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    METHOD FOR FORMING A COATING ON AN ELECTRONIC OR ELECTRICAL DEVICE
    43.
    发明申请
    METHOD FOR FORMING A COATING ON AN ELECTRONIC OR ELECTRICAL DEVICE 审中-公开
    在电子或电气设备上形成涂层的方法

    公开(公告)号：WO2016198855A1

    公开(公告)日：2016-12-15

    申请号：PCT/GB2016/051686

    申请日：2016-06-08

    Applicant: P2I LTD

    Inventor： COULSON, Stephen Richard ,  EVANS, Delwyn ,  HELLWIG, Thomas ,  HOPPER, Fred ,  POULTER, Neil ,  SIOKOU, Angeliki ,  TELFORD, Clive

    IPC: H05K3/28 ,  B05D1/00

    CPC classification number: H05K3/285 ,  B05D1/62 ,  B05D5/083 ,  H05K2201/09872 ,  H05K2203/095

    Abstract: An electronic or electrical device or component thereof having a coating formed thereon by exposing said electronic or electrical device or component thereof to a plasma comprising one or more monomer compounds for a sufficient period of time to allow a protective polymeric coating to form on a surface thereof;wherein the protective polymeric coating forms a physical barrier over a surface of the electronic or electrical device or component thereof; wherein each monomer is a compound of formula I(a): I(a) or a compound of formula I(b) wherein each of R 1 to R 9 is independently selected from hydrogen or halogen or an optionally substituted C 1 -C 6 branched or straight chain alkyl group; each X is independently selected from hydrogen or halogen; a is from 0-6; b is from 2 to 14; and c is 0 or 1;and wherein when each X is F or when at least one X is halogen, in particular F, the FTIR/ATR intensity ratio of CX 3 /C=O of the coating is less than (c+1)0.6e -0.1n where n is a+b+c+1;and wherein when each X is H the FTIR/ATR intensity ratio of CX 3 /C=O is less than (c+1) 0.25±0.02, optionally wherein the barrier is a conformal physical barrier.

    Abstract translation: 通过将所述电子或电气设备或其组件暴露于包含一种或多种单体化合物的等离子体足够长的时间以使其在其表面上形成保护性聚合物涂层而形成有涂层的电子或电气设备或其组件 ;其中所述保护性聚合物涂层在所述电子或电气设备或其部件的表面上形成物理屏障; 其中每个单体是式I（a）的化合物：I（a）或式I（b）的化合物，其中R 1至R 9各自独立地选自氢或卤素或任选取代的C 1 -C 6支链或直链 烷基; 每个X独立地选自氢或卤素; a是0-6; b为2〜14; 并且c为0或1;并且其中当每个X为F时或当至少一个X为卤素时，特别是F时，涂层的CX 3 / C = O的FTIR / ATR强度比小于（c + 1） 0.6e-0.1n其中n是a + b + c + 1;并且其中当每个X是H时，CX3 / C = O的FTIR / ATR强度比小于（c + 1）0.25±0.02，任选地其中 屏障是保形物理障碍。

    POLYMERIC MATERIALS WITH NANOSCALE FUNCTIONAL COATINGS
    45.
    发明申请
    POLYMERIC MATERIALS WITH NANOSCALE FUNCTIONAL COATINGS 审中-公开
    具有纳米功能涂层的聚合材料

    公开(公告)号：WO2014070750A1

    公开(公告)日：2014-05-08

    申请号：PCT/US2013/067280

    申请日：2013-10-29

    Applicant: YOKLEY, Edward Maxwell ,  OBENG, Yaw Samuel

    Inventor： YOKLEY, Edward Maxwell ,  OBENG, Yaw Samuel

    IPC: B05D1/38 ,  B05D3/04 ,  B05D3/06

    CPC classification number: H05K1/185 ,  B05D1/62 ,  B05D3/142 ,  B05D3/144 ,  B29C59/14 ,  C03C23/006 ,  C03C2218/31 ,  H05K3/284 ,  H05K2201/0104 ,  H05K2201/0195 ,  H05K2201/09872 ,  H05K2203/095

    Abstract: A film deposition process comprising exposing a surface of a substrate to a first plasma treatment having plasma reactants in a plasma chamber to form an activated substrate surface. The activated surface has a lower water contact angle than the substrate surface before the surface activating. The process comprises introducing water vapor into the plasma chamber to form a water layer on the activated surface. The process comprises introducing pre-cursors molecules into the plasma chamber in the presence of a second plasma to graft a layer of reacted pre-cursor molecules on the water layer.

    Abstract translation: 一种成膜方法，包括将衬底的表面暴露于在等离子体室中具有等离子体反应物的第一等离子体处理以形成活化的衬底表面。 激活的表面在表面激活之前具有比基底表面更低的水接触角。 该方法包括将水蒸气引入等离子体室中以在活化表面上形成水层。 该方法包括在存在第二等离子体的情况下将预游离子分子引入等离子体室，以在水层上移植一层反应的前体分子。

    CLOSED-LOOP BUBBLE ELIMINATION SYSTEM AND METHODS FOR APPLYING A CONFORMAL COATING MATERIAL TO A SUBSTRATE
    46.
    发明申请
    CLOSED-LOOP BUBBLE ELIMINATION SYSTEM AND METHODS FOR APPLYING A CONFORMAL COATING MATERIAL TO A SUBSTRATE 审中-公开
    封闭式气泡消除系统及将一种合适涂层材料应用于基材的方法

    公开(公告)号：WO2008086429A1

    公开(公告)日：2008-07-17

    申请号：PCT/US2008/050651

    申请日：2008-01-09

    Applicant: NORDSON CORPORATION ,  HOGAN, Patrick ,  DE SANCTIS, Gareth

    Inventor： HOGAN, Patrick ,  DE SANCTIS, Gareth

    IPC: B05B9/04 ,  B05C11/10

    CPC classification number: B05B9/0423 ,  B05B7/24 ,  B05B9/002 ,  B05C11/1039 ,  B05C11/1047 ,  H05K3/0091 ,  H05K2201/09872 ,  H05K2203/0126

    Abstract: Systems and methods for applying a conformal coating material to a substrate, such as an electronic component or circuit board. The systems and methods rely on a pressure- regulated fluid circulation loop (56, 64, 66, 74) connecting an outlet (51) of a pump (52) with an inlet (75) of a pump (52) and an applicator (16) that is connected in fluid communication with the fluid circulation loop. Amounts of the conformal coating material dispensed by the applicator (16), which are diverted from the fluid circulation loop, may be replenished by fresh amounts supplied from a non-pressurized reservoir (50), which are siphoned by the pump (52) into the fluid circulation loop.

    Abstract translation: 将适形涂层材料施加到诸如电子部件或电路板的基底的系统和方法。 系统和方法依赖于将泵（52）的出口（51）与泵（52）的入口（75）和施加器（52）连接的压力调节流体循环回路（56,64,66,74） 16），其与流体循环回路流体连通。 通过从流体循环回路转向的涂抹器（16）分配的保形涂层材料的量可以由从泵（52）虹吸的非加压储存器（50）供应的新鲜量补充到 流体循环回路。

    COATED ELECTRICAL ASSEMBLY
    49.
    发明申请
    COATED ELECTRICAL ASSEMBLY 审中-公开
    镀膜电气装配

    公开(公告)号：WO2017125741A1

    公开(公告)日：2017-07-27

    申请号：PCT/GB2017/050125

    申请日：2017-01-19

    Applicant: SEMBLANT LIMITED

    Inventor： SINGH, Shailendra Vikram ,  ARESTA, Gianfranco ,  BROOKS, Andrew Simon Hall ,  HENNIGHAN, Gareth

    IPC: H05K3/28 ,  B05D1/00

    CPC classification number: H05K3/285 ,  B05D1/62 ,  B05D5/08 ,  H05K3/282 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/122 ,  H05K2203/1322

    Abstract: An electrical assembly which has a multi-layer conformal coating comprising three or more layers on at least one surface of the electrical assembly, wherein the lowest layer of the multi-layer conformal coating, which is in contact with the at least one surface of the electrical assembly, is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O 2 , N 2 O, NO 2 , H 2 , NH 3 and/or N 2 , and (c) optionally He, Ar and/or Kr; the uppermost layer of the multi-layer conformal coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O 2 , N 2 O, NO 2 , H 2 , NH 3 and/or N 2 , and (c) optionally He, Ar and/or Kr; and the multi-layer coating comprises one or more layers which is obtainable by plasma deposition of a precursor mixture comprising (a) one or more hydrocarbon compounds of formula (A), (b) optionally NH 3 , N 2 O, N 2 , NO 2 , CH 4 , C 2 H 6 , C 3 H 6 and/or C 3 H 8 , and (c) optionally He, Ar and/or Kr, Z 1 represents C 1 -C 3 alkyl or C 2 -C 3 alkenyl; Z 2 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl; Z 3 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl; Z 4 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl; Z 5 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl; and Z 6 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl.

    Abstract translation: 一种电气组件，其具有在电气组件的至少一个表面上包括三层或更多层的多层保形涂层，其中多层保形涂层的最下层接触 （a）一种或多种有机硅化合物，（b）任选地O 2，N 2，N 2，N 2， 0，NO 2，H 2，NH 3和/或N 2，和（c ）任选地，He，Ar和/或Kr; （a）一种或多种有机硅化合物，（b）任选的O 2，N 2，N 2，N 2，N，N，N，N，N，N-二甲基甲酰胺或其混合物的前体混合物的等离子体沉积可获得多层保形涂层的最上层。 O，NO 2，H 2，NH 3和/或N 2，以及（c） 任选地，He，Ar和/或Kr; （a）一种或多种式（A）的烃化合物，（b）任选地为NH 3的前体混合物，所述一种或多种层可通过等离子体沉积得到， N 2 0，N 2，NO 2，CH 4，C 2，N 4， H 6 6，C 3 H 6和/或C 3 H 8， 和（c）任选地，He，Ar和/或Kr，Z 1表示C 1 -C 3烷基或C 1 -C 2烷基， -C 3 -C 3链烯基; Z 2表示氢，C 1 -C 3烷基或C 2 -C 3烷基， 链烯基; Z 3表示氢，C 1 -C 3 - 烷基或C 2 -C 3 - 烷基， 链烯基; Z 4表示氢，C 1 -C 3烷基或C 2 -C 3烷基， 链烯基; Z 5表示氢，C 1 -C 3烷基或C 2 -C 3烷基， 链烯基; 且Z 6表示氢，C 1 -C 3烷基或C 2 -C 3环烷基， / sub>烯基。

    THERMAL MATERIAL WITHIN A DEVICE
    50.
    发明申请
    THERMAL MATERIAL WITHIN A DEVICE 审中-公开
    在设备中的热物质

    公开(公告)号：WO2017030744A1

    公开(公告)日：2017-02-23

    申请号：PCT/US2016/043797

    申请日：2016-07-25

    Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

    Inventor： PENTTINEN, Juha Erkki Antero

    IPC: H05K1/02 ,  H05K3/28

    CPC classification number: H05K7/20436 ,  H05K1/0204 ,  H05K1/0209 ,  H05K3/0091 ,  H05K3/284 ,  H05K3/285 ,  H05K3/303 ,  H05K2201/0162 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2203/1316

    Abstract: In an embodiment, thermal conductive material within a device having electrical component is described. In an embodiment, a device is disclosed comprising: a printed circuit board comprising electrical components; a housing of the device, wherein the housing substantially encloses the printed circuit board; a thermal conductive material coated on the printed circuit board, wherein the thermal conductive material is configured to coat an interface between an electrical component and the printed circuit board, and wherein the thermal conductive material is located between the printed circuit board and a portion of the housing according to both a three dimensional topography of the printed circuit board and a three dimensional shape of the portion of the housing.

    Abstract translation: 在一个实施例中，描述了具有电气部件的装置内的导热材料。 在一个实施例中，公开了一种装置，包括：包括电气部件的印刷电路板; 所述装置的壳体，其中所述壳体基本上包围所述印刷电路板; 涂覆在所述印刷电路板上的导热材料，其中所述导热材料被配置为涂覆电气部件和所述印刷电路板之间的界面，并且其中所述导热材料位于所述印刷电路板和所述印刷电路板的一部分之间 根据印刷电路板的三维形状以及壳体的一部分的三维形状的外壳。

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