKIHIKO

IPC: C08L23/26 ,  C08L23/00 ,  C08L23/02 ,  C08L25/00 ,  C08L25/08 ,  C08L25/12 ,  C08L25/14 ,  C08L25/16 ,  C08L29/00 ,  C08L33/00 ,  C08L33/02 ,  C08L33/04 ,  C08L33/06 ,  C08L33/18 ,  C08L33/20 ,  C08L51/00 ,  C08L51/02 ,  C08L51/06 ,  C08L57/00 ,  C08L101/00

公开(公告)号：JPH0367539B2

公开(公告)日：1991-10-23

申请号：JP11677185

申请日：1985-05-31

Applicant: TORAY INDUSTRIES

Inventor： TANAKA MASAYUKI ,  KISHIMOTO AKIHIKO

IPC: C08F6/00 ,  C08F6/06 ,  C08F6/12 ,  C08F6/22 ,  C08J3/16 ,  C08L7/00 ,  C08L21/00 ,  C08L25/00 ,  C08L25/16 ,  C08L51/00 ,  C08L51/02 ,  C08L51/04

公开(公告)号：JPH03119051A

公开(公告)日：1991-05-21

申请号：JP25840789

申请日：1989-10-02

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  KAYABA KEIJI ,  TANAKA MASAYUKI

IPC: C08L101/00 ,  C08G59/00 ,  C08G59/20 ,  C08K5/54 ,  C08K5/5419 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To provide an epoxy resin composition giving semiconductors generating no crack when soldered and having excellent moisture resistance and mold release property by compounding a specific epoxy resin, a hardening agent, a filler and a specified silane coupling agent. CONSTITUTION:An epoxy resin composition (A) an epoxy resin having the skeletons of the formula I (R to R are H, 1-4C lower alkyl or halogen), (B) a hardening agent, (C) a silane coupling agent containing an alkylsilane compound of formula II (R is 1-20C alkyl, phenyl or halogen; R and R are H or 1-20C monovalent hydrocarbon) and (D) a filler. The composition may further contain (E) a silicone polymer. The component D preferably contains fused silica comprising 40-90% of crushed fused silica having an average particle size of

公开(公告)号：JPH0251460B2

公开(公告)日：1990-11-07

申请号：JP13128783

申请日：1983-07-19

Applicant: TORAY INDUSTRIES

Inventor： TANAKA MASAYUKI ,  KISHIMOTO AKIHIKO ,  HIRAI TOSHIMASA

IPC: C08L33/06 ,  C08L33/00 ,  C08L33/04 ,  C08L67/00 ,  C08L77/00 ,  C08L77/12 ,  C08L79/00 ,  C08L79/08