公开(公告)号：DE10155139A1

公开(公告)日：2003-02-27

申请号：DE10155139

申请日：2001-11-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER ,  HEINDL WERNER

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50

Abstract: Electronic component comprises a semiconductor element (4) mounted in a plastic housing (8) having horizontally running flat conductor connections (10); and electrical connections arranged between the contact surfaces (43) on one active surface (41) of the element and contact connecting surfaces (105) of the conductor connections using bonding wires (12). The conductor connections are each structured and are vertically and/or horizontally flexible. An Independent claim is also included for a process for the production of the electronic component. Preferably the conductor connections each have a recess (101). The semiconductor element is mounted with its passive rear side (42) on a support substrate (6).

公开(公告)号：DE10137184A1

公开(公告)日：2003-02-27

申请号：DE10137184

申请日：2001-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/50 ,  H01L21/60 ,  H01L21/58

Abstract: An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

公开(公告)号：DE10146306A1

公开(公告)日：2003-01-02

申请号：DE10146306

申请日：2001-09-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN

IPC: H01L23/498 ,  H01L23/50 ,  H01L21/60 ,  H01L21/56

Abstract: The device has at least one semiconducting chip (4) and a bearer substrate (6) for accepting and electrically contacting the chip(s), whereby the bearer substrate has at least sectionally parallel conducting tracks (64) on its surface facing the chip(s) and in contact with chip contact surfaces (43). Each track is available for connection over approximately its entire length. AN Independent claim is also included for the following: a method of manufacturing an inventive device.