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公开(公告)号：KR1020120056554A
公开(公告)日：2012-06-04
申请号：KR1020100118148
申请日：2010-11-25
Applicant: 전자부품연구원
IPC: C08L37/00 , C08L79/00 , C08K5/1539 , H05K1/02
Abstract: PURPOSE: A highly heat-resistant composition is provided to have excellent thermal resistance by having glass transition temperature of 220 °C or higher, thereby maintaining substrates without damage even under high temperature process condition like lead-free reflow process. CONSTITUTION: A highly heat-resistant composition comprises a cycloaliphatic resin in chemical formula 1 as a main component. In chemical formula 1, R is a C1-20 alkyl group, n is an integer from 10-30. The highly heat-resistant composition comprises a cyclo aliphatic resin in chemical formula 1, and 10-100.0 parts by weight of a cyanate ester resin in chemical formula 2.
Abstract translation: 目的：通过玻璃化转变温度为220℃以上，提供高耐热性组合物以具有优异的耐热性，从而即使在无铅回流工艺等高温工艺条件下也能保持基板不损坏。 构成：高耐热组合物包含化学式1中的脂环族树脂作为主要成分。 在化学式1中，R为C 1-20烷基，n为10-30的整数。 高耐热组合物包含化学式1中的环脂族树脂和10-100.0重量份化学式2中的氰酸酯树脂。
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公开(公告)号：KR1020120025277A
公开(公告)日：2012-03-15
申请号：KR1020100087572
申请日：2010-09-07
Applicant: 전자부품연구원
IPC: C09J163/00 , C09J7/02 , C09J11/00 , H01L21/58
CPC classification number: C09J163/00 , C09J7/22 , C09J7/30 , C09J7/35 , C09J11/00 , C09J2201/61 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: A composite material composition and a substrate using thereof are provided to improve thermal resistance and lower dielectric property by including high thermal resistant epoxy resin and hardener. CONSTITUTION: A composite material composition comprises 14-34 weight% of inorganic filler including hollow glass microsphere which concurrently controls low dielectric property and high thermal resistance property, 31-51 weight% of epoxy based adhesive which controls adhesive force and high thermal resistance property of the tape, 23-43 weight% of acid anhydride based hardener which controls the high thermal resistance property through curing reaction with the adhesive of acid anhydride, and 0.1-0.3 weight% of curing accelerator which controls the thermal characteristic and curing reaction of the tape.
Abstract translation: 目的：提供一种复合材料组合物及其使用的基材，以通过包括高耐热性环氧树脂和硬化剂来改善耐热性和降低介电性能。 构成：复合材料组合物包含14-34重量％的无机填料，其包括同时控制低介电性和高耐热性的中空玻璃微球，31-51重量％的环氧基粘合剂，其控制粘合力和高耐热性 胶带，23-43重量％的酸酐类硬化剂，其通过与酸酐的粘合剂进行固化反应来控制高耐热性，和0.1-0.3重量％的固化促进剂，其控制带的热特性和固化反应 。
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公开(公告)号：KR1020110125071A
公开(公告)日：2011-11-18
申请号：KR1020100044610
申请日：2010-05-12
Applicant: 전자부품연구원
IPC: C09J163/00 , C08L63/00 , C08K3/24 , C08J5/18
Abstract: PURPOSE: A composition for a bonding film and a substrate using the bonding film are provided to ensure excellent adhesive force and high thermal resistance by comprising epoxy- and phenoxy-based adhesives, acid anhydride-based hardeners. CONSTITUTION: A composition for a bonding film for forming micro circuit patterns comprises: an epoxy-based adhesive for controlling the adhesive force and high thermal resistance of the bonding film; a phenoxy-based adhesive capable of embodying adhesive force, high thermal resistance, and micro circuit patterns by forming roughness on the surface of the bonding film; an anhydride-based hardener for controlling high thermal resistance through a curing reaction with the first adhesive; and other additives controlling thermal properties and the curing reaction of the bonding film.
Abstract translation: 目的：提供一种用于接合膜的组合物和使用该接合膜的基底，以通过包含环氧基和苯氧基基粘合剂，酸酐类固化剂来确保优异的粘合力和高耐热性。 构成：用于形成微电路图形的接合膜的组合物包括：用于控制接合膜的粘合力和高热阻的环氧基粘合剂; 通过在接合膜的表面上形成粗糙度的能够体现粘合力，高热阻和微电路图案的苯氧基类粘合剂; 用于通过与第一粘合剂的固化反应来控制高热阻的基于酸酐的硬化剂; 以及控制粘合膜的热性能和固化反应的其他添加剂。
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公开(公告)号：KR1020100127936A
公开(公告)日：2010-12-07
申请号：KR1020090046291
申请日：2009-05-27
Applicant: 전자부품연구원
Abstract: PURPOSE: A via paste composition is provided to offer a thermosetting paste for forming a heat conductive via with the excellent thermal conductivity. CONSTITUTION: A via paste composition is formed with a thermo-conductive material and a thermosetting resin. The thermo-conductive material contains silver powder with the average particle diameter of 100~300 nanometers, and silver-coated copper powder with the average particle diameter of 3~10 microns. The thermosetting resin contains an epoxy resin including either phenol novolak based epoxy or cresol novolak based epoxy.
Abstract translation: 目的：提供通孔糊组合物以提供用于形成具有优异导热性的导热通孔的热固性糊剂。 构成：用导热材料和热固性树脂形成通孔糊组合物。 导热材料含有平均粒径为100〜300纳米的银粉，平均粒径为3〜10微米的镀银铜粉。 热固性树脂含有包括苯酚酚醛清漆型环氧树脂或甲酚酚醛清漆型环氧树脂的环氧树脂。
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公开(公告)号：KR1020090012682A
公开(公告)日：2009-02-04
申请号：KR1020070076705
申请日：2007-07-31
Applicant: 전자부품연구원
IPC: H01L21/027
CPC classification number: H01L21/0274 , G03F7/2022
Abstract: A formation method of the polymer thick layer resistor is provided to reduce the deviation of the resistance value and simplify the manufacturing process. A formation method of the polymer thick layer resistor comprises a step for forming conductivity cattails(111,112); a step for coating the paste(120) for the photosensitivity resistance; a step for forming a resistor pattern; and a step for forming the protective layer. The conductivity cattail is formed on a supporting part(100). The supporting part is a substrate or the electric component. The resistor pattern is formed by exposing and developing the paste for the photosensitivity resistance.
Abstract translation: 提供聚合物厚层电阻器的形成方法以减少电阻值的偏差并简化制造过程。 聚合物厚层电阻器的形成方法包括形成电导率电极的步骤（111,112）; 用于涂覆所述糊剂（120）以获得耐光敏性的步骤; 形成电阻图案的步骤; 以及形成保护层的步骤。 在支撑部分（100）上形成导电性的尾巴。 支撑部件是基板或电气部件。 电阻图案通过曝光和显影用于耐光敏性的浆料而形成。
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Patent Agency Ranking
公开(公告)号：KR100869224B1
公开(公告)日：2008-11-18
申请号：KR1020070008358
申请日：2007-01-26
Applicant: 전자부품연구원
Abstract: 본 발명의 세라믹 조성물은 세라믹 분말과 아크릴 코폴리머를 포함하는 바인더를 포함하여 이루어진다. 보다 구체적으로는, 적은 양의 아크릴 코폴리머 바인더로 세라믹 분말을 충분히 결합시킴으로써, 세라믹 분말의 조성 비율을 현저히 높인 세라믹 조성물에 대한 것이다. 또한, 본 발명에 따른 세라믹 조성물로부터 제조되는 그린 시트는 두께 균일성이 우수하고, 높은 비율의 세라믹 성분을 포함하므로 한층 우수한 물성을 나타낼 수 있다.
세라믹 조성물, 그린 시트, 아크릴 코폴리머-
公开(公告)号：KR100867661B1
公开(公告)日：2008-11-10
申请号：KR1020060134758
申请日：2006-12-27
Applicant: 전자부품연구원
Abstract: 본 발명은 열경화성 수지 조성물에 관한 것으로, 특히 폴리페닐렌옥사이드(PPO)를 포함하여 이루어진 모수지; 가교제; 및 개시제가 포함되어 이루어진, 고주파 저유전율 저손실의 열경화성 수지 조성물에 대한 것이다. 이러한 본 발명의 열경화성 수지 조성물은 고주파 대역에서 우수한 전기적 특성을 가지는 폴리페닐렌옥사이드 수지를 포함함으로써, 프리프레그, 시트, 필름, 테이프, 적층판, 회로용 적층재 또는 프린트 배선용 기판 등을 제조하는데 이용되어, 상기 프린트 배선용 기판 등이 종래의 수지 조성물에 의하는 것보다 작은 유전율 및 유전손실을 가지게 할 수 있는 효과가 있다.
폴리페닐렌옥사이드, 프리프레그, 프린트 배선용 기판-
公开(公告)号：KR1020080070362A
公开(公告)日：2008-07-30
申请号：KR1020070008358
申请日：2007-01-26
Applicant: 전자부품연구원
Abstract: A ceramic composition and a ceramic green sheet comprising the ceramic composition are provided to obtain sufficient binding of ceramic powder using less amount of binder and to carry out burn-out process at relatively low temperature by using acrylic copolymer binder, and to increase the amount of ceramic powder and to obtain thin and uniform green sheet having excellent property by decreasing organic material in the composition. A ceramic composition comprises 40-70 parts by weight of ceramic powder and 2-8 parts by weight of binder comprising acrylic copolymer which is polymerized from at least two selected from metha-methyl acrylate, ethyl acrylate, ethyl methacrylate, butyl methacrylate, butyl acrylate and methacrylate, with respect to 100 parts by weight of the total weight. The ceramic composition optionally comprises at least one solvent selected from ethanol, toluene, xylene, methyl ethyl ketone, methanol, isopropanol, cyclohexane and acetone. The ceramic composition optionally comprises dispersant. The ceramic composition optionally comprises phthalate type curing agent, glycol type curing agent or glycerin type curing agent. The ceramic composition additionally comprises a solvent is at least one selected from ethanol, toluene, xylene, methyl ethyl ketone, methanol, isopropanol, cyclohexane and acetone. The binder solution comprises 30-60 parts by weight of binder with respect to 100 parts by weight of the total weight. A ceramic green sheet is prepared with the ceramic composition, and the density of the ceramic green sheet is at least 55% of the ceramic powder density.
Abstract translation: 提供包含陶瓷组合物的陶瓷组合物和陶瓷生片，以使用较少量的粘合剂获得足够的陶瓷粉末结合，并通过使用丙烯酸共聚物粘合剂在相对低的温度下进行烧尽，并增加 并通过降低组合物中的有机材料获得具有优异性能的薄而均匀的生片。 陶瓷组合物包含40-70重量份的陶瓷粉末和2-8重量份的包含丙烯酸共聚物的粘合剂，其由选自甲基丙烯酸甲酯，丙烯酸乙酯，甲基丙烯酸乙酯，甲基丙烯酸丁酯，丙烯酸丁酯， 和甲基丙烯酸酯，相对于总重量的100重量份。 陶瓷组合物任选地包含至少一种选自乙醇，甲苯，二甲苯，甲基乙基酮，甲醇，异丙醇，环己烷和丙酮的溶剂。 陶瓷组合物任选地包含分散剂。 陶瓷组合物任选地包含邻苯二甲酸酯型固化剂，二醇型固化剂或甘油型固化剂。 陶瓷组合物另外包含溶剂，其为选自乙醇，甲苯，二甲苯，甲基乙基酮，甲醇，异丙醇，环己烷和丙酮中的至少一种。 粘合剂溶液相对于总重量的100重量份包含30-60重量份的粘合剂。 用陶瓷组合物制备陶瓷生片，陶瓷生片的密度至少为陶瓷粉末密度的55％。
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公开(公告)号：KR100832803B1
公开(公告)日：2008-05-27
申请号：KR1020060076775
申请日：2006-08-14
Applicant: 전자부품연구원
Abstract: 본 발명은 프린트 배선용 기판에 사용되는 저유전율 저손실의 열경화성 복합 수지 조성물에 관한 것으로, 특히 폴리페닐렌옥사이드(PPO)와 폴리스티렌(PS)이 6:4 내지 8:2 의 중량비율로 혼합된 모수지; 상기 모수지에 대하여 1:9 내지 3:7의 중량비율에 해당하는 양의 가교제; 상기 모수지에 대하여 1:10 내지 1:5의 중량비율에 해당하는 양의 첨가제; 및 상기 가교제에 대하여 1:20 내지 1:5의 중량비율에 해당하는 양의 개시제가 포함된 저유전율 저손실의 열경화성 복합 수지 조성물인 것을 특징으로 한다. 이러한 본 발명은 고주파 영역에서 우수한 전기적 특성을 가지는 폴리페닐렌옥사이드 수지를 포함하여 프린트 배선용 기판, 프리프레그, 시트, 필름, 테이프, 적층판 또는 회로용 적층재 등을 제조하는데 이용됨으로써, 상기 프린트 배선용 기판 등이 종래의 복합 수지 조성물에 의하는 것보다 작은 유전율 및 유전손실을 가지게 할 수 있는 효과가 있다.
프린트 배선용 기판, 프리프레그, 폴리페닐렌옥사이드-
公开(公告)号：KR100813888B1
公开(公告)日：2008-03-18
申请号：KR1020060134769
申请日：2006-12-27
Applicant: 전자부품연구원
IPC: C08L101/00 , C08L23/00
Abstract: A thermosetting resin composition is provided to ensure a low dielectric constant and low dielectric loss in fabricating a printed circuit board, and to impart transmission characteristics suitable for a high frequency range to a printed circuit board. A thermosetting resin composition having a low dielectric constant and low dielectric loss in a high frequency range comprises: a matrix resin formed of a solid phase single cycloolefin resin; an organic solvent for dissolving the matrix resin; a crosslinking agent used in an amount corresponding to a weight ratio of 1/20 to 1/3 based on the weight of the matrix resin. In the composition, the crosslinking agent modifies the properties of the matrix resin so as to realize improved dielectric properties in a high frequency range in a GHz scale.
Abstract translation: 提供一种热固性树脂组合物以确保制造印刷电路板时的低介电常数和低的介电损耗，并将适合于高频范围的传输特性赋予印刷电路板。 在高频范围内具有低介电常数和低介电损耗的热固性树脂组合物包括：由固相单环烯烃树脂形成的基体树脂; 用于溶解基质树脂的有机溶剂; 交联剂的使用量相当于基体树脂重量的1/20〜1/3的重量比。 在组合物中，交联剂改变基体树脂的性质，以便在GHz的高频范围内实现改进的介电特性。
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