中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

77 records (took 0.024 seconds)

    PRODUCTION OF POLYETHER SULFONE
    41.
    发明专利
    PRODUCTION OF POLYETHER SULFONE 失效

    公开(公告)号：JPH03294332A

    公开(公告)日：1991-12-25

    申请号：JP9656590

    申请日：1990-04-13

    Applicant: UBE INDUSTRIES

    Inventor： ISHIKAWA SEIJI ,  JIBIKI HIROSHI ,  KADOMA KIMITOSHI

    IPC: C08G75/23 ,  C08G75/00

    Abstract: PURPOSE:To obtain the subject thermoplastic compound having faint color and excellent heat-resistance and mechanical strength by heating and stirring a dihalogenodiphenylsulfone and a dihydric phenolic compound in a specific polar organic solvent in the presence of an alkali metal compound. CONSTITUTION:The objective compound can be produced by heating and stirring (A) a dihalogenodiphenylsulfone (e.g. 4,4'-dichlorodiphenylsulfone) and (B) a dihydric phenolic compound (e.g. hydroquinone) in a polar organic solvent consisting of a 2-imidazolidinone derivative of formula (R and R are methyl or ethyl) (preferably 1,3-dimethyl-2-imidazolidine) in the presence of an alkali metal compound (preferably sodium carbonate or potassium carbonate).

    COPOLYAMIDE FIBER AND ITS PRODUCTION
    42.
    发明专利
    COPOLYAMIDE FIBER AND ITS PRODUCTION 失效

    公开(公告)号：JPS54106621A

    公开(公告)日：1979-08-21

    申请号：JP28278

    申请日：1978-01-06

    Applicant: UBE INDUSTRIES

    Inventor： KANEDA TAKAHO ,  ISHIKAWA SEIJI ,  DAIMON HIROSHI ,  KATSURA TOSHIO ,  HONDOU TADAHIRO ,  UEDA MASAHIRO

    IPC: D01F6/80 ,  C08G69/32

    Abstract: PURPOSE:Copolyamide fibers that are composed of specific structures as recurring units and useful for industrial fibers as reinforcing materials for rubber products, ropes, filter cloths, a variety of covering cloths and others because of their high initial modulus, tensile strength, knot strength and heat resistance. CONSTITUTION:Said copolyamide fibers are substantially composed of rccurring units of structures shown by formula I, II and III wherein the units of formula I and II is substantialy equimolar with the unit of formula III and the molar ratio of the unit of formula I to that of formula II is 10/90-50/50. A copolyamide with an inherent viscosity of over 2.0, preferably over 3.0 dl/g measured with 0.5g/dl solution in 95-98% sulfuric acid at 30 deg.C is wet spun using conc, or fuming sulfuric acid as a solvent and water as a coagulant, forming fibers with initial modulus over 400g/d and tensile strength over 16g/d.

    POLYIMIDE RESIN FOR UNDERFILL
    47.
    发明专利
    POLYIMIDE RESIN FOR UNDERFILL 失效

    公开(公告)号：JP2000154250A

    公开(公告)日：2000-06-06

    申请号：JP33168798

    申请日：1998-11-20

    Applicant: UBE INDUSTRIES

    Inventor： ISHIKAWA SEIJI ,  YAMAMOTO SHIGERU

    IPC: H01B3/30 ,  C08G73/10 ,  C08L63/00 ,  C08L79/08 ,  H01L21/52

    Abstract: PROBLEM TO BE SOLVED: To obtain a polyimide resin which is soluble in organic solvents and desirably applied to an underfill process where the circuit board on which semiconductor chips have been mounted is a polyimide substrate by selecting a polyimide resin containing a specified proportion of a polyimidosiloxane component. SOLUTION: The polyimide resin used comprises 40-80 mol% polyimidosiloxane component of formula I, 5-50 mol% polyimide component of formula II, and the balance of a polyimide component of formula III. In the formulae, R1 is a residue derived by removing the four carboxyl groups from an aromatic tetracarboxylic acid; R2 is a hydrocarbon group or phenylene; R3 is a 1-3C alkyl or phenyl; n1 is 3-50; r1 is hydroxyl or carboxyl; X is a direct bond, -O-, -S-, or a group of any one of formulae IV to IX; n2 is 1 or 2; n3 is 0-3; R4 and R5 are each H, methyl, or trifluoromethyl; and R6 is a residue derived by removing the amino groups from a diamine compound other than the diamine compounds forming the diamine components of formulae I and II.

    ONE-COLOR-COATING POLYIMIDESILOXANE COATING MATERIAL AND CURED FILM
    48.
    发明专利
    ONE-COLOR-COATING POLYIMIDESILOXANE COATING MATERIAL AND CURED FILM 失效

    公开(公告)号：JPH11310754A

    公开(公告)日：1999-11-09

    申请号：JP11827998

    申请日：1998-04-28

    Applicant: UBE INDUSTRIES

    Inventor： ISHIKAWA SEIJI ,  YAMAMOTO SHIGERU ,  WATANABE YOSHIAKI

    IPC: C09D179/08 ,  C09D183/10 ,  H01B3/30 ,  H01B3/46 ,  H01L23/29 ,  H01L23/31

    Abstract: PROBLEM TO BE SOLVED: To obtain a coating material which has a good storage stability and gives a cured film excellent in plating resistance, heat resistance, softness, etc., by incorporating a polyimidesiloxane, an epoxy resin, a fine-particle inorg. filler, and a high-b.p. solvent each in a specified amt. into the same and imparting a specified viscosity to the same. SOLUTION: This coating material contains 100 pts.wt. org.-solvent-soluble polyimidesiloxane represented by formulas I-III, 2-30 pts.wt. epoxy resin, 20-150 pts.wt. fine-particle inorg. filler, and 60-140 pts.wt. high-b.p. solvent and has a viscosity of 400-1,000 P. In the formulas, R1 is a tetravalent residue formed by removing four carboxyl groups from a tetracarboxylic acid; R2 is a residue formed by removing the NH2 group from a compd. of formula IV; R3 is a residue formed by removing the NH2 group from a compd. of formula V; R4 is R2 or R3 ; n1 is 3-50; R5 is a divalent hydrocarbon group or phenyl; R6 is an alkyl or the like; X is a direct bond or the like; r1 is OH or COOH; n2 is 1 or 2; n3 is 0-3; and m1, m2, and m3 are each the mole fraction of the respective component and are 60-92.5 mol.%, 7.5-40 mol.%, and the rest, respectively, the sum being 100 mol.%.

    LAMINATED SUBSTRATE
    49.
    发明专利
    LAMINATED SUBSTRATE 失效

    公开(公告)号：JPH10733A

    公开(公告)日：1998-01-06

    申请号：JP15652896

    申请日：1996-06-18

    Applicant: UBE INDUSTRIES

    Inventor： ISHIKAWA SEIJI ,  YASUNO HIROSHI

    IPC: C08J5/12 ,  B32B15/08 ,  B32B15/088 ,  C08G59/40 ,  C08G73/10 ,  C08L63/00 ,  C09J163/00 ,  C09J179/08 ,  H05K3/38

    Abstract: PROBLEM TO BE SOLVED: To eliminate the fixation of a metal layer to a substrate under pressure at high temperature by a method wherein a composition, which is prepared by dissolving a polymer component consisting of non-crystalline polyimide siloxane and aromatic epoxy compound in organic solvent, is applied onto the substrate so as to paste the metal layer to the board at the lamination of the metal layer to the substrate through adhesive. SOLUTION: At the manufacturing of a laminated substrate such as one represented by the flexible substrate of a tape of TAB, a composition, which is prepared by dissolving a polymer component consisting of non-crystalline polyimide siloxane having a functional group reacting with an epoxy group in a benzene ring and an aromatic epoxy compound in organic solvent, is applied onto a laminated substrate and, after the solvent is removed through evaporation, the metal layer is pasted to the bonding surface of the substrate under heat and pressure. At this case as the functional group reactive with the epoxy group of the non-crystalline polyimide siloxane, an OH group or a COOH group is employed. Further, the adhesive is prepared from the reactive mixture of 100 pts.wt. of the non-crystalline polyimide siloxane and 1-50 pts.wt. of epoxy resin.

    PHOTOSENSITIVE POLYIMIDOSILOXANE, COMPOSITION AND INSULATING FILM
    50.
    发明专利
    PHOTOSENSITIVE POLYIMIDOSILOXANE, COMPOSITION AND INSULATING FILM 失效

    公开(公告)号：JPH09100350A

    公开(公告)日：1997-04-15

    申请号：JP14905096

    申请日：1996-06-11

    Applicant: UBE INDUSTRIES

    Inventor： ISHIKAWA SEIJI ,  YASUNO HIROSHI ,  SAKURAI HIROYUKI

    IPC: C08G73/10 ,  C08G77/455 ,  C08L79/08 ,  C09D183/10 ,  G03F7/038 ,  G03F7/075 ,  H01B3/30

    Abstract: PROBLEM TO BE SOLVED: To obtain a photosensitive polyimidosiloxane which is solvent-soluble and used for forming an insulating film by polymerizing an aromatic tetracarboxylic acid dianhydride with a photosensitive-group-containing aromatic diamine and a specified diaminopolysiloxane and imidating the obtained polyamic acid. SOLUTION: Equipment amounts of an aromatic tetracarboxylic acid dianhydride component of formula I (wherein R1 and R2 are each an acid anhydride-group- containing mononuclear aromatic group; and X is CO, O or a direct bond) and a diamine component comprising 15-80mol% photosensitive-group-containing aromatic diamine of formula II (wherein R3 is a photosensitive-group-containing aromatic group having a hydrocarbon unsaturation) and 85-20mol% diaminopolysiloxane of formula III (wherein R4 is a hydrocarbon group; R5 is a 1-3C alkyl or a phenyl; and (l) is 3-30) are polymerized, and the formed polyamic acid is imidated to obtain a photosensitive polyimidosiloxane soluble in organic solvents. The new aromatic polyimidosiloxane is excellent in heat resistance and electrical properties and flexible and is excellent as an overcoating material for flexible printed wiring boards, an interlayer insulation material or an insulation film forming material for solid-state elements.

Patent Agency Ranking