公开(公告)号：JP2005252278A

公开(公告)日：2005-09-15

申请号：JP2005095685

申请日：2005-03-29

Applicant: Infineon Technologies Ag ,  インフィネオン テクノロジーズ アクチエンゲゼルシャフト

Inventor： HAINZ OSWALD ,  PAULUS STEFAN ,  LEHNER RUDOLF ,  AUBURGER ALBERT ,  LANG DIETMAN ,  PETZ MARTIN ,  WEBER MICHAEL

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L21/98 ,  H01L23/31 ,  H01L23/482 ,  H01L25/04 ,  H01L25/18

CPC classification number: H01L21/568 ,  H01L23/3107 ,  H01L23/482 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive packaging method having a simple production process for realizing short signal path and a compact structure. SOLUTION: The housing includes a primary principal plane and a secondary principal plane that counters the primary principal plane, with most of them surrounding at least one semiconductor chip. The semiconductor chip includes a first metallization on the first principal plane side. The second principal planar side of the semiconductor chip reaches the second principal plane of the semiconductor structure element. The first metallizing of the semiconductor chip is also surrounded by the housing through a conductive material and connected with the contact section that reaches the second principal plane. Furthermore, the semiconductor chip includes a secondary metallization to pass signals to the second principal plane side. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 解决的问题：提供一种廉价的包装方法，其具有用于实现短信号路径和紧凑结构的简单制造工艺。 解决方案：壳体包括主要主平面和与主要主平面对准的次要主平面，其大部分围绕至少一个半导体芯片。 半导体芯片包括在第一主平面侧上的第一金属化。 半导体芯片的第二主平面侧到达半导体结构元件的第二主平面。 半导体芯片的第一金属化也被壳体通过导电材料包围并与到达第二主平面的接触部分连接。 此外，半导体芯片包括用于将信号传递到第二主平面侧的二次金属化。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2002124597A

公开(公告)日：2002-04-26

申请号：JP2001287531

申请日：2001-09-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  AUBURGER ALBERT ,  HAINZ OSWALD ,  LANG DIETMAR ,  PETZ MARTIN ,  WEBER MICHAEL

IPC: H01L23/12 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide a component, which can be produced by a known production method as easily as possible, composed of a little external contacts. SOLUTION: A contact pad 11 of at least one integrated circuit 1 is connected with a conductive projection 2 directly attached on a basic substrate.

公开(公告)号：WO02069618A3

公开(公告)日：2002-10-24

申请号：PCT/DE0200708

申请日：2002-02-28

Applicant: INFINEON TECHNOLOGIES AG ,  PETZ MARTIN ,  STADLER BERND ,  PAULUS STEFAN ,  SCHROEDER MARTIN ,  LOSEHAND REINHARD ,  SCHAFFER JOSEF-PAUL

Inventor： PETZ MARTIN ,  STADLER BERND ,  PAULUS STEFAN ,  SCHROEDER MARTIN ,  LOSEHAND REINHARD ,  SCHAFFER JOSEF-PAUL

IPC: H01L31/0203 ,  H01L31/0232 ,  H04N5/225 ,  H01L27/146

CPC classification number: H04N5/2257 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The invention relates to a digital camera (1) comprising a lens (2), a camera housing (3) and a semiconductor sensor (9), whereby the camera housing (3) is essentially comprised of a transparent plastic block (44), which encloses, only on its underside, a semiconductor sensor (9) and comprises, on its upper side, an adapted lens (2). A layer, which is situated between the semiconductor sensor and the lens, which is impervious to light, and which has an aperture (14), improves the image quality. The invention also relates to a method for producing a digital camera of the aforementioned type.

Abstract translation: 本发明涉及一种数码相机（1）与透镜（2），一个摄像机壳体（3）和半导体传感器（9），其中所述摄像机壳（3）基本上由一个透明的塑料块（44），其中仅在其下侧 包括半导体传感器（9）和在其上侧的适配透镜（2），而具有孔（14）的不透明层之间改进了图像质量。 此外，本发明涉及一种用于制造这样的数字照相机的方法。

公开(公告)号：WO2004073013A3

公开(公告)日：2004-10-14

申请号：PCT/DE2004000185

申请日：2004-02-04

Applicant: INFINEON TECHNOLOGIES AG ,  PAULUS STEFAN ,  PETZ MARTIN

Inventor： PAULUS STEFAN ,  PETZ MARTIN

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/047 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10

CPC classification number: H01L23/49861 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/3025 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: The invention relates to an electronic component (1), in particular a high-frequency power module. Said component comprises a housing (3) containing a hollow chamber surrounded by a housing frame (40) with plastic walls (5). At the base of the plastic walls (5), a metal frame (6) is connected to said walls (5) in a positive fit by means of anchor elements (14), in such a way that a housing base (9) is attached to the housing frame (40) in a temperature-resistant manner using a soldered joint (15).

Abstract translation: 本发明涉及的电子部件（1），在具有腔壳特定的射频功率模块（3）具有与塑料壁的壳体框架（40）（5）。 在塑料壁（5）的底部区域是通过锚部件（14）的形状配合的塑料壁（5）的金属框架（6），从而使一个壳体基部（9）由一个焊接接头（15）到壳体框架（40）是耐高温的连接。

公开(公告)号：WO2005041272A2

公开(公告)日：2005-05-06

申请号：PCT/DE2004002199

申请日：2004-10-01

Applicant: INFINEON TECHNOLOGIES AG ,  BETZ BERND ,  DANGELMAIER JOCHEN ,  PAULUS STEFAN

Inventor： BETZ BERND ,  DANGELMAIER JOCHEN ,  PAULUS STEFAN

IPC: H01L21/48 ,  H01L23/495 ,  H01L21/00

CPC classification number: H01L23/49582 ,  H01L21/4828 ,  H01L23/49503 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A flat conductor frame for fitting with a semiconductor chip (2) and for covering with a plastic mass (4) has a single-piece, metal base body (3) on which an intermediate layer (5) is applied. The intermediate layer (5) has a surface (6) with a matrix of islands (14) of leftover materials having substantially a uniform height and cavities (10) extending therebetween.

Abstract translation: 用于与半导体芯片（2）一起放置并且用塑料化合物（4）包裹的引线框架具有其上施加有中间层（5）的金属一体式基体（3）。 中间层（5）具有表面（6），所述表面（6）具有基本均匀高度的残余材料的岛状基体（14）以及在其间延伸的空隙（10）。

公开(公告)号：WO0201634A3

公开(公告)日：2002-06-20

申请号：PCT/DE0102097

申请日：2001-06-07

Applicant: INFINEON TECHNOLOGIES AG ,  PAULUS STEFAN

Inventor： PAULUS STEFAN

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/485

CPC classification number: H01L21/568 ,  H01L21/56 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48471 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: The invention relates to a system support (5) for semiconductor chips (1) and electronic components (2) which are produced on said system support (5). The system support (5) has a base substrate (11) on which outer contact elements (6) are located. These outer contact elements have a cross-section (7) in the form of a rivet with a rivet head area (8), a rivet shaft area (9) and a rivet foot area (10). This ensures that the outer contact elements (6) are securely anchored in the housing, which consists of a plastic mass (4).

Abstract translation: 本发明涉及一种系统，载体（5），用于半导体芯片（1）和电子部件（2），这是本系统的载体上产生（5）。 系统载架（5）具有基底（11），在所述外接触元件（6）被布置成一个铆钉形状的横截面（7）示出了Nietkopfbereich（8），一个Nietschaftbereich（9）和一个铆钉底部区域（10），由此 外接触元件（6）在由塑料化合物（4）的壳体被牢固地锚定。

公开(公告)号：WO2006050690A3

公开(公告)日：2006-08-31

申请号：PCT/DE2005001921

申请日：2005-10-26

Applicant: INFINEON TECHNOLOGIES AG ,  DANGELMAIER JOCHEN ,  FOWLKES DONALD ,  GUENGERICH VOLKER ,  HOYER HENRIK ,  PAULUS STEFAN ,  PETZ MARTIN

Inventor： DANGELMAIER JOCHEN ,  FOWLKES DONALD ,  GUENGERICH VOLKER ,  HOYER HENRIK ,  PAULUS STEFAN ,  PETZ MARTIN

IPC: H01L23/10 ,  H01L21/48 ,  H01L23/047

CPC classification number: H01L23/047 ,  H01L23/10 ,  H01L23/49861 ,  H01L23/66 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: Disclosed is an electronic component (1), especially a high frequency power module (2), comprising a hollow housing (3) with a housing frame (4), plastic walls (5), and a metallic housing bottom (9) with at least one chip island (10) and at least one semiconductor chip (11) which is disposed on said chip island (10). The plastic walls (5) are made of a thermosetting material while being provided with surfaces (36) that are connected to surfaces (37) of the metallic housing bottom (9) via a soldered joint.

Abstract translation: 一种电子部件（1），特别是射频功率模块（2）具有空腔壳体（3）与壳体框架（4）与塑料壁（5）和金属外壳的底部（9）与至少一种芯片岛（10）和中的至少一个 所述芯片岛（10）布置有半导体芯片（11），其中所述塑料壁（5）由热固性塑料制成并且具有经由焊接连接与所述金属外壳底部（9）的表面（37）连接的表面（36）。

公开(公告)号：WO2005101458A3

公开(公告)日：2006-01-19

申请号：PCT/DE2005000639

申请日：2005-04-13

Applicant: INFINEON TECHNOLOGIES AG ,  BETZ BERND ,  MAHLER JOACHIM ,  OTREMBA RALF ,  PAULUS STEFAN

Inventor： BETZ BERND ,  MAHLER JOACHIM ,  OTREMBA RALF ,  PAULUS STEFAN

IPC: H01L21/56 ,  B41F5/04 ,  H01L21/00 ,  H01L21/312 ,  H05K1/00 ,  H05K3/00

CPC classification number: H01L21/56 ,  H01L21/6715 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/0091 ,  H05K2203/013 ,  H05K2203/1545 ,  H01L2924/00

Abstract: The invention relates to a device (35) and a method for applying a thin organic or inorganic layer to individual component positions of band-shaped structures (1). Said layer can result in improved or optimized adhesion between a coated surface and a plastic housing material. In addition, said layer can be used as an anticorrosive layer, electrically insulating layer, or dielectric for the coated surfaces. In order to selectively apply the layer, the inventive device (35) comprises a jet printer (2) with several electronically controlled jet heads (4-7). Said jet printer (2) selectively coats the top face (17) of the band-shaped structures (1) in a first coating position (15) while selectively coating the bottom face (18) thereof in a second coating position (16).

Abstract translation: 本发明涉及一种装置（35）和用于施加于带状结构（1）的单独的部件的位置的薄的有机或无机层的方法。 该层可提供一被涂覆表面和塑料壳体组合物之间的改进的或优化的粘附性。 此外，层可以作为腐蚀保护层，电绝缘层或作为电介质的涂覆表面。 对于层的选择性施加，该装置（35）具有多个电子可控制的喷墨头（4-7）一个束打印机（2）。 涂在第一涂层位置（15）的束打印机（2），带状结构（1）选择性地在顶部（17）和在第二涂布位置（16）选择性地在带形结构的底部（18）（1）。

公开(公告)号：DE102009042921B4

公开(公告)日：2021-04-29

申请号：DE102009042921

申请日：2009-09-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  FRIES MANFRED ,  PETZ MARTIN ,  MÜLLER THOMAS

IPC: H01L23/055 ,  H01L21/60 ,  H01L23/28 ,  H01L23/34 ,  H01L23/48

Abstract: Halbleiterbauelement (300), umfassend:eine Formstruktur (305), die einen Hohlraum (315) definiert,mehrere, in die Formstruktur (305) eingeformte separate Zuleitungen (303a, 303b, 303c), undeinen in dem Hohlraum (315) an der Formstruktur (305) über mindestens zweien der mehreren separaten Zuleitungen (303a, 303b, 303c) angebrachten Chip (307),wobei sich die mindestens zwei der mehreren separaten Zuleitungen (303a, 303b, 303c) in einem Überlappungsgebiet (3099) in einer Projektion orthogonal zu einer Chiphauptfläche zumindest teilweise mit dem Chip (307) überlappen,wobei die mindestens zwei der mehreren separaten Zuleitungen (303a, 303b, 303c) derart nach oben gebogen sind, dass sie innerhalb des Hohlraums (315) an freiliegenden Abschnitten an der Formstruktur (305) freiliegen, wobei der Chip (307) mittels verbindender Elemente (319) mit den freiliegenden Abschnitten der mindestens zwei der mehreren separaten Zuleitungen (303a, 303b, 303c) elektrisch verbunden ist,wobei die mindestens zwei der mehreren separaten Zuleitungen (303a, 303b, 303c) an gegenüberliegenden Seiten aus der Formstruktur (305) herausragen,wobei die Formstruktur (305) eine ausgeformte erste Isolierschicht (311) definiert, die den Chip (307) von den mindestens zweien der mehreren separaten Zuleitungen (303a, 303b, 303c) trennt, undwobei der Chip (307) mit Hilfe eines Klebers (313) an der ausgeformten ersten Isolierschicht (311) angebracht ist und der Kleber (313) eine klebende zweite Isolierschicht bildet, die zwischen dem Chip (307) und der ausgeformten ersten Isolierschicht (311) angeordnet ist.

公开(公告)号：DE102010000539A1

公开(公告)日：2010-09-30

申请号：DE102010000539

申请日：2010-02-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AUBURGER ALBERT ,  PAULUS STEFAN ,  SEE BENG KEH ,  WIETSCHORKE HELMUT

IPC: H01L23/31 ,  H01L21/56 ,  H01L25/16