公开(公告)号：EP2750488A1

公开(公告)日：2014-07-02

申请号：EP12008664.0

申请日：2012-12-28

Applicant: Heraeus Precious Metals GmbH & Co. KG

Inventor： Flick, Stefan ,  Fuchs, Dr. Herbert ,  Modes, Christina ,  Timter, Kerstin

IPC: H05K1/03 ,  H05K3/10 ,  H05K3/24 ,  H05K3/12

CPC classification number: H05K3/247 ,  H05K1/0306 ,  H05K3/248 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2203/1157 ,  H05K2203/121

Abstract: Die vorliegende Erfindung betrifft allgemein ein Verfahren zur Herstellung eines Schichtaufbaus (1), beinhaltend die Schritte:
a) Bereitstellen einer Keramikschicht (2) mit einer die Keramikschicht (2) mindestens teilweise überlagernden ersten Metallschicht (3);
b) mindestens teilweises Überlagern der ersten Metallschicht (3) mit einer weiteren Metallschicht (4), beinhaltend mindestens ein Metall der VIII. Nebengruppe;
c) gegebenenfalls mindestens teilweises Überlagern der ersten Metall-Schicht (3) mit einer zusätzlichen Metallschicht (5), beinhaltend mindestens ein Metall der VIII. Nebengruppe;
d) mindestens teilweises Überlagern der weiteren Metallschicht (4) oder der zusätzlichen Metallschicht (5) mit einer äußeren Schicht (6);

wobei das Überlagern in mindestens einem der Schritte b) bis d) durch Drucken mittels einer flüssigen Druckmasse (7, 8, 9) erfolgt, wobei die flüssige Druckmasse (7, 8, 9) eine metallorganische Verbindung in einer Menge in einem Bereich von 5 bis 50 Gew.-%, jeweils bezogen auf die Druckmasse (7, 8, 9) beinhaltet

Abstract translation: 该方法包括提供陶瓷层（2）与第一金属层（3）部分地重叠的陶瓷层。 所述第一金属层是部分重叠有第二金属层（4）和含有第八子组的金属的第三金属层（5）。 第二金属层或第三金属层被部分地叠加在外层（6），通过使用液体印刷质量，其在有机金属化合物中，在量的范围内含有5重量印刷含有金属选自％至50 重量相对于打印质量％。 因此独立权利要求中包括了以下内容：（1）的层结构（2）的层结构的前体（3）至电元件（4）的车辆（5）的试剂盒。

公开(公告)号：EP2656703A2

公开(公告)日：2013-10-30

申请号：EP11851645.9

申请日：2011-12-23

Applicant: LG Innotek Co., Ltd.

Inventor： LEE, Sang Myung ,  YOON, Sung Woon ,  LEE, Hyuk Soo ,  LEE, Sung Won ,  CHUN, Ki Do

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K3/064 ,  H05K3/388 ,  H05K3/428 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0341 ,  H05K2203/0376

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

公开(公告)号：EP1930946B1

公开(公告)日：2017-01-25

申请号：EP07122244.2

申请日：2007-12-04

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kaneko, Kentaro ,  Kodani, Kotaro ,  Nakamura, Junichi ,  Kobayashi, Kazuhiro

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H05K1/113 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2924/0002 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/0341 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49155 ,  H01L2924/00

公开(公告)号：EP2759622A4

公开(公告)日：2016-03-16

申请号：EP12834344

申请日：2012-09-10

Applicant: JX NIPPON MINING & METALS CORP

Inventor： SHIBUYA YOSHITAKA ,  FUKAMACHI KAZUHIKO ,  KODAMA ATSUSHI

IPC: B32B15/01 ,  C22C5/06 ,  C22C5/08 ,  C22C5/10 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  C22C13/02 ,  C22C19/03 ,  C22C19/07 ,  C22C22/00 ,  C22C27/06 ,  C22C38/00 ,  C23C18/16 ,  C25D3/12 ,  C25D3/20 ,  C25D3/30 ,  C25D3/38 ,  C25D3/46 ,  C25D3/50 ,  C25D3/56 ,  C25D3/62 ,  C25D3/64 ,  C25D5/10 ,  C25D5/12 ,  C25D5/50 ,  H01R13/03 ,  H05K1/11 ,  H05K3/24

CPC classification number: H01B1/02 ,  B32B15/01 ,  B32B15/018 ,  C22C5/06 ,  C22C5/08 ,  C22C5/10 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  C22C13/02 ,  C22C19/03 ,  C22C19/07 ,  C22C22/00 ,  C22C27/06 ,  C22C38/00 ,  C23C18/1651 ,  C23C18/1692 ,  C25D3/12 ,  C25D3/20 ,  C25D3/30 ,  C25D3/38 ,  C25D3/46 ,  C25D3/50 ,  C25D3/567 ,  C25D3/62 ,  C25D3/64 ,  C25D5/10 ,  C25D5/12 ,  C25D5/505 ,  H01R13/03 ,  H05K1/117 ,  H05K1/118 ,  H05K3/244 ,  H05K2201/0341 ,  Y10T428/12681 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722

Abstract: There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 µm, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 µm.

Abstract translation: 提供了一种电子部件用金属材料，其具有低插入性/提取性，低晶须成形性和高耐久性，以及金属材料的制造方法。 用于电子部件的金属材料10具有基材11，在基材11上构成表面层的A层14，由Sn，In或其合金构成，B层13构成中间层，B层13设置在基材 材料11和A层14，其由Ag，Au，Pt，Pd，Ru，Rh，Os，Ir或其合金形成，其中表面层（A层）14具有0.002至0.2μm的厚度， 中间层（B层）13的厚度为0.001〜0.3μm。

公开(公告)号：EP2732967A1

公开(公告)日：2014-05-21

申请号：EP12810573.1

申请日：2012-07-11

Applicant: NHK Spring Co., Ltd.

Inventor： YAMAUCHI, Yuichiro ,  HIRANO, Satoshi ,  SAITO, Shinji ,  HANAMACHI, Toshihiko

IPC: B32B15/04 ,  B05D1/12 ,  C23C24/04

CPC classification number: B32B15/04 ,  B05D1/12 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/126 ,  C04B2237/128 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/706 ,  C23C24/04 ,  C23C28/02 ,  C23C28/30 ,  H01L21/4846 ,  H01L23/3735 ,  H01L23/498 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/83447 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/0306 ,  H05K3/14 ,  H05K3/38 ,  H05K2201/0341 ,  H05K2201/0355 ,  H05K2203/1344 ,  Y10T428/12056 ,  H01L2924/014 ,  H01L2924/00

Abstract: When a laminated body having a metal film formed on a ceramic base member is manufactured by using a cold spraying method, a laminated body having a high adhesion strength between a ceramic and the metal film and a method of manufacturing such a laminated body are provided. The laminated body includes a ceramic base member 10 having an insulating property, an intermediate layer 50 including metal or alloy as a main component formed on a surface of the ceramic base member 10, and a metal film layer (a circuit layer 20 and a cooling fin 40) formed on a surface of the intermediate layer 50 by accelerating a powder of metal or alloy with a gas and spraying and depositing the powder on the surface of the intermediate layer 50 as the powder is in a solid state.

Abstract translation: 当通过使用冷喷涂法制造具有形成在陶瓷基底上的金属膜的层压体时，提供陶瓷和金属膜之间的粘合强度高的层叠体以及这种层压体的制造方法。 层叠体包括具有绝缘性的陶瓷基体部件10，在陶瓷基体部件10的表面上形成的金属或合金作为主要成分的中间层50，以及金属膜层（电路层20和冷却 翅片40），其通过用气体加速金属或合金粉末而形成在中间层50的表面上，并且当粉末处于固体状态时将粉末喷涂并沉积在中间层50的表面上。

公开(公告)号：EP0298422B1

公开(公告)日：1994-06-15

申请号：EP88110710.6

申请日：1988-07-05

Applicant: HITACHI, LTD.

Inventor： Toba, Ritsuji ,  Murakami, Kanji ,  Kawamoto, Mineo

IPC: H05K3/10 ,  H05K3/02

CPC classification number: H05K3/384 ,  H05K3/108 ,  H05K3/385 ,  H05K3/427 ,  H05K2201/0317 ,  H05K2201/0341 ,  H05K2201/0347 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/1157

公开(公告)号：EP2661160A1

公开(公告)日：2013-11-06

申请号：EP11853108.6

申请日：2011-12-02

Applicant: Tokuyama Corporation

Inventor： TAKAHASHI, Naoto ,  YAMAMOTO, Yasuyuki ,  USHIODA, Emi

IPC: H05K3/38 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  H05K3/26

CPC classification number: H05K3/06 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/108 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/0341 ,  Y10T428/24967 ,  Y10T428/265

Abstract: The present invention provides: a method for manufacturing a metallized substrate by which a fine pattern can be formed more easily; a metallized substrate manufactured by the method; and a metal paste composition to be used in the method. The metallized substrate has: a sintered nitride ceramic substrate (10); a titanium nitride layer (20) on the sintered substrate (10); an adhesion layer (30) on the titanium nitride layer (20); and a copper plating layer (40) on or above the adhesion layer (30), wherein the adhesion layer (30) contains copper and titanium, and has a thickness of no less than 0.1 µm and no more than 5 µm.

Abstract translation: 本发明提供一种金属化基板的制造方法，能够更容易地形成精细图案; 通过该方法制造的金属化基板; 以及该方法中使用的金属糊剂组合物。 金属化基板具有：烧结氮化物陶瓷基板（10）; 在所述烧结基板（10）上的氮化钛层（20）; 在氮化钛层上的粘附层（30）; 以及在所述粘合层（30）上或上方的镀铜层（40），其中所述粘合层（30）含有铜和钛，并且具有不小于0.1μm且不大于5μm的厚度。

公开(公告)号：EP2479788A2

公开(公告)日：2012-07-25

申请号：EP12164665.7

申请日：2007-12-04

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kaneko, Kentaro ,  Kodani, Kotaro ,  Nakamura, Junichi ,  Kobayashi, Kazuhiro

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H05K1/113 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2924/0002 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/0341 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A wiring substrate (10) has a pad (12) formed from a plurality of metal layers (26, 27, 28) and a via (13,17,29) connected to the pad. The plurality of metal layers have a metal layer (26) exposed through the wiring substrate, and a first metal layer (27) which is interposed between the metal layer and via and which prevents diffusion of metal included in the via into the metal layer. A second metal layer (28) which is less subject to oxidation than the first metal layer (27) is provided between the via (13) and the first metal layer, and the via is connected to a roughened surface of the second metal layer. An insulation layer (11) covers the side surfaces of the pad and the roughened surface of the second metal layer except for a region of the surface exposed by an opening section (25) in which the via is provided.

Abstract translation: 布线基板（10）具有由多个金属层（26,27,28）形成的焊盘（12）和与焊盘连接的通孔（13,17,29）。 多个金属层具有通过布线基板露出的金属层（26），以及介于金属层和通孔之间的第一金属层（27），并且防止通孔中包含的金属扩散到金属层中。 在通孔（13）和第一金属层之间设置有比第一金属层（27）更少受到氧化的第二金属层（28），并且通孔连接到第二金属层的粗糙表面。 除了由设置有通孔的开口部分（25）暴露的表面的区域之外，绝缘层（11）覆盖焊盘的侧表面和第二金属层的粗糙表面。

公开(公告)号：EP1930946A3

公开(公告)日：2009-09-09

申请号：EP07122244.2

申请日：2007-12-04

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kaneko, Kentaro ,  Kodani, Kotaro ,  Nakamura, Junichi ,  Kobayashi, Kazuhiro

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H05K1/113 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2924/0002 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/0341 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A wiring substrate (10) has pads (12) formed from a plurality of metal layers (26,27,28) and vias (13,17,29) connected to the pads. The plurality of metal layers have a metal layer (26) exposed through the wiring substrate, and a first metal layer (27) which is interposed between the metal layer and the vias and which prevents diffusion of metal included in the vias into the metal layer. A second metal layer (28) which is less subject to oxidation than the first metal layer (27) is provided between the vias and the first metal layer (27), and the vias are connected to the second metal layer (28).

公开(公告)号：EP0298422A2

公开(公告)日：1989-01-11

申请号：EP88110710.6

申请日：1988-07-05

Applicant: HITACHI, LTD.

Inventor： Toba, Ritsuji ,  Murakami, Kanji ,  Kawamoto, Mineo

IPC: H05K3/10 ,  H05K3/02

CPC classification number: H05K3/384 ,  H05K3/108 ,  H05K3/385 ,  H05K3/427 ,  H05K2201/0317 ,  H05K2201/0341 ,  H05K2201/0347 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/1157

Abstract: In conducting wiring by masking the portion other than the portion to be wired of a metallic laminate (2) with a photoresist (6) for plating and subjecting only the portion to be wired to pattern plating (7), the provision of a noble metal layer (5) made of gold, platinum or the like, or a metallic layer (5) made of a metal having a larger ionization tendency than that of a metal used in the pattern plating (7) on the metallic layer constituting the undercoat of the photoresist (6) for plating enables the peeling of the resist (6) for plating to be prevented and excellent fine wiring to be conducted.

Abstract translation: 在通过用金属层压体（2）的布线部分以外的部分与用于电镀的光致抗蚀剂（6）进行掩模的接线来进行布线，并且仅使所述布线部分进行图案电镀（7），提供贵金属 或由金，铂等制成的层（5）或金属层（5），金属层（5）由构成底层的金属层上的图案电镀（7）中使用的金属离子化倾向大的金属制成 用于电镀的光致抗蚀剂（6）能够防止用于电镀的抗蚀剂（6）的剥离，并且进行优良的精细布线。