Abstract:
A method of repairing an area of metallization that has lifted from a circuit board substrate uses a dry film epoxy placed between the lifted metallization and the substrate. Downward pressure and heat are simultaneously applied to the lifted area to rebond it to the substrate. Both metallization pads and traces may be repaired with the method, and the resulting bond may be stronger than that originally present. When heated, the dry film epoxy will melt and cure very quickly, requiring no further processing. The method is particularly useful when repairing circuit boards intended for microwave circuitry, in which conductive ribbons are gap welded to metallization pads. A metallization pad repair operation may be combined with a ribbon attachment operation, accomplishing both with one gap welding operation. The gap welder provides the downward force and heat necessary to bond the ribbon and repair the lifted pad.
Abstract:
A method of interconnecting circuit modules (30) to mother boards (50) each having a plurality of mating solder pads (32, 52) is available. The solder pads (32, 52) have respective pairs of arms (40, 42) and (54, 56) with a venting channel (36, 58) formed between each pair of arms to vent solder medium when the solder pads are reflowed to interconnect the circuit modules and mother boards.
Abstract:
A method for ultrasonically welding electrical conductors in which the compaction of the electrical conductors carried out in a compaction chamber takes place in two compaction phases, in which the electrical conductors are first compacted substantially in a vertical direction and thereafter both in a vertical and in a horizontal direction, wherein, during the second compaction phase with superimposed movements, the ultrasonic action takes place for welding the electrical conductors. Several forms of embodiment of an apparatus for carrying out this method and modified methods are described, the common feature of which is the mounting of a crosshead (7), displaceably parallel to a sonotrode surface (2), on a second, vertically displaceable anvil part (8), the crosshead (7) being connected with a drive apparatus (19) acting in its direction of displacement.
Abstract:
A method of attaching a connection piece of metal to a metal surface by brazing wherein the required heat is generated by an electric arc. The heat generated by the electric arc is conducted through at least a portion of the connection piece and melts a brazing metal provided between the connection piece and the metal surface. The heat conducting portion of the connection piece prevents direct contact between the electric arc, the metal surface and the brazing metal during melting which prevents disadvantageous thermal actuation of the metal surface. When the current to the electric arc has been disconnected, a mechanical force is applied to the heat conducting portion of the connection piece pressing the latter against the metal surface and pressing out a portion of the brazing metal from underneath the remaining joint-forming surfaces of the connection piece.
Abstract:
A first electrode with a first clamping surface and a second electrode with a second clamping surface are moveable towards and away from each other during working cycles of the apparatus. The first and second clamping surfaces face each other and serve to securely clamp a workpiece to be welded and to supply an electrical current required for this operation. The second clamping surface of the second electrode is larger than the first clamping surface of the first electrode, and radial displacing members are provided to displace the second electrode with respect to the first electrode between successive working cycles. This is necessary, particularly during welding or soldering series of small articles, in order to reduce the frequency of wear due to heat accumulation and to reduce the need to frequently exchange the electrodes or electrode inserts carrying the clamping surfaces, which exchange is caused by the heat accumulation. Consequently, different surface sections of the larger second clamping surface of the second electrode face the first clamping surface of the first electrode during successive working cycles.
Abstract:
Aluminum is joined to titanium by welding using so much welding energy that the temperature on the titanium side of the alloying melt boundary remains below 2000.degree. C., while titanium and aluminum do, however, melt at the joint interface.In a weldment thus obtained, the base material alloys and aluminum filler of which contain at maximum 10% titanium, there is in the vicinity of the interface between titanium and aluminum only a discontinuous .beta.-phase, dispersed in the aluminum matrix.
Abstract:
A channeled photosensitive element is described. In particular, the element has a substantially solid photosensitive, thermoplastic layer having grooves or channels therein, the layer being applied with pressure to a surface, e.g., having raised areas such as in a printed circuit board without entrapping air bubbles.
Abstract:
A fine insulated wire with a diameter of less than 0.3 mm is attached to a connecting pin embedded in an electric component. The wire is wrapped around this connecting pin at least three times, and then argon-arc welded without melting the electrode. This welding operation is carried out from a distance of less than 3 mm and preferably on the order of 0.5 mm, for a short time such as for a period of less than 0.75 seconds, preferably on the order of 0.5 seconds. In order to avoid heating the wire is far above its melting point, which might destroy the wire or cause similar disadvantages, the connection pin is pre-tinned, the tin is rendered molten and the insulating coating of the wire is partially burned during the welding process in such a way that the solidified tin will hold the wire at several points.
Abstract:
An electrical terminal designed to be attached to an electrical conductor in the form of a conventional insulated wire or the like, by means of a solder connection. The body portion of the terminal comprises a channel extending into its interior and at least one hole or aperture formed in the side of the body portion intermediate the extremities of the channel and communicating with the interior of the channel. Solder applied to the interior of said channel through the side hole flows about the connector within the channel due to capillary action. Proper filling of the channel with a required minimum amount of solder may be evidenced by the provision of a second hole also formed in the side of the body portion a spaced distance from the first hole and communicating with the interior of the channel such that the presence of solder in the channel may be observed.