Bonder chuck and optical component mounting structure interface

    公开(公告)号:AU4908601A

    公开(公告)日:2001-09-17

    申请号:AU4908601

    申请日:2001-03-01

    Applicant: AXSUN TECH INC

    Abstract: An optical component is adapted for pick-and-place-style installation on an optical submount or bench and compatible with a chuck of a bonder that picks-up the optical component, places it on the optical bench, and then typically solder bonds the optical component to the bench. In the current implementation, this optical component comprises an optical element, such as an optical fiber, lens, or MOEMS device, that is attached to a plastically deformable mounting structure. The optical component has a bench-attach surface that is used to bond the optical component to an optical bench. Further, the optical component has a bonder chuck engagement surface to which a bonder chuck attaches to manipulate the optical component, such as install it, on the optical bench.

    55.
    发明专利
    未知

    公开(公告)号:DE60029125D1

    公开(公告)日:2006-08-10

    申请号:DE60029125

    申请日:2000-11-14

    Applicant: AXSUN TECH INC

    Abstract: Mounting and alignment structures for optical components allow optical components to be connected to an optical bench and then subsequently aligned, i.e., either passively or actively, in a manufacturing or subsequent calibration or recalibration, alignment or realignment processes. The structures comprise quasi-extrusion portions. This portion is "quasi-extrusion" in the sense that it has a substantially constant cross section in a z-axis direction as would be yielded in an extrusion manufacturing process. The structures further comprise at least one base, having a laterally-extending base surface, and an optical component interface. At least one armature connects the optical component interface with the base. In the preferred embodiment, the base surface is securable to an optical bench.

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