公开(公告)号：DE10137668A1

公开(公告)日：2002-10-17

申请号：DE10137668

申请日：2001-08-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GEBAUER UTA ,  STRUTZ VOLKER ,  MEYER THORSTEN

IPC: H01L21/60 ,  H05K3/30 ,  H01L23/50 ,  H01L21/58

Abstract: A component comprises a substrate (3); semiconductor components (1) connected to the substrate via contacts (2) which are arranged between the substrate and the semiconductor components; and supporting bodies (4, 5, 6) arranged between a prescribed region of a semiconductor component and the substrate. An Independent claim is also included for the production of a component. Preferred Features: Several prescribed regions are arranged on the periphery of a semiconductor component and supported by several supporting bodies. The supporting bodies are made from a metal, polymer and/or a ceramic material.

公开(公告)号：DE10137666A1

公开(公告)日：2003-02-27

申请号：DE10137666

申请日：2001-08-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GEBAUER UTA ,  STRUTZ VOLKER

IPC: H01L21/54 ,  H01L23/24 ,  H01L23/42 ,  H01L23/04 ,  H01L23/16 ,  H01L23/50 ,  H05K3/28

公开(公告)号：DE10137618A1

公开(公告)日：2003-02-27

申请号：DE10137618

申请日：2001-08-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GEBAUER UTA ,  STRUTZ VOLKER ,  MEYER THORSTEN

IPC: H01L23/10 ,  H01L25/065 ,  H01L23/04 ,  H01L23/50 ,  H05K5/03

Abstract: A protective device is described for subassemblies having a substrate and components disposed thereon and to be protected, for example semiconductor components. The protective device has at least one covering element for covering a subassembly, and at least one compression prevention element, which is disposed between the at least one covering element and the substrate and which is connected to the substrate and a surface of the covering element which faces the components and the substrate in such a way that a predefined spacing between covering element and the components to be protected can be maintained or is maintained.

公开(公告)号：DE10014305A1

公开(公告)日：2001-10-04

申请号：DE10014305

申请日：2000-03-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GEBAUER UTA ,  MUENCH THOMAS ,  WANNINGER FRIEDRICH

IPC: H01L23/498 ,  H01L23/50 ,  H01L21/60

Abstract: An electronic component comprises multiple contact bumps (1) arranged on one side of an intermediate carrier (2). Conductive strips (3) from the bumps (1) are connected to exposed contact terminals (5) in the bond channel window (4) and thus to the contact surfaces of the semiconductor chip (7). The neutral point (8) of the chip is arranged in the centre of the bond channel window and the width of the window increases with increasing distance from the neutral point.

公开(公告)号：DE10137667A1

公开(公告)日：2003-02-27

申请号：DE10137667

申请日：2001-08-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GEBAUER UTA ,  STRUTZ VOLKER

IPC: H01L23/16 ,  H01L23/36 ,  H05K3/30 ,  H01L23/04 ,  H01L23/50

Abstract: A protective device is provided for subassemblies having a substrate and a component disposed thereon and needing to be protected. The component typically is a semiconductor component. The protective device includes a covering element, a spacer, and a guide. The covering element covers a subassembly. The spacer is disposed between the covering element and the substrate for maintaining a predefined spacing between the covering element and the component to be protected in the area of the spacer. The guide is used for fixing a free end of the spacer to the covering element and/or to the substrate in a predefined X and/or Y position.

公开(公告)号：DE10137619A1

公开(公告)日：2003-02-27

申请号：DE10137619

申请日：2001-08-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GEBAUER UTA ,  STRUTZ VOLKER ,  WENNEMUTH INGO

IPC: H01L23/10 ,  H01L25/065 ,  H01L23/04

Abstract: A covering element for covering subassemblies having a substrate and at least one component disposed thereon and to be protected, in particular, a semiconductor component, includes at least one substantially planar area for covering the at least one component to be protected, one or more moldings serving for mechanical support, at least one of the moldings being in contact with the substrate and/or a supporting element disposed on the substrate after the covering element has been mounted on the subassembly, and the planar area and the molding being disposed such that, in the event of pressure on the covering element, no displacement of the at least one component ( 4 ) to be protected occurs.

公开(公告)号：DE10101875A1

公开(公告)日：2002-08-01

申请号：DE10101875

申请日：2001-01-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WENNEMUTH INGO ,  GEBAUER UTA

IPC: H01L21/768 ,  H01L23/48 ,  H01L25/065 ,  H01L23/50 ,  G11C5/02 ,  H01L21/60 ,  H01L23/538

公开(公告)号：DE10014305C2

公开(公告)日：2002-02-07

申请号：DE10014305

申请日：2000-03-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GEBAUER UTA ,  MUENCH THOMAS ,  WANNINGER FRIEDRICH

IPC: H01L23/498 ,  H01L23/50 ,  H01L21/60

Abstract: The invention relates to an electronic device having a multiplicity of contact bumps and an intermediate support. In this case, the intermediate support connects the multiplicity of contact bumps to contact areas of a semiconductor chip via a multiplicity of flat conductors which have contact connecting lugs exposed in a bonding channel window of the intermediate support. The contact areas are configured in the bonding channel window via the bonded contact connecting lugs of the flat conductors. The width of the bonding channel window is increasingly greater with increasing distance from the neutral point of the semiconductor chip.

公开(公告)号：DE10135393B4

公开(公告)日：2004-02-05

申请号：DE10135393

申请日：2001-07-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  GEBAUER UTA ,  STRUTZ VOLKER ,  HEDLER HARRY

IPC: B23K1/00 ,  H01L21/60 ,  H05K3/32 ,  H01L23/50 ,  H01L21/58

Abstract: An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.

公开(公告)号：DE10121578C2

公开(公告)日：2003-04-10

申请号：DE10121578

申请日：2001-05-03

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GEBAUER UTA ,  WENNEMUTH INGO ,  HOEGERL JUERGEN ,  POHL JENS

IPC: H01L21/00 ,  H01L21/68 ,  H05K13/02 ,  H01L21/58 ,  B65G47/91 ,  B65G49/07 ,  B65G43/08

Abstract: A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.