Abstract:
순수 구리를 이용한 금속 배선의 형성 방법이 개시되어 있다. 반도체 기판의 상부에 장벽 금속층을 형성한 후, 그 위에 감광막 패턴을 형성하여 금속 배선이 형성될 부위를 오픈시킨다. 상기 반도체 기판을 구리 수용액에 담근 후 전기 도금을 실시하여 상기 오픈된 부위에 구리 배선층을 형성한다. 구리 수용액 속에서 장벽 금속층을 이용한 전기 도금 방법을 사용하여 순수 구리 배선층을 형성함으로써, 배선 공정을 용이하게 진행할 수 있다.
Abstract:
PURPOSE: A semiconductor device and a method for manufacturing the same are provided to increase the integrity of a NAND type flash memory device by controlling an electric connection between a bit-line and a source-ling using a voltage applied to gate-lines. CONSTITUTION: One or more upper wirings are arranged on a lower wiring. A plurality of gate-lines(70) successively stacked to from a gate structure. The gate structure is arranged between the upper wiring and the lower wiring. A semiconductor pattern(55) connects the upper wirings and the lower wirings. The semiconductor pattern includes horizontal parts(HP) and a vertical part(VP). The horizontal parts are in parallel with the upper side of a substrate(10). The vertical part connects the horizontal parts.
Abstract:
PURPOSE: A method and a device for estimating moving speed of a terminal in a wireless communication system are provided to accurately estimate moving speed of a terminal. CONSTITUTION: When a UE(User Equipment) moves to a cell controlled by another ENB(Evolved Node B) of a wireless communication system, a cell size information transmitting unit(501) transmits size information of cells to which the UE moves during a set period and a cell controlled by the ENB to another ENB. A terminal speed estimating unit(502) estimates moving speed of the UE using size information of the cell. A transmission power measuring unit(504) measures transmission power of a downlink signal transmitted to a cell coverage edge of the ENB.
Abstract:
PURPOSE: A handover apparatus and a method thereof are provided to prevent that unnecessary handover is performed about at least a cell among the cells performing the handover. CONSTITUTION: In case a terminal performs handover to a target cell, a controller(200) transmits handover information received from the terminal and an adjacent cell to the target cell. In case of confirming that the terminal performs the handover to a plurality of cells while moving an overlapped cell coverage region, a parameter correcting unit(206) modifies a handover parameter of the target cell. The parameter correcting unit prevents that unnecessary handover process is generated.
Abstract:
A nonvolatile memory device and a method for manufacturing the same are provided to obtain uniform distribution by using a silicon nitride film including the metal as a charge trap layer. A gate structure(20) is formed on a semiconductor substrate(10). The gate structure is comprised of a tunnel dielectric layer, a charge trap layer, a blocking dielectric layer and a gate electrode. A source/drain region(12) is formed within the semiconductor substrate of both sides of the gate structure. The charge trap layer is comprised of the nitride film including the metal. The metal is selected among the transition metal. The rate of the transition metal is within the range of 1 to 50% not to lose a nonconductor characteristic of the nitride film. The charge trap layer is made of a titanium silicon nitride film or the tantalum silicon nitride film.
Abstract:
A non-volatile memory device and a manufacturing method thereof are provided to increase integration degree by forming a stack structure instead of a plane structure. A plurality of semiconductor layers(120) are laminated on a substrate(105). A plurality of second semiconductor layers(115) are inserted between the first semiconductor layers. The second semiconductor layers are recessed from one end of the first semiconductor layers in order to define a plurality of first trenches. A plurality of first storage nodes(140a) are formed on surfaces of the second semiconductor layers in the first trenches. A plurality of first control gate electrodes(150a) are formed on the first storage nodes in order to fill up the first trenches.
Abstract:
An AND-type and NOR-type flash memory arrays, a manufacturing method thereof and an operating method thereof are provided to form plural same silicon pins having certain width and height on an upper portion of a substrate. A local bit line(LBL1) is connected to bit lines(BL1,BL2,BLn) via a first select transistor(ST11). Memory cells(M11 to Mm1) are connected in parallel to the local bit line and the local source line. A local source line(LSL1) is commonly connected to a source of the respective memory cells, and a common source line(CSL) is connected to the local source line via a second select transistor(ST21). A drain select line(DSL) and a source select line(SSL) are electrically connected to a gate of the first select transistor and a gate of the second select transistor. Plural word lines(WL1 to WLm) are connected to a gate of each memory cell. The local bit line and the local source line have a first doped layer and a second doped layer which are vertically spaced apart from silicon pins.
Abstract:
본 발명은 고유전율 절연막을 포함하는 반도체 메모리 소자 및 그 제조 방법에 관한 것이다. 반도체 기판에 각각 형성된 제 1불순물 영역 및 제 2불순물 영역; 상기 반도체 기판 상에 상기 제 1불순물 영역 및 상기 제 2불순물 영역과 각각 접하며 형성되며 Hf Silicate, Zr Silicate, Y Silicate 또는 란탄 계열 금속 Silicate 중 적어도 어느 하나의 물질을 포함하여 ((Hf, Zr, Y or Ln)O 2 ) x (SiO 2 ) 1-x (0.03≤x≤0.26)의 조성을 지닌 절연막; 및 상기 절연막 상에 형성된 게이트 전극층;을 포함하는 고유전률 절연막을 포함하는 반도체 메모리 소자 및 그 제조 방법을 제공한다.