Abstract:
A printed circuit board for carrying high frequency signals. Conducting structures of the printed circuit board are shaped within breakout regions to limit impedance discontinuities in the signal paths between vias and conductive traces within the printed circuit board. Values of parameters of traces or anti-pads, for example, may be adjusted to provide a desired impedance. The specific values selected as part of designing a printed circuit board may match the impedance of the breakout region to that of the via. The parameters for which values are selected may include the trace width, thickness, spacing, length over an anti-pad or angle of exit from the breakout region.
Abstract:
The invention relates to an electronic network comprising a row of two or more electronic components (121, 122, 123) each having an input terminal (131, 141) and an output terminal (132, 142). All input terminals are interconnected with a conductive input line (151), and all output terminals are interconnected with a conductive output line (152), the input and output lines having a uniform and substantially the same electrical resistance per unit length. The input line is arranged to allow electric charge to flow to each electronic component via the input terminal (131) of the first electronic component (121), and the output line is arranged to allow electric charge to flow away from each electronic component via the output terminal (142) of the last electronic component (123). The electronic network enables a uniform performance of the electronic components, particularly when the input and output lines have a relatively high electrical resistance. The electronic network is therefore particularly suitable for use in an electronic textile (100), wherein the input and output lines are electrically conductive yarns that are interwoven in a textile carrier (110) on which the electronic components are mounted.
Abstract:
The present application discloses a display panel having a plurality of wirings (1,2) in the fan-out area (300) respectively connected to a plurality of signal lines (100) in the display area (200), each of the plurality of wirings in the fan-out area (300) configured to transmit a signal to one of a plurality of subpixels through one of the plurality of signal lines (100) in the display area (200); and a plurality of bonding pads (400) respectively connected to the plurality of wirings (1,2), configured to boned the plurality of wirings (1,2) with a driver integrated circuit. The plurality of wirings (1,2) are grouped into a plurality of groups of wirings (1,2) comprising a first group of a plurality of first wirings (1) and a second group of a plurality of second wirings (2). The plurality of first wirings (1) are made of a first conductive material. The plurality of second wirings (2) are made of a second conductive material. The second conductive material has a resistivity greater than that of the first conductive material.
Abstract:
The present invention relates to a microwave signal transition component (1) having a first signal conductor side (2) and a second signal conductor side (3). The signal transition component (1) is arranged for transfer of microwave signals from the first signal conductor side (2) to the second signal conductor side (3). The transfer component (1) comprises at least one, at least partly circumferentially running, electrically conducting frame (4), a dielectric filling (5) positioned at least partly within said conducting frame (4), at least one filling aperture (6; 6a, 6b) running through the dielectric filling, and, for each filling aperture (6; 6a, 6b), an electrically conducting connection (7; 7a, 7b) that at least partly is positioned within said filling aperture (6; 6a, 6b). The present invention also relates to a method for manufacturing a microwave signal transition component according to the above.
Abstract:
The choice of appropriate dimensions for a transition structure (ÜV) in a conductor-path layout on a thin-film substrate, the transition structure connecting the closely spaced conductor paths (LA) in the region of the heating elements (RH) with the widely spaced conductor paths (LB) in the region of the bonded contacts, enables the conductor-path input resistance (Li) to be made as uniform as possible, at the same time keeping it low. This is achieved by establishing a dimension-determination specification which, for a given set of input data, i.e. the conductor-path widths (da, db) and gap widths (Sa, Sb) in the two zones, and the gap width (Sv) in the transition structure (ÜV), gives the conductor width (dv) in the transition structure as the output.
Abstract:
An array substrate for a liquid crystal display device is provided to increase resistance in a central portion of gate or data link areas and decrease resistance in an outer line, thereby removing a problem of not charging. One link line corresponding to between the first link line and the n/2 link line(DDL1~DDLn/2) is defined as the k link line(DLLk). A link line opposite to the k link line and corresponding to between the n/2 link line and the n link line is defined as the I link line. The first to k link lines and the I to n link lines have one or two refractive portions. The k to l link lines do not have refractive portions.
Abstract:
The present invention relates to a microwave signal transition component (1) having a first signal conductor side (2) and a second signal conductor side (3). The signal transition component (1) is arranged for transfer of microwave signals from the first signal conductor side (2) to the second signal conductor side (3). The transfer component (1) comprises at least one, at least partly circumferentially running, electrically conducting frame (4), a dielectric filling (5) positioned at least partly within said conducting frame (4), at least one filling aperture (6; 6a, 6b) miming through the dielectric filling, and, for each filling aperture (6; 6a, 6b), an electrically conducting connection (7; 7a, 7b) that at least partly is positioned within said filling aperture (6; 6a, 6b). The present invention also relates to a method for manufacturing a microwave signal transition component according to the above.
Abstract:
The border routing of conductive traces in devices, such as displays, touch sensor panels, and touch screens, to improve border area space usage, thereby reducing device size, and to reduce trace resistance, thereby improving device operation, is disclosed. The conductive traces can form a staggered stair-step configuration in the device border area, in which the average widths of the traces can be different from each other and each trace can have segments with different widths. The conductive traces can be coupled to an active area of the device to transmit signals to and from the active area in accordance with a device operation. The varying widths can help improve the border area space usage, reduce trace resistance, and reduce the differences in resistance between traces.
Abstract:
A multilayer ceramic capacitor may include a ceramic body having first to third dielectric layers, first and third internal electrodes disposed to be partially exposed to an upper surface of the ceramic body, second and fourth internal electrodes disposed to be partially exposed to a lower surface of the ceramic body, internal resistance electrodes disposed on the third dielectric layers and partially exposed to the upper surface of the ceramic body, first and third external electrodes disposed on the ceramic body to be connected to the first and third internal electrodes, second and fourth external electrodes disposed to be connected to the second and fourth internal electrodes. The first and third external electrodes are electrically connected to each other by the internal resistance electrodes.