Abstract:
A lighting system comprising a light box housing, a plurality of lighting units including a housing, a plurality of light emitting elements mounted on a PCB within the housing. The light emitting elements arranged on an angled surface such that the light emitting elements emit light in a sideways direction from the lighting units. The lighting units can also be interconnected in a daisy-chain configuration, such that the lighting units form a row of lighting units. The row of lighting units adapted to be mounted within the light box housing, wherein the light box housing comprises one or more rows of lighting units.
Abstract:
An imager assembly for a remote inspection device includes an imager body. A circuit board retainer is slidably received through an end of the imager body. The circuit board retainer has deflectable legs separated by a slot. A circuit board assembly has an imager device connected to a first circuit board. A second circuit board is electrically connected to the first circuit board. The second circuit board is received in the slot of the circuit board retainer and frictionally engaged by the deflectable legs. A flexible tube has a first end connected to an end of the imager body using a first ferrule. A male connector is connected to a second end of the flexible tube using a second ferrule. A wiring harness is disposed through a bore of the flexible tube.
Abstract:
The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) for transmitting electrical current and at least one electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) comprising electrically insulating material, wherein the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) and the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) are arranged in an alternating assembly such that the two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) are electrically insulated with respect to each other by means of the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j), wherein each of the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) is adapted to be coupled to a bond wire (460a, 460b) independently from the other electrically conductive layer (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) at a side surface of the printed circuit board being inclined to the top side and the bottom side of the printed circuit board. The invention further describes a corresponding method of fabricating the printed circuit board. The invention further describes a printed circuit board arrangement comprising the printed circuit board and a corresponding method of fabricating the printed circuit board arrangement.
Abstract:
Die Erfindung schafft eine Beleuchtungsvorrichtung, insbesondere zum Beleuchten von elektronischen Bauelementen und/oder von auf Bauelementeträgern aufgebrachten Markierungen, mit einer ersten Beleuchtungseinheit (111e), welche zumindest ein in einer ersten Beleuchtungsebene angeordnetes erstes Leuchtelement (120) aufweist, und einer zweiten Beleuchtungseinheit (111f), welche zumindest ein in einer zweiten Beleuchtungsebene angeordnetes zweites Leuchtelement (120) aufweist. Die Leuchtelemente sind (120) an einem gemeinsamen Schaltungsträger (110) angeordnet, welcher zumindest einen flächigen ersten starren Bereich (111e) und einen flächigen zweiten starren Bereich (111f) aufweist, wobei die beiden starren Bereiche (111e, 11f) über einen flexiblen Zwischenbereich (113e) des gemeinsamen Schaltungsträgers (110) winklig miteinander verbunden sind. Der erste starre Bereich (111e) stellt die erste Beleuchtungseinheit (111e) und der zweite starre Bereich (111f) stellt die zweite Beleuchtungseinheit (111f) dar, so dass ein Beleuchtungsfeld (135) unter verschiedenen Beleuchtungsrichtungen beleuchtbar ist. Die Erfindung ermöglicht eine Realisierung einer für eine Vielzahl von verschiedenen Beleuchtungssituationen einsetzbaren Beleuchtungsvorrichtung mittels einer einfachen Montagetätigkeit innerhalb einer kompakten Bauform.
Abstract:
The proposed method of producing multifunctional multilayered connection substrates involves the following: the connection substrate is built up function by function from the various components, i.e. signal conducting substrate components (19), power supply substrate components (2), thermal substrate components (20), mechanical substrate components (7), and the arrangement of the components (4) and component-bearing substrate components as interdependent functions or modules, are designed and optimised separately before finally being assigned to spatially separated functional areas (inner/outer) of the circuit. The construction process involves connecting the modules to a circuit which forms the connection substrate. The substrate components with fine, compact, flexible and cool elements are assigned to the inner areas of the circuit, while those substrate components with coarse, rigid and warm elements and/or components are assigned to the outer areas of the circuit; a stiffening support material is applied in the outer area in such a way as to give the circuit a mechanical support structure which is designed to have rigid sections which merge into flexible sections. The circuit can be folded and/or wound according to the rigid and flexible sections. The mechanical support structure can be formed by separately manufactured device housing components or by the device housing.
Abstract:
A plurality of circuit component carrier packages (71) having the same size and shape are stacked adjacent one to another with the faces (72, 74) thereof in contact to form a carrier package assembly (40) in the form of a prismatic or cylindrical solid. Each carrier package houses one or more electrical circuit components (110) and is provided at portions of the faces thereof with electrical contacts (84, 86) which cooperate with similarly located contacts on the faces of adjacent carrier packages to electrically interconnect the circuit components. The carrier package assembly is usable with a flexible, printed circuit board (50) having on one side thereof an array of contact sites (52) selectively interconnected by printed routing traces (54). Electrical contacts on the peripheral surfaces of the carrier packages are coupled with the circuit components housed therein and engage the contact sites on the circuit board when it is wrapped around the carrier package assembly.
Abstract:
Plusieurs boîtiers porteurs (71) de composants de circuit en forme de plaque sont empilés adjacents entre eux avec leurs faces plates (72, 74) en contact pour former un ensemble de boîtiers porteurs (40). Chaque boîtier porteur loge un ou plusieurs composants de circuit électrique (110) couplés à des contacts électriques (84, 86) sur les faces plates et à des contacts électriques (98) ou des broches droites (424, 436) prévues sur les côtés. Ces broches coopèrent avec celles des boîtiers porteurs adjacents pour effectuer une connexion électrique avec les composants des circuits. Une plaquette à circuit imprimé flexible (50) ayant un réseau de sites de contact (52) interconnectés sélectivement par des traces imprimées de routage (54) entoure l'assemblage de boîtier porteur. Les extrémités de l'assemblage de boîtier porteur sont pourvues de blocs connecteurs de support et d'interconnexion électrique (22, 16). Plusieurs assemblages de boîtier porteur peuvent être interconnectés directement, par emboîtement, ou par l'intermédiaire de structures intermédiaires de connexion.
Abstract:
Une pluralité de modules de composants de circuit (71) ayant la même dimension et la même forme sont empilés adjacents les uns aux autres avec leurs faces (72, 74) en contact pour former un assemblage de modules (40) se présentant sous la forme d'un solide prismatique ou cylindrique. Chaque module abrite un ou plusieurs composants de circuit électrique (110) et est pourvu, au niveau de portions de ses faces, de contacts électriques (84, 86) qui coopèrent avec des contacts situés de manière similaire sur les faces de modules adjacents afin d'interconnecter électriquement les composants de circuit. Cet assemblage de modules s'utilise avec une carte de circuits imprimés (50), souple et présentant sur l'une de ses faces un réseau de sites de contact (52) interconnectés sélectivement par des parcours imprimés (54). Des contacts électriques sur les surfaces périphériques des modules sont couplés avec les composants de circuit que ces derniers abritent, et s'engagent dans les sites de contact de la carte de circuits lorsque celle-ci est enroulée autour de l'assemblage de modules.