Method for repair of metallization on circuit board substrates
    41.
    发明授权
    Method for repair of metallization on circuit board substrates 失效
    电路板基板上金属化修复方法

    公开(公告)号:US5814174A

    公开(公告)日:1998-09-29

    申请号:US664657

    申请日:1996-06-17

    Inventor: Stewart O. Fong

    Abstract: A method of repairing an area of metallization that has lifted from a circuit board substrate uses a dry film epoxy placed between the lifted metallization and the substrate. Downward pressure and heat are simultaneously applied to the lifted area to rebond it to the substrate. Both metallization pads and traces may be repaired with the method, and the resulting bond may be stronger than that originally present. When heated, the dry film epoxy will melt and cure very quickly, requiring no further processing. The method is particularly useful when repairing circuit boards intended for microwave circuitry, in which conductive ribbons are gap welded to metallization pads. A metallization pad repair operation may be combined with a ribbon attachment operation, accomplishing both with one gap welding operation. The gap welder provides the downward force and heat necessary to bond the ribbon and repair the lifted pad.

    Abstract translation: 修复从电路板基板提起的金属化区域的方法使用放置在提升的金属化和基板之间的干膜环氧树脂。 向下的压力和热量同时施加到提升区域以将其重新粘附到基底。 可以用该方法修复金属化焊盘和迹线,并且所得到的结合可能比原来存在的更强。 当加热时,干膜环氧树脂将非常快速地熔化和固化,不需要进一步处理。 该方法在修理用于微波电路的电路板时特别有用,其中导电带间隙焊接到金属化焊盘。 金属化板修复操作可以与色带附接操作组合,通过一次间隙焊接操作实现两者。 间隙焊机提供粘结带状物并修复提升垫所需的向下的力和热量。

    Method of connecting electrical conductors and apparatus for carrying
out the method
    43.
    发明授权
    Method of connecting electrical conductors and apparatus for carrying out the method 失效
    电导体连接方法及其实施方法

    公开(公告)号:US4869419A

    公开(公告)日:1989-09-26

    申请号:US128288

    申请日:1987-12-03

    Applicant: Lothar Nuss

    Inventor: Lothar Nuss

    CPC classification number: H01R43/0207 B23K20/106 B23K2201/32 B23K2201/38

    Abstract: A method for ultrasonically welding electrical conductors in which the compaction of the electrical conductors carried out in a compaction chamber takes place in two compaction phases, in which the electrical conductors are first compacted substantially in a vertical direction and thereafter both in a vertical and in a horizontal direction, wherein, during the second compaction phase with superimposed movements, the ultrasonic action takes place for welding the electrical conductors. Several forms of embodiment of an apparatus for carrying out this method and modified methods are described, the common feature of which is the mounting of a crosshead (7), displaceably parallel to a sonotrode surface (2), on a second, vertically displaceable anvil part (8), the crosshead (7) being connected with a drive apparatus (19) acting in its direction of displacement.

    Abstract translation: 一种用于超声波焊接电导体的方法,其中在压实室中执行的电导体的压实发生在两个压实阶段中,其中电导体基本上在垂直方向上先压实,然后在垂直和 水平方向,其中,在具有叠加运动的第二压实阶段期间,进行用于焊接电导体的超声波作用。 描述了用于执行该方法和改进方法的装置的几种形式的实施例,其共同特征是在第二可竖直位移的砧座上安装可平移于超声焊管表面(2)的十字头(7) 部分(8),所述十字头(7)与沿其移动方向作用的驱动装置(19)连接。

    Method of attaching a connection piece to a metal surface by brazing
    44.
    发明授权
    Method of attaching a connection piece to a metal surface by brazing 失效
    通过钎焊将连接件附接到金属表面的方法

    公开(公告)号:US4716272A

    公开(公告)日:1987-12-29

    申请号:US756631

    申请日:1985-07-19

    CPC classification number: B23K1/0008 B23K2201/38

    Abstract: A method of attaching a connection piece of metal to a metal surface by brazing wherein the required heat is generated by an electric arc. The heat generated by the electric arc is conducted through at least a portion of the connection piece and melts a brazing metal provided between the connection piece and the metal surface. The heat conducting portion of the connection piece prevents direct contact between the electric arc, the metal surface and the brazing metal during melting which prevents disadvantageous thermal actuation of the metal surface. When the current to the electric arc has been disconnected, a mechanical force is applied to the heat conducting portion of the connection piece pressing the latter against the metal surface and pressing out a portion of the brazing metal from underneath the remaining joint-forming surfaces of the connection piece.

    Abstract translation: 通过钎焊将金属连接片附着在金属表面上的方法,其中所需的热量由电弧产生。 由电弧产生的热量通过连接件的至少一部分导入,并熔化设置在连接件和金属表面之间的钎焊金属。 连接件的导热部分防止熔化期间电弧,金属表面和钎焊金属之间的直接接触,从而防止金属表面的不利的热致动。 当电弧电流已经断开时,机械力被施加到连接件的导热部分上,将其压在金属表面上,并从其余的接合成形表面的下方挤出一部分钎焊金属 连接件。

    Apparatus for electric pressure joining, especially pressure welding and
pressure soldering
    45.
    发明授权
    Apparatus for electric pressure joining, especially pressure welding and pressure soldering 失效
    电压接合装置,特别是压力焊接和压力焊接

    公开(公告)号:US4647750A

    公开(公告)日:1987-03-03

    申请号:US810180

    申请日:1985-12-18

    Inventor: Albert Mosbacher

    CPC classification number: B23K11/31 B23K1/0004 B23K11/3009 B23K2201/38

    Abstract: A first electrode with a first clamping surface and a second electrode with a second clamping surface are moveable towards and away from each other during working cycles of the apparatus. The first and second clamping surfaces face each other and serve to securely clamp a workpiece to be welded and to supply an electrical current required for this operation. The second clamping surface of the second electrode is larger than the first clamping surface of the first electrode, and radial displacing members are provided to displace the second electrode with respect to the first electrode between successive working cycles. This is necessary, particularly during welding or soldering series of small articles, in order to reduce the frequency of wear due to heat accumulation and to reduce the need to frequently exchange the electrodes or electrode inserts carrying the clamping surfaces, which exchange is caused by the heat accumulation. Consequently, different surface sections of the larger second clamping surface of the second electrode face the first clamping surface of the first electrode during successive working cycles.

    Abstract translation: 具有第一夹紧表面的第一电极和具有第二夹紧表面的第二电极在设备的工作循环期间彼此可移动并彼此远离。 第一和第二夹紧表面彼此面对,用于牢固地夹紧待焊接的工件并提供该操作所需的电流。 第二电极的第二夹紧表面大于第一电极的第一夹紧表面,并且提供径向移位构件以在相继的工作循环之间相对于第一电极移动第二电极。 这是必要的,特别是在小型制品的焊接或焊接系列期间,为了减少由于热积聚而导致的磨损频率,并且减少了频繁更换承载夹紧表面的电极或电极插件的需要,这些交换是由 热积累 因此,第二电极的较大的第二夹紧表面的不同表面部分在连续的工作循环期间面对第一电极的第一夹紧表面。

    Method for connecting a fine wire to a connecting pin
    48.
    发明授权
    Method for connecting a fine wire to a connecting pin 失效
    将精细线连接到连接PIN的方法

    公开(公告)号:US4039801A

    公开(公告)日:1977-08-02

    申请号:US591038

    申请日:1975-06-27

    CPC classification number: H01R43/0228 B23K31/02 B23K2201/38

    Abstract: A fine insulated wire with a diameter of less than 0.3 mm is attached to a connecting pin embedded in an electric component. The wire is wrapped around this connecting pin at least three times, and then argon-arc welded without melting the electrode. This welding operation is carried out from a distance of less than 3 mm and preferably on the order of 0.5 mm, for a short time such as for a period of less than 0.75 seconds, preferably on the order of 0.5 seconds. In order to avoid heating the wire is far above its melting point, which might destroy the wire or cause similar disadvantages, the connection pin is pre-tinned, the tin is rendered molten and the insulating coating of the wire is partially burned during the welding process in such a way that the solidified tin will hold the wire at several points.

    Side hole terminal
    49.
    发明授权
    Side hole terminal 失效
    侧孔端子

    公开(公告)号:US3665367A

    公开(公告)日:1972-05-23

    申请号:US3665367D

    申请日:1969-08-20

    Abstract: An electrical terminal designed to be attached to an electrical conductor in the form of a conventional insulated wire or the like, by means of a solder connection. The body portion of the terminal comprises a channel extending into its interior and at least one hole or aperture formed in the side of the body portion intermediate the extremities of the channel and communicating with the interior of the channel. Solder applied to the interior of said channel through the side hole flows about the connector within the channel due to capillary action. Proper filling of the channel with a required minimum amount of solder may be evidenced by the provision of a second hole also formed in the side of the body portion a spaced distance from the first hole and communicating with the interior of the channel such that the presence of solder in the channel may be observed.

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