Abstract:
PURPOSE: A high adhesive polyimide/poly(ethylene terephthalate) compound film and a manufacturing method thereof are provided to enable the compound film to be used as a high quality adhesive film suitable for a flexible printed circuit board by virtue of improved heat-resistance, transparency, and mechanical properties thereof. CONSTITUTION: The high adhesive polyimide/poly(ethylene terephthalate) compound film comprises a thin soluble polyimide resin solution layer(1) coated on the one surface or the both surfaces of a poly(ethylene terephthalate) film(3), and a high adhesive polyester layer(2) between the film and the resin layer so as to increase an interfacial adhesive property therebetween.
Abstract:
PURPOSE: A waste PVC/PE-based polymer mixture is provided, to minimize the phase separation between the waste PVC and the waste PE by employing a specific copolymer, thereby improving the mechanical properties. CONSTITUTION: The waste PVC/PE-based polymer mixture comprises 100 parts by weight of waste plastic; 0.1-20 parts by weight of a copolymer having 30-99 wt% of a main chain of an ethylene bond and 1-70 wt% of a side chain of an ester group, an acetate group or an acryl group, as a compatibilizer; and optionally 0.01-3 parts by weight of a lubricant, 0.01-5 parts by weight of a stabilizer, and 0.01-1 parts by weight of an antioxidizing agent. The waste plastic comprises 1-99 parts by weight of waste poly(vinyl chloride); and 1-99 wt% of polyethylene; and the waste PVC is a hard PVC, a soft PVC or their mixture. The mixture also contains new PVC and PC instead of the waste PVC and the waste PE.
Abstract:
본 발명은 내열성 및 접착성이 우수한 폴리에스테르/폴리이미드계 복합 필름 및 그의 제조방법에 관한 것으로서, 기존 폴리에스테르 수지의 특성을 거의 그대로 유지하면서도 내열성이 특히 우수하여, 투명 내열소재로 사용할 수 있는 새로운 형태의 폴리에스테르/폴리이미드 복합 필름에 관한 것이다. 본 발명에서는 필름 계면의 접착성 향상을 위해 폴리아믹산이 5~95 몰% 도입된 지방족 고리계 가용성 폴리이미드 수지혼합물 용액을 폴리에스테르 필름 위에 박막 코팅함으로써, 내열성, 접착성, 기계적 특성 이 우수한 신규 가용성 폴리이미드/ 폴리에스테르 복합 필름을 제조하고 제조된 폴리에스테르 복합 필름은 230℃ 이상의 고온에서 사용이 가능하다.
Abstract:
본 발명은 신규 폴리이미드와 이를 이용한 기체 분리막에 관한 것으로서, 더욱 상세하게는 다음 화학식 1로 표시되는 신규 폴리이미드와 이의 제조방법, 그리고 신규 폴리이미드를 이용하여 제조된 기체 분리막에 관한 것이다.
본 발명에 따른 기체 분리막은 투과능 및 선택투과성능이 우수할 뿐만 아니라 내열성 및 내약품성 등이 우수하므로 그 이용분야가 매우 광범위하다. 본 발명의 기체 분리막이 사용될 수 있는 분야로는 예를 들면 암모니아 합성시의 수소의 분리회수, 화력발전소 혹은 쓰레기 소각로 등에서 방출된 이산화탄소의 회수 혹은 유황산화물이나 질소 산화물의 제거, 유전의 가스로부터 이탄화탄소의 회수, 천연가스로부터 황하수소, 이산화탄소의 제거나 헬륨의 분리, 주유소에서 새어나간 가솔린의 회수, 휘발성 물질이 함유된 액체혼합물의 분리, 액체에 용해되고 있는 기체의 제거, 공기의 산소 및 질소의 분리 등이다.
Abstract:
PURPOSE: Provided is a polyolefin-based resin composition excellent in strength, tracking resistance, fire retardancy, and flexibility, which can be used as insulating material. CONSTITUTION: The polyolefin-based resin composition contains: 100pts.wt. of a base resin mixture comprising 40-80wt% of a polyethylene resin having a density of 0.915-0.919g/cm3 and 20-60wt% of a polyolefin copolymer rubber containing 20-90wt% of propylene and having a Mooney viscosity of 61-100 at 100deg.C, wherein the polyethylene resin is ethylene homopolymer or copolymer of ethylene with one monomer selected from 1-butene, 1-pentene, 1-hexene, and 1-octene and the polyolefin copolymer rubber is ethylene-propylene copolymer rubber or ethylene-propylene-diene terpolymer rubber; 5-100pts.wt. of a metal hydroxide being aluminium hydroxide, magnesium hydroxide, or a mixture thereof; 10-60pts.wt. of a halogen-based organic fire-retardant agent; 5-30pts.wt. of antimony trioxide; and 0.1-5pts.wt. of a carbon black.
Abstract:
PURPOSE: A colorless and transparent aliphatic polyimide resin is provided, which has excellent heat-proof property, transparency, electricity insulating property and adhesive property, and a complex material of the polyimide resin and an inorganic compound is also provided, which has excellent interfacial adhesive property to be applied to a buffer coating layer of a color filter of a liquid crystal display, an insulating material between a glass base plate and a thin film transistor, and a polymer partitioning material of a liquid crystal display for a touch panel. CONSTITUTION: The colorless and transparent aliphatic polyimide resin having high adhesive property has a repeating unit represented by the formula (1), wherein the m/m+n is greater than 0 and smaller than 1. In the complex material of the polyimide and an inorganic compound, the surface of the inorganic material selected from the group consisting of glass, conductive glass, aluminum, copper, titanium and oxides thereof is coated by the aliphatic polyimide resin having the formula 1 as the repeating unit.
Abstract translation:目的:提供一种无色透明的脂肪族聚酰亚胺树脂,其具有优异的耐热性,透明性,电绝缘性和粘合性,并且还提供了聚酰亚胺树脂和无机化合物的复合材料,其具有优异的界面粘合剂 适用于液晶显示器的滤色器的缓冲涂层,玻璃基板和薄膜晶体管之间的绝缘材料,以及用于触摸面板的液晶显示器的聚合物分隔材料。 构成:具有高粘合性的无色透明脂肪族聚酰亚胺树脂具有由式(1)表示的重复单元,其中m / m + n大于0且小于1.在聚酰亚胺和 无机化合物,由具有式1的脂肪族聚酰亚胺树脂作为重复单元涂覆选自玻璃,导电玻璃,铝,铜,钛及其氧化物的无机材料的表面。
Abstract:
PURPOSE: A novel polyamide polymer capable of preventing an increase of a dielectric constant by the remaining hydroxyl group and having high heat resistance by transforming a hydroxyl group produced by pyrolysis of acetal or a side chain of its cyclic derivatives by heating a patterned exposed section to a thermally stable benzoxazole group and photosensitive heat resistant insulator composition are provided, which are useful as a layer insulation film of a passivation layer of semiconductors, a buffer coat or composite multilayer PCP. CONSTITUTION: A polyamide polymer having an intrinsic viscosity of 0.1 to 2.5 dL/g contains the formula 1 as a repeating unit and a photosensitive heat resistant insulator composition contains 0.3 to 20% by weight of a photoacid generator based on the polyamide. A concentration of an acid sensitive group (-OR1 or -OR2) is 3 to 70%. The photoacid generator is a material for generating an acid by absorbing light in an area of long wavelength (more than 300nm) as compared to an absorbing area of polyamide
Abstract:
PURPOSE: A soluble polyimide resin having polyalicyclic structure is provided for enhancing heat-resistance, solubility and transparency by comprising specifically structured aromatic diamine monomer and aromatic tetracarboxylic dianhydride. CONSTITUTION: The soluble polyimide resin having polyalicyclic structure and the repeating units of formula 1 (wherein the radical of formula 1a represents at least one of quaternary value radicals selected from the groups in description; the radical of formula 1b represents at least one of the group including polyalicyclic structure expressed as follows in description) is produced by dissolving and polymerizing aromatic tetracarboxylic dianhydride and aromatic diamine compounds including at least one of cyclohexylidene dianiline derivative of formula 2 (wherein the radical of formula 2a represents the groups as follows in description). The polyimide resin has a specific viscosity of 0.2-1.1 dL/g, molecular weight of 50,000-200,000 g/mol and glass transition temperature of 260-410 deg.C.
Abstract:
PURPOSE: An aromatic polyimide resin powder which, since it can be molded even under low processing temperature and pressure compared with existing aromatic polyimide resin powder and is excellent in heat resistance, abrasion resistance and mechanical property, can be applied to heat-resistant material of various industrial machines, electric and electromagnetic parts, and automobiles and is predicted to be extensively used for various high-advanced structural materials, and method for the preparation thereof are provided. CONSTITUTION: The aromatic polyimide resin powder has the following chemical formula 1: wherein B and C are the same as that are defined in the detailed description of the present invention. The method for the preparation of the aromatic polyimide resin powder is characterized by reacting an aromatic tetracarboxylic dianhydride with an aromatic diamine which trifluoromethyl phenyl benzamide group is introduced into.