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    OUT-OF-PLANE MICRONEEDLE MANUFACTURING PROCESS
    48.
    发明申请
    OUT-OF-PLANE MICRONEEDLE MANUFACTURING PROCESS 有权
    超平面麦克风制造工艺

    公开(公告)号：US20100280458A1

    公开(公告)日：2010-11-04

    申请号：US12808334

    申请日：2008-10-17

    Applicant: Astrid Cachemaille ,  Francois Cannehan

    Inventor： Astrid Cachemaille ,  Francois Cannehan

    IPC: A61M5/00 ,  B23P17/04

    CPC classification number: A61M37/0015 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C1/00111 ,  Y10T29/49826 ,  Y10T428/24479

    Abstract: Out-of-plane microneedle manufacturing process comprising the simultaneous creation of a network of microneedles and the creation of a polygonal shaped hat (2) above each microneedle (1) under formation, said process comprising the following steps: providing bridges (3) between the hats (3), maintaining the bridges (3) during the remaining microneedle manufacturing steps, removing the bridges (3), together with the hats (2), when the microneedles (1) are formed.

    Abstract translation: 面外微型制造工艺包括同时创建微针网络并在形成每个微针（1）上方形成多边形帽（2），所述方法包括以下步骤：提供桥 （3），在剩余的微针制造步骤期间保持桥（3），当形成微针（1）时，与帽子（2）一起移除桥（3）。

    METHOD FOR PRODUCING MICRONEEDLE STRUCTURES EMPLOYING ONE-SIDED PROCESSING
    49.
    发明申请
    METHOD FOR PRODUCING MICRONEEDLE STRUCTURES EMPLOYING ONE-SIDED PROCESSING 审中-公开
    生产采用单面加工的微结构结构的方法

    公开(公告)号：US20100224590A1

    公开(公告)日：2010-09-09

    申请号：US12160444

    申请日：2008-05-20

    Applicant: Yehoshua Yeshurun ,  Meint de Boer ,  J.W. Berenschot

    Inventor： Yehoshua Yeshurun ,  Meint de Boer ,  J.W. Berenschot

    IPC: B81C1/00

    CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B81B2201/055

    Abstract: A method for forming a hollow microneedle structure includes processing the front side of a wafer to form at least one microneedle projecting from a substrate and a through-bore passing through the microneedle and through a thickness of the substrate. An entire length of the through-bore is formed by a dry etching process performed from the front side of the wafer. Most preferably, upright surfaces of the microneedle structure and the through bore of the structure are formed by dry etching performed via a single mask with differing depths obtained by harnessing aspect ratio limitations of the dry etching process.

    Abstract translation: 用于形成中空微针结构的方法包括处理晶片的前侧以形成从基底突出的至少一个微针和穿过微针并穿过基底的厚度的通孔。 通孔的整个长度通过从晶片的前侧进行的干蚀刻工艺形成。 最优选地，微针结构的直立表面和结构的通孔通过经由通过利用干蚀刻工艺的纵横比限制而获得的不同深度的单个掩模执行的干蚀刻形成。

    Wet etch processing
    50.
    发明授权
    Wet etch processing 失效
    湿式蚀刻处理

    公开(公告)号：US07651946B2

    公开(公告)日：2010-01-26

    申请号：US11637020

    申请日：2006-12-12

    Applicant: Nicolle Wilke ,  Anthony Morrissey

    Inventor： Nicolle Wilke ,  Anthony Morrissey

    IPC: H01L21/311

    CPC classification number: A61M37/0015 ,  A61M2037/003 ,  A61M2037/0046 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C1/00626 ,  B81C99/0065 ,  B81C2201/0133 ,  B81C2201/0138

    Abstract: A method of wet etching produces high-precision microneedle arrays for use in medical applications. The method achieves precise process control over microneedle fabrication, at single wafer or batch-level, using wet etching of silicon with potassium hydroxide (KOH) solution by accurately identifying the etch time endpoint. Hence, microneedles of an exactly required height, shape, sharpness and surface quality are achieved. The outcome is a reliable, reproducible, robust and relatively inexpensive microneedle fabrication process. Microneedles formed by KOH wet etching have extremely smooth surfaces and exhibit superior mechanical and structural robustness to their dry etched counterparts. These properties afford extra reliability to such silicon microneedles, making them ideal for medical applications. The needles can also be hollowed. Wet etched silicon microneedles can then be employed as masters to replicate the improved surface and structural properties in other materials (such as polymers) by moulding.

    Abstract translation: 湿蚀刻的方法产生用于医疗应用的高精度微针阵列。 该方法通过精确地识别蚀刻时间终点，通过使用氢氧化钾（KOH）溶液对硅进行湿蚀刻，在单晶片或批次水平上实现了微针制造的精确过程控制。 因此，实现了精确要求的高度，形状，锐度和表面质量的微针。 结果是可靠，可重现，稳健且相对便宜的微针制作工艺。 通过KOH湿蚀刻形成的微针具有非常光滑的表面，并且对其干蚀刻的对应物表现出优异的机械和结构坚固性。 这些性能为这种硅微针提供了额外的可靠性，使其成为医疗应用的理想选择。 针也可以是中空的。 湿法蚀刻的硅微针可用作主机，通过模制复制其他材料（如聚合物）中改进的表面和结构性能。

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