公开(公告)号：EP0310357A2

公开(公告)日：1989-04-05

申请号：EP88308996.3

申请日：1988-09-28

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Carey, David H.

IPC: H05K1/00

CPC classification number: H01L23/5383 ,  H01L23/4985 ,  H01L23/5382 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/09701 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0289 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A customizable circuit using a programmable interconnect and a compatible TAB chip bonding design. The programmable interconnect comprises layers of wire segments forming programmable junctions rather than continuous wires. This segmentation is performed with an offset from line to line in each layer such that the ends of the segments in each layer form along diagonal lines having a pitch determined by the basic wire segment length. The terminal ends of each of these segments are positioned in a plane such that the segments may be connected by short lengths to form the desired interconnect. The links which join the line segments represent the customization of the otherwise undedicated interconnect. The TAB chip bonding design uses a carrier tape to bond the integrated circuit chips to the programmable interconnect. Also disclosed are methods for forming the interconnect and the TAB chip bonding design.

Abstract translation: 使用可编程互连和兼容TAB芯片接合设计的可定制电路。 可编程互连包括形成可编程结而不是连续导线的线段层。 该分割是利用每一层中的线对线的偏移来执行的，使得每个层中的段的端部沿着具有由基本线段长度确定的间距的对角线形成。 这些片段中的每一个的末端位于平面中，使得片段可以通过短长度连接以形成所需的互连。 连接线段的链接代表了否定的未互连互连的定制。 TAB芯片接合设计使用载带将集成电路芯片连接到可编程互连。 还公开了用于形成互连和TAB芯片接合设计的方法。

公开(公告)号：EP0268971A3

公开(公告)日：1988-08-17

申请号：EP87116898

申请日：1987-11-16

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Potter, Curtis Nathan

IPC: H01L21/48 ,  H01L23/14

CPC classification number: H05K3/4685 ,  H01L21/4857 ,  H01L23/5381 ,  H01L2924/0002 ,  H05K3/205 ,  H01L2924/00

Abstract: A method of fabricating an anodic aluminum support system having an air bridge for metallic conductors. The method includes providing two or more metal layers separated by a coating of aluminum creating a multiple layer electrical interconnect system. The method includes the step of anodizing the aluminum and applying a photoresist mask to spaced portions of the top of the system. Thereafter, an etching solution is applied to the top of the system for removing the anodized aluminum, except for the portions covered by the mask, thereby providing a multilayer conductor system supported by pillars of anodic aluminum surrounded by low dielectric air.

公开(公告)号：EP0267772A2

公开(公告)日：1988-05-18

申请号：EP87309904.8

申请日：1987-11-09

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Herrell, Dennis, J. ,  Gupta, Omkarnath Ramnath ,  Hilbert, Claude

IPC: H01L23/467 ,  H01L23/367

CPC classification number: H01L23/467 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A heat exchanger for cooling or heating an object, which heat exchanger (10) comprises a plurality of spaced apart substantially parallel thermally conductive fins (18, 20) characterized in that diverting means (26, 26 b , 26 e , 26 f , 58) are provided which, when a gas is introduced in one direction into said heat exchanger (10) diverts at least part of said gas in a second direction generally perpendicular to said one direction.
In one embodiment, the heat exchanger (10) comprises two interdigitated sets of oppositely facing cooling fins (18, 20) which are of generally right-angled triangular configuration. Cooling air is introduced downwardly into the heat exchanger (10) from duct (16) and is diverted horizontally by the hypotenuse of the cooling fins (18, 20). The cooling air leaves the heat exchanger (19) in mutually opposite directions through the passageways (30) formed between adjacent fins in each set of fins. The heat exchanger (10) is particularly useful as a heat sink for use with electronic chips (12).
Several other embodiments are described.

Abstract translation: 一种用于冷却或加热物体的热交换器，所述热交换器（10）包括多个间隔开的基本上平行的导热翅片（18,20），其特征在于，提供转向装置（26,26b，26e，26f，58） 当将气体沿一个方向引入所述热交换器（10）时，所述气体在大致垂直于所述一个方向的第二方向上转移至少部分所述气体。 在一个实施例中，热交换器（10）包括两个互相指向的一组相对的冷却翅片（18,20），其具有大致直角的三角形构造。 冷却空气从管道（16）向下引入到热交换器（10）中，并且被冷却翅片（18,20）的斜边水平地转向。 冷却空气通过形成在每组翅片中的相邻翅片之间的通道（30）沿彼此相反的方向离开热交换器（19）。 热交换器（10）特别适用于与电子芯片（12）一起使用的散热器。 描述几个其它实施例。