公开(公告)号：EP3113585B1

公开(公告)日：2018-11-28

申请号：EP15750613.0

申请日：2015-02-24

Applicant: NGK Insulators, Ltd.

Inventor： TAKAGAKI Tatsuro ,  IWASAKI Yasunori ,  MIYAZAWA Sugio ,  IDE Akiyoshi ,  NAKANISHI Hirokazu

IPC: H05K1/03 ,  C04B35/111 ,  H05K3/00

CPC classification number: H05K1/115 ,  C04B35/111 ,  C04B35/119 ,  C04B35/634 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/3281 ,  C04B2235/3418 ,  C04B2235/6023 ,  C04B2235/606 ,  C04B2235/612 ,  C04B2235/6582 ,  C04B2235/662 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/95 ,  H01B3/12 ,  H01B17/56 ,  H05K1/03 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/0014 ,  H05K3/0029 ,  H05K2201/09009 ,  Y10T428/24273

Abstract: It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 µ m, and a diameter of the through hole is 20 to 100 µ m. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 µ m in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 µ m.

公开(公告)号：EP3007183A4

公开(公告)日：2017-02-08

申请号：EP14834338

申请日：2014-08-07

Applicant: LG CHEMICAL LTD

Inventor： KIM JAE HYUN ,  SEONG EUN KYU ,  LEE SU JEONG ,  KIM JAE JIN ,  PARK CHEOL-HEE ,  PARK CHEE-SUNG ,  JUN SHIN HEE ,  JUNG SANG YUN ,  JEONG HAN NAH

IPC: H01B13/00 ,  C08J7/04 ,  C23C18/16 ,  C23C18/20 ,  C23C18/22 ,  C23C18/30 ,  C25D5/02 ,  C25D5/56 ,  H05K3/02 ,  H05K3/18

CPC classification number: C23C18/31 ,  C09D5/24 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1689 ,  C23C18/204 ,  C23C18/2053 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C25D5/02 ,  C25D5/56 ,  H05K1/0296 ,  H05K1/09 ,  H05K3/02 ,  H05K3/181 ,  H05K2201/09009

Abstract: Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers under a relatively low power by a simplified process, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed thereon. The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate containing carbon-based black pigment; forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.

Abstract translation: 本发明提供一种即使在聚合物中不含有特定的无机添加剂的情况下，也能够通过简单的工序以较低的功率在各种聚合物树脂制品或树脂层上直接照射能够形成微细的导电图案的电磁波而形成导电图案的方法 树脂本身以及其上形成有导电图案的树脂结构。 通过电磁波的直接辐射来形成导电图案的方法包括：通过在包含碳基黑色颜料的聚合物树脂基板上选择性地辐射电磁波来形成具有预定表面粗糙度的第一区域; 在聚合物树脂基底上形成导电种子; 通过电镀形成有导电晶种的聚合物树脂基板形成金属层; 以及从聚合物树脂基板的第二区域去除导电种子和金属层，其中第二区域的表面粗糙度小于第一区域的表面粗糙度。

公开(公告)号：EP3071002A1

公开(公告)日：2016-09-21

申请号：EP14876888.0

申请日：2014-12-29

Applicant: Kunshan Visionox Display Co., Ltd.

Inventor： AN, Leping ,  WANG, Long ,  GAO, Ming ,  HONG, Yao ,  PU, Bin

IPC: H05K1/02

CPC classification number: H05K1/028 ,  G06F3/041 ,  G06F2203/04107 ,  H05K1/0213 ,  H05K1/0215 ,  H05K2201/053 ,  H05K2201/09009

Abstract: The present invention discloses a flexible circuit board. The flexible circuit board comprises a base portion and a grounding soft board extending from the base portion, the grounding soft board comprising a board body connected to the base portion and a contact end provided at a free end of the board body, the contact end comprising a bonding region and a windowing copper exposure region arranged inside the bonding region, and the board body being in a curved shape. According to the present invention, by making improvements on the bonding area between the grounding soft board and the shielding layer and on the shape of the soft board, and by increasing the bonding power and dispersing the folding stress, the grounding soft board is prevented from falling off at portions contacting the shielding layer when folded or transported.

Abstract translation: 本发明公开了一种柔性电路板。 柔性电路板包括从基部延伸的基部和接地软板，接地软板包括连接到基部的板本体和设置在板本体的自由端的接触端，所述接触端包括 接合区域和布置在接合区域内的开窗铜曝光区域，并且板体呈弯曲形状。 根据本发明，通过对接地软板和屏蔽层之间的接合面积以及软板的形状进行改进，并且通过增加接合力和分散折叠应力，可以防止接地软板 在折叠或运输时与屏蔽层接触的部分脱落。

公开(公告)号：EP3113586A4

公开(公告)日：2017-10-25

申请号：EP15754711

申请日：2015-02-20

Applicant: NGK INSULATORS LTD

Inventor： TAKAGAKI TATSURO ,  IWASAKI YASUNORI ,  MIYAZAWA SUGIO ,  IDE AKIYOSHI ,  NAKANISHI HIROKAZU

IPC: H05K1/03 ,  C04B35/111 ,  H05K3/00

CPC classification number: H05K1/115 ,  C04B35/111 ,  C04B35/119 ,  C04B35/634 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/3281 ,  C04B2235/3418 ,  C04B2235/6023 ,  C04B2235/606 ,  C04B2235/612 ,  C04B2235/6582 ,  C04B2235/662 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/95 ,  H01B3/12 ,  H01B17/56 ,  H05K1/03 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/0014 ,  H05K3/0029 ,  H05K2201/09009 ,  Y10T428/24273

Abstract: It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 µ m, and a diameter of the through hole is 20 to 100 µ m. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 µ m in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 µ m.

公开(公告)号：EP3007182A4

公开(公告)日：2017-02-08

申请号：EP14833847

申请日：2014-08-07

Applicant: LG CHEMICAL LTD

Inventor： KIM JAE HYUN ,  JUN SHIN HEE ,  KIM JAE JIN ,  PARK CHEE-SUNG ,  SEONG EUN KYU ,  LEE SU JEONG ,  PARK CHEOL-HEE ,  JEONG HAN NAH ,  JUNG SANG YUN

IPC: H01B13/00 ,  C08J7/04 ,  C23C18/16 ,  C23C18/20 ,  C23C18/22 ,  C23C18/30 ,  C25D5/02 ,  C25D5/56 ,  H01B5/14 ,  H05K3/02 ,  H05K3/18

CPC classification number: C23C18/31 ,  C09D5/24 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1689 ,  C23C18/204 ,  C23C18/2053 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C25D5/02 ,  C25D5/56 ,  H05K1/0296 ,  H05K1/09 ,  H05K3/02 ,  H05K3/181 ,  H05K2201/09009

Abstract: Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers under a relatively low power by a simplified process, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed thereon. The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate containing carbon-based black pigment; forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.

Abstract translation: 本发明提供了即使没有在聚合物中含有特定的无机添加剂由能够通过简化的工艺下相对低的功率上形成各种聚合物树脂产品或树脂层微细的导体图案的电磁波的辐射直接形成导体图案的方法 树脂本身，并具有树脂结构的导电性图案形成在其上。 用于形成由电磁波的辐射直接的导电图的方法包括：形成具有通过选择性地辐射含在基于碳的黑色颜料的聚合物树脂基材的电磁波的预定表面粗糙度的第一区域; 形成在聚合物树脂基板导电种子; 通过电镀具有导电种子形成于其上的聚合物树脂衬底上形成的金属层; 和去除所述导电种子和从聚合物树脂基板的第二区域中的金属层，worin所述第二区域具有的表面粗糙度比所述第一区域小。

公开(公告)号：EP3032548A1

公开(公告)日：2016-06-15

申请号：EP14834164.7

申请日：2014-07-24

Applicant: LG Chem, Ltd.

Inventor： KIM, Jae Hyun ,  KIM, Jae Jin ,  PARK, Cheol-Hee ,  PARK, Chee-Sung ,  JUN, Shin Hee ,  JUNG, Sang Yun ,  JEONG, Han Nah

IPC: H01B13/00 ,  H01B5/14 ,  C08J7/06

CPC classification number: C23C18/31 ,  C09D5/24 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1689 ,  C23C18/204 ,  C23C18/2053 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C25D5/02 ,  C25D5/56 ,  H05K1/0296 ,  H05K1/09 ,  H05K3/02 ,  H05K3/181 ,  H05K2201/09009

Abstract: Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers by a simplified process, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed thereon.
The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate; forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.

Abstract translation: 提供了用于由能够通过简化的工艺上形成的各种聚合物树脂产品或树脂层微细的导体图案的电磁波的辐射直接形成导体图案的方法，即使没有在所述聚合物树脂本身含有特定的无机添加剂，以及一个 树脂结构体具有导电图案形成在其上。 用于形成由电磁波的辐射直接的导电图的方法包括：形成具有通过选择性地辐射在聚合物树脂基板的电磁波的预定表面粗糙度的第一区域; 形成在聚合物树脂基板导电种子; 通过电镀具有导电种子形成于其上的聚合物树脂衬底上形成的金属层; 和去除所述导电种子和从聚合物树脂基板的第二区域中的金属层，worin所述第二区域具有的表面粗糙度比所述第一区域小。

公开(公告)号：EP3000904A2

公开(公告)日：2016-03-30

申请号：EP15170556.3

申请日：2013-03-26

Applicant: JX Nippon Mining & Metals Corporation

Inventor： NAGAURA, Tomota ,  KOHIKI, Michiya ,  MORIYAMA, Terumasa

IPC: C22C9/00 ,  H05K3/06

CPC classification number: H05K1/09 ,  B32B3/30 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/08 ,  C22C9/00 ,  C25D1/04 ,  C25D3/12 ,  C25D3/38 ,  C25D5/12 ,  C25D9/08 ,  H05K1/0313 ,  H05K3/022 ,  H05K3/025 ,  H05K3/06 ,  H05K3/181 ,  H05K3/188 ,  H05K3/381 ,  H05K3/383 ,  H05K3/388 ,  H05K2201/09009 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/12847 ,  Y10T428/12903 ,  Y10T428/1291

Abstract: Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 µm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.

Abstract translation: 本发明提供一种印刷电路板用铜箔，其至少一个面上具有粗糙化层。 在粗糙层中，粒子底部与粒子底部相距粒子长度的10％的平均直径D1为0.2至1.0μm，并且粒子长度L1与平均直径D1之比L1 / D1 在颗粒底部是15或更小。 在用于印刷线路板的铜箔中，当具有粗糙层的印刷线路用铜箔被层压到树脂上，然后通过蚀刻除去铜层时，包含不均匀性的树脂粗糙化表面的孔面积之和为 20％以上。 本发明涉及开发一种用于半导体封装基板的铜箔，其能够避免电路腐蚀而不会导致铜箔的其他性能劣化。 特别地，本发明的目的是提供一种用于印刷线路板的铜箔及其制造方法，其中通过改善粗糙化层可以提高铜箔与树脂之间的粘合强度 的铜箔。

公开(公告)号：US12014868B2

公开(公告)日：2024-06-18

申请号：US17165933

申请日：2021-02-02

Applicant: CYNTEC CO., LTD.

Inventor： Yi-Cheng Lin

IPC: H05K1/09 ,  H01F27/255 ,  H01F41/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40 ,  H01F1/22

CPC classification number: H01F41/0233 ,  H01F27/255 ,  H01F41/0246 ,  H05K1/09 ,  H05K1/111 ,  H05K1/18 ,  H05K3/341 ,  H05K3/40 ,  H01F1/22 ,  H05K2201/09009 ,  H05K2201/10007

Abstract: An electrode structure on a circuit board, the electrode structure comprising a metal structure disposed on and electrically connected to the circuit board, wherein the metal structure and a surface of the circuit board forms a space therebetween, wherein at least one first electrical component is disposed in the space and an outer surface of the metal structure forms an electrode for electrically connecting with an external component.

公开(公告)号：US20190215956A1

公开(公告)日：2019-07-11

申请号：US16358315

申请日：2019-03-19

Applicant: International Business Machines Corporation

Inventor： Eric J. CAMPBELL ,  Joseph KUCZYNSKI ,  Timothy J. TOFIL

IPC: H05K1/03 ,  H05K1/02 ,  B29C35/02

CPC classification number: H05K1/0353 ,  B29C35/02 ,  B29C35/0272 ,  B29K2105/0872 ,  B29K2105/162 ,  B29K2995/0008 ,  B29L2031/3425 ,  H05K1/0201 ,  H05K2201/068 ,  H05K2201/09009

Abstract: A composite material incorporates multi-compartment microcapsules that produce heat when subject to a stimulus such as a compressive force or a magnetic field. The stimulus ruptures an isolating structure within the multi-compartment microcapsule, allowing reactants within the multi-compartment microcapsule to produce heat from an exothermic reaction. In some embodiments, the composite material is a laminate used in the manufacture of multi-layer printed circuit boards (PCBs) and provides heat during the curing process of the multi-layer PCBs to ensure a consistent thermal gradient in the multi-layer product.

公开(公告)号：US20180356048A1

公开(公告)日：2018-12-13

申请号：US15697149

申请日：2017-09-06

Applicant: Fluence Bioengineering

Inventor： Dung Duong ,  Randy Johnson ,  Nick Klase

IPC: F21K9/232 ,  F21V29/83 ,  F21V29/70 ,  H05K1/02

CPC classification number: F21V23/005 ,  A01G7/045 ,  F21K9/232 ,  F21K9/90 ,  F21S4/28 ,  F21V7/005 ,  F21V7/0066 ,  F21V7/05 ,  F21V15/015 ,  F21V17/107 ,  F21V19/0015 ,  F21V19/003 ,  F21V23/001 ,  F21V23/02 ,  F21V23/0442 ,  F21V29/70 ,  F21V29/74 ,  F21V29/83 ,  F21Y2103/10 ,  F21Y2105/16 ,  F21Y2115/10 ,  H05B33/0854 ,  H05B37/0227 ,  H05B37/0272 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0274 ,  H05K1/0277 ,  H05K1/05 ,  H05K1/056 ,  H05K1/181 ,  H05K1/182 ,  H05K1/185 ,  H05K3/0014 ,  H05K3/28 ,  H05K3/32 ,  H05K3/44 ,  H05K2201/066 ,  H05K2201/09009 ,  H05K2201/10106

Abstract: Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing metal core PCB (MCPCB) for thermal, mechanical, and/or optical controls.