公开(公告)号：DE10121578A1

公开(公告)日：2002-11-14

申请号：DE10121578

申请日：2001-05-03

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GEBAUER UTA ,  WENNEMUTH INGO ,  HOEGERL JUERGEN ,  POHL JENS

IPC: H01L21/00 ,  H01L21/68 ,  H05K13/02

Abstract: The invention relates to a method and a component system (4) for providing a substrate (1) with an electronic component (2). The component system (4) comprises a substrate carrying device (5) for receiving the substrate, a wafer carrying device (6) placed over the substrate carrying device (5) for receiving a wafer carrying frame (10), as well as a vacuum pincette-holder device (7) placed above the wafer carrying device (6). The wafer carrying frame (10) can receive a complete semiconductor wafer (3) divided into electronic components.

公开(公告)号：DE10119004A1

公开(公告)日：2002-10-31

申请号：DE10119004

申请日：2001-04-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WENNEMUTH INGO ,  HOEGERL JUERGEN

IPC: H01L23/49 ,  H01L25/065 ,  H01L23/50 ,  H01L21/60

Abstract: The device has at least one semiconductor chip (2) having an active front side (4) with semiconductor structures, and a passive back side (3) without semiconductor structures. Contact connections (8) or pads (10) are provided on the front or back side. Wiring arrangements in the form of conductive clips (6) are provided for making electrical connections from the active front side to the passive back side. The clips engage with at least one side of the semiconductor chip, and may be made of metal, plastics, or plastics-coated flexible metal. Independent claims are also included for an electronic module, and for a method of manufacturing an electronic module.

公开(公告)号：DE10023869A1

公开(公告)日：2002-01-17

申请号：DE10023869

申请日：2000-05-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN

IPC: H01L25/065 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/14 ,  H05K7/20

Abstract: A circuit configuration for reliably and simply interconnecting circuit modules includes a connection carrier and circuit modules disposed essentially one above another approximately in a stack. Each of the circuit modules has a connecting device for externally and electrically bonding the circuit modules. The connecting device has at least one series configuration of connecting elements disposed essentially in a plane. The connecting elements are disposed on the connection carrier. The connecting device of at least one of the circuit modules is at least partially electrically connected to another connecting device of at least one different one of the circuit modules in direct mechanical and electrical contact.

公开(公告)号：DE10017741A1

公开(公告)日：2001-10-25

申请号：DE10017741

申请日：2000-04-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  HOEGERL JUERGEN

IPC: H01L23/13 ,  H01L23/24 ,  H01L23/498 ,  H01L23/053 ,  H01L23/12

Abstract: A housing for semiconductor chips includes a plastic base substrate having a region for accommodating a chip and substrate sides having a patterned metallization layer. One of the sides contacts a chip and another contacts an external electrical connection. Each chip has front and rear sides and at least one chip contact on each side. Two or more pads are formed in the patterned metallization layer on one of the base substrate sides. One of the pads is connected to a front side chip contact and another is connected to a rear side chip contact. At least one pad is formed in the patterned metallization layer on the other base substrate side and is connected to the external electrical connection. One of the two pads is connected to a chip contact through the bonding wire, and another of the two pads is directly applied to another chip contact.