Abstract:
본 발명은 정렬시스템에 대응하여 웨이퍼를 정렬 위치시키도록 하기 위한 정렬마크와 이를 이용한 노광정렬시스템 및 그 정렬방법에 관한 것으로서, 이를 구현하기 위한 정렬마크는, 화학적 기계적 폴리싱 공정이 적용되는 층의 하부층 내에 메사 또는 트렌치 형상의 단위마크가 소정 간격으로 복수개 배열되어 정렬 공정시 정렬신호를 형성하는 정렬마크에 있어서, 상기 단위마크 내에 화학적 기계적 폴리싱 공정시 디싱 현상을 방지하기 위한 정도의 밀도로 적어도 하나 이상의 메사 또는 트렌치 패턴이 인라인 배열되어 이루어진다. 이에 따르면 종래 정렬마크의 각 단위마크 범위 내에 메사 또는 트렌치 패턴이 배열되어 조사되는 소정 파장의 광과 다른 파장의 광에 대응하여 세분하여 각각의 정렬 위치가 검출하게 됨으로써 종래의 정렬시스템을 호환할 수 있을 뿐 아니라 보다 향상된 정확도로 신뢰도가 향상되며, 화학적 기계적 폴리싱 공정에 대응하여 충분한 밀도를 이루어 디싱 현상이 방지되는 등의 효과가 있다.
Abstract:
PURPOSE: Semiconductor wafer exposure equipment with focus error prevention capability is provided to effectively eliminate the particles existing on the upper surface of a wafer fixing chuck by improving the structure of the wafer fixing chuck. CONSTITUTION: A wafer supporting pin(31) for settling a wafer is installed in a protrusion(33a) inside a wafer cleaning apparatus(30). The wafer cleaning apparatus includes a chamber in which a vacuum absorbing member for removing the particles existing on the bottom of the wafer through vacuum absorption is installed. A vacuum line(41a) is formed in the vacuum absorbing member. A stem(41) transfers vertically and rotates in a predetermined direction by a drive unit. A disc plate(43) extends to the upper surface of the stem and includes a plurality of vacuum holes(43a) connected to the vacuum line.
Abstract:
PURPOSE: A method for measuring fail probability by only defect, method for measuring defect limited yield using classification the extracted defect pattern's parameter, and system for measuring fail probability by only defect and the defect limited yield are provided to be capable of obtaining fail probability by the inspected block and by the wafer chip using defect inspection data alone. CONSTITUTION: A plurality of defect generated chips are firstly divided into the first chip group having fail and the second chip group having no fail(S1). The defect generated chips are secondly divided using the first maximum value out of the total sum of the size of defects located in the left and right peripheral region of X-axis as a reference(S21,S22). When the first maximum value is lower than the first reference value, the third dividing process is carried out using the second maximum value out of the total sum of the size of defects by the segment as a reference(S31,S32). When the second maximum value is lower than the second reference value, the fourth dividing process is carried out using the total sum of the surface of defects located in a chip as a reference(S41,S42).
Abstract:
PURPOSE: A developing apparatus capable of controlling a temperature of development solution and a developing method are provided to improve the inequality of critical dimension occurring in development processing by installing a temperature controller controlling a temperature of development solution. CONSTITUTION: A developing apparatus comprises a sealed reaction chamber(150), a chuck part(100) located in the lower portion of the sealed reaction chamber(150), a wafer(110) on the chuck part(100), a nozzle part(130) capable of spraying a development solution on the wafer(110) located on the upper portion of the sealed reaction chamber(150), and a temperature controller(140) having thermal-detection sensors(142) and thermal-controllers(144) located over the wafer(110) in the sealed reaction chamber(150). At this point, the temperature of the development solution is controlled uniformly.
Abstract:
PURPOSE: A system of monitoring a developed state of a glass disk photoresist for manufacturing an optical disk is provided to use a CCD to sense information on a diffracted light passing through a glass disk, and to calculate the developed state of the photoresist as data by a controller on the basis of the information. CONSTITUTION: A reflector(22) is set between a light source and a glass disk(12). A CCD(20) senses information on a diffracted light, which is irradiated from the light source and passes through the glass disk(12). A controller(25) calculates a developed state of a photoresist applied to the glass disk(12) as data by the sensed information.
Abstract:
PURPOSE: Provided are an optical polyimide monomer and an optical polyimide compound, having low light-absorption loss and high heat-resistance and preventing cleavage of a thin film in an etching process, and a preparation thereof. CONSTITUTION: The optical polyimide monomer (formula 1) is produced by a process comprising the steps of: dissolving diol and 2-chloro-5-nitrobenzotrifluoride in N,N-dimethylacetamide; adding potassium carbonate, t-butylammonium chloride, and copper powder to the resultant and heating; eliminating the copper from the resultant and precipitating and recrystallizing in acetic acid to obtain a dinitro compound; dissolving the dinitro compound in tetrahydrofurane and reducing in the presence of a catalyst. And the polyimide compound (formula 3) is produced by a process comprising the steps of: dissolving the polyimide monomer (formula 1) and a dianhydride (formula 2) in dimethylacetamide; stirring the resultant under nitrogen to form polyamic acid; coating a silicon substrate with the polyamic acid; heating the polyamic acid coated substrate. In the formula, X is chlorine, bromine, or halogenated alkyl, Ar is an aromatic ring group or a halogenated aromatic ring group, Z is partially/wholly fluorinated or chlorinated aromatic cyclic group, partially/wholly fluorinated or chlorinated ring type aliphatic group, partially/wholly fluorinated or chlorinated aliphatic group, or a connection structure thereof connected by a hetero atom.
Abstract:
PURPOSE: A method for manufacturing a hot optical switch is provided to have a switch speed lower than a specific degree and to have a low driving power by decreasing a distance of an electrode, waveguide and heat sink as well as reducing combination loss with an optical fiber lower than 0.5dB/facet. CONSTITUTION: Both specific areas for positioning input/output tapers on a heat sink substrate(610) are etched to 10-15 micrometers in depth. A lower clad layer(620) is formed on the substrate. The input/output tapers are formed by photolithography and etching of the lower clad layer. A core layer(630) with a specific thickness is formed on the lower clad layer by using a material having a refractive index of 1-2% with the lower clad layer. A rib core is formed on the core layer through photolithography and etching. Then, an upper clad layer(640) is formed on the core layer by using a material having a refractive index of 1-15% with the core layer. Finally, a conductive metal film is put on the upper clad layer and an electrode(650) is formed by photolithography and etching.
Abstract:
PURPOSE: An index table of a spinner is provided to prevent a mechanical contact between an index table and a guide plate in a spinner used for applying a predetermined coating solution on a semiconductor wafer. CONSTITUTION: An index table of a spinner is to load a spinner for receiving a plurality of semiconductor wafer. An index table(10) is installed on a spinner for applying photoresist on a semiconductor wafer. Guide plates(20,21) are installed at both sides the index table. The index table is moved toward a vertical direction by the guide plates. An interval between the guide plates and the index table is more than 5mm. The index table is descended by a cylinder for relaxing an impact.
Abstract:
PURPOSE: An apparatus for dispensing developer having a wafer type nozzle is provided to reduce the amount of developer by using a structure comprising a rotary table, a rotator, and a rotary dispenser. CONSTITUTION: An apparatus for dispensing developer having a wafer type nozzle comprises a rotary table(120) for locating a wafer, a rotator(130) for rotating the rotary table, and a rotary dispenser(140) for dispensing developer(150) on the wafer. The rotary dispenser comprises a wafer type nozzle(144) and a support device(142). The wafer type nozzle is formed with a multitude of injection holes corresponding to a front face of the wafer. The supporter supports the wafer type nozzle and supplies the developer. The developer is dispensed on the wafer through the wafer type nozzle.
Abstract:
본 발명은 컴팩트 디스크, 레이저 디스크 플레이어 등의 광 디스크의 포커싱 서보 장치에 관한 것으로, 상세하게는 광 디스크 상에 정보를 기록하거나 읽어내는 광 디스크 정보 기록 재생에 있어서 포커싱을 최적화 시키기 위한 포커싱 서보 장치에 관한 것이다. 즉, 본 발명에 따른 광 디스크의 포커싱 서보 장치는 로우 패스필터를 채용하여 두 개의 스위치 절환 불일치에 의한 포커싱 이탈 현상을 억제하여 안정된 포커싱이 일어날 수 있도록 하여 주는 장점이 있다. 또한 로우 패스 필터가 포커스 에러 검출기에서 검출된 신호를 감쇠시켜 주므로 정상적인 포커싱이 보다 빠르게 구현되는 효과도 있다.