公开(公告)号：WO2004070382A2

公开(公告)日：2004-08-19

申请号：PCT/DE2004000165

申请日：2004-02-03

Applicant: INFINEON TECHNOLOGIES AG ,  GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  BAUER MICHAEL ,  WOERNER HOLGER

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  BAUER MICHAEL ,  WOERNER HOLGER

IPC: B01L3/00 ,  B01L9/00 ,  G01N33/487 ,  G01N27/327

CPC classification number: G01N33/48785 ,  B01L3/502715 ,  B01L9/52 ,  B01L2200/027 ,  B01L2300/0819 ,  B01L2300/0877 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to a measuring instrument and a measuring method for chip card-shaped biosensors (1), and methods for the production thereof. The biosensor (1) is provided with a semiconductor chip (2) having a bioactive structure (3) and contact areas (4). The biosensor (1) is covered by a rewiring substrate (6) which protrudes from the semiconductor chip (2) such that outer contact surfaces of the rewiring substrate (6) are freely accessible. Both the biosensor (1) and the measuring instrument that is adapted thereto are designed as disposable products.

Abstract translation: 本发明涉及一种测量仪器和用于芯片卡状生物传感器（1）和方法的测量方法用于制造相同的。 为了这个目的，一个半导体芯片（2）在生物传感器上（1）与生物活性结构（3）和接触区（4）。 所述的生物传感器（1）由再布线基板盖住。 内插基板（6）超过半导体芯片的项目（2），以使内插基板的外接触表面（6）的自由接近。 无论是生物传感器（1）和适于此计被设计为一次性产品。

公开(公告)号：WO03015165A3

公开(公告)日：2003-07-31

申请号：PCT/DE0202811

申请日：2002-07-31

Applicant: INFINEON TECHNOLOGIES AG ,  GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER ,  THUMBS JOSEF

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER ,  THUMBS JOSEF

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31

CPC classification number: H01L21/561 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/0508 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/83104 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/11

Abstract: The invention relates to an electronic component, in which a semiconductor chip (3) is arranged, with a plastic housing (2) and method for production thereof. The lower side (6) of the plastic housing (2) comprises external contacts (7). The external contacts (7) are connected to contact surfaces (11) on the active upper side (12) of the semiconductor chip (3) by means of contact pegs (8) on the semiconductor chip (3) and by interconnecting lines (10) arranged on the plastic housing body (9). The contact pegs (8) thus represent an electrically-conducting projection of the contact surfaces (11).

Abstract translation: 本发明涉及一种具有塑料壳体（2）的电子部件及其制造方法，其中布置有半导体芯片（3）。 塑料外壳（2）的下侧（6）具有外部触点（7）。 外触点（7）通过接触柱连接在所述半导体芯片的（8）（3），并且在塑料外壳的组合物（9），布置连接到接触上的半导体芯片（3）的有源顶部侧（12）的表面（11）重新布线线（10）。 接触柱（8）表示接触表面（11）的导电高度。

公开(公告)号：DE102014115882B3

公开(公告)日：2016-02-25

申请号：DE102014115882

申请日：2014-10-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  HEITZER LUDWIG ,  STUEMPFL CHRISTIAN

IPC: H01L23/485 ,  H01L21/58

Abstract: Das Verfahren umfasst das Bereitstellen eines Halbleiter-Die, wobei der Halbleiter-Die eine erste Hauptfläche und eine zweite Hauptfläche gegenüber der ersten Hauptfläche und mindestens ein elektrisches Kontaktelement auf der ersten Hauptfläche umfasst, das Aufbringen einer Isolierschicht auf der zweiten Hauptfläche des Halbleiter-Die, das Aufbringen einer Interconnect-Lotschicht auf der Isolierschicht und das Anbringen des Halbleiter-Die mit der Interconnect-Lotschicht an einem Träger.

公开(公告)号：DE10137184B4

公开(公告)日：2007-09-06

申请号：DE10137184

申请日：2001-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/12 ,  H01L23/50 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31

Abstract: An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

公开(公告)号：DE102006001602A1

公开(公告)日：2007-05-24

申请号：DE102006001602

申请日：2006-01-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  STROBEL PETER ,  POHL JENS ,  STUEMPFL CHRISTIAN ,  HEITZER LUDWIG

IPC: H01L23/498 ,  H01L23/50

Abstract: Semiconductor component comprises a wiring substrate (2) with bond surfaces (5) and a chip on an island where there is a metal layer structure (15) comprises a copper base layer (10) facing the wiring substrate and a noble metal cover layer (12) facing the chip with an intermediate layer (11) of nickel or nickel alloy. The intermediate layer facing the cover layer has a surface roughness of 0.1-3 mu m : An independent claim is also included for a production process for the above.

公开(公告)号：DE102005051414B3

公开(公告)日：2007-04-12

申请号：DE102005051414

申请日：2005-10-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ESCHER-POEPPEL IRMGARD ,  POHL JENS ,  BRUNNBAUER MARKUS ,  BAUER MICHAEL ,  STUEMPFL CHRISTIAN

IPC: H01L23/50 ,  H01L21/50 ,  H01L23/498 ,  H01L25/065

Abstract: A semiconductor component with solder balls (2), plastic housing and a lower wiring substrate (4) of a base semiconductor component (5) comprises a central upper region of the wiring having a spatially limited plastic mass (3) and with solder balls on the upper side of the lower wiring substrate in edge regions (11) surrounded by a film template (15) having openings (16) in which the solder balls are arranged in a spatially limited manner. Independent claims are also included for production processes for the above.

公开(公告)号：DE10360708A1

公开(公告)日：2005-07-28

申请号：DE10360708

申请日：2003-12-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： POHL JENS ,  ROEMER BERND ,  SCHAETZLER BERNHARD ,  VILSMEIER HERMANN ,  WOERNER HOLGER ,  ZUHR BERNHARD ,  STUEMPFL CHRISTIAN

IPC: H01L23/12 ,  H01L21/56 ,  H01L23/00 ,  H01L23/04 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H01L25/065 ,  H01L23/50 ,  H01L23/16 ,  H01L21/50

Abstract: An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor component further includes an upper interposing unit, on which upper external contact pads are arranged. The two interposing units are electrically connected to one another via bonding connections disposed at their edge areas. The basic semiconductor component is a compact component on which different, customer-specific semiconductor components can be stacked.

公开(公告)号：DE10240461A1

公开(公告)日：2004-03-11

申请号：DE10240461

申请日：2002-08-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L21/60 ,  H01L25/065

Abstract: Electronic component comprises a semiconductor chip (3) having chip contacts (4) on its contact surfaces. The chip contacts are mechanically fixed on contact connecting surfaces (5) of a rewiring structure (6) and electrically connected to the rewiring structure. The rewiring structure is formed as a region of a structured metal plate or structured metal layer of a metal-laminated base plate. Independent claims are also included for the following: (1) Process for the production of an electronic component; and (2) Panel for the electronic component having a shape-stable plastic plate.

公开(公告)号：DE102006033701B4

公开(公告)日：2012-02-23

申请号：DE102006033701

申请日：2006-07-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL DIPL ING ,  STUEMPFL CHRISTIAN ,  HEITZER LUDWIG DIPL ING

IPC: H01L21/60 ,  H01L21/56 ,  H01L23/50

Abstract: Herstellungsverfahren für ein elektronisches Bauelement, mit den Schritten: – Bereitstellen eines Opfersubstrates (20), – Verankern eines Halbleiterelementes auf dem Opfersubstrat, – Kontaktieren des Halbleiterelementes mit dem Opfersubstrat mit einem Ausbilden von Kontaktierungspunkten (30) auf dem Opfersubstrat, – Ausbilden einer Verkapselung (40) auf der mit dem Halbleiterelement bestückten Oberseite des Opfersubstrates, – Abtragen des Opfersubstrates mit einer Freilegung der Kontaktierungspunkte auf der Unterseite der Verkapselung, wobei als Opfersubstrat (20) ein auf der Oberseite metallisiertes ätz- und ablösbares Papier verwendet wird und das Abtragen des Opfersubstrats mittels eines kombinierten Ätz- und Abweichprozesses erfolgt.

公开(公告)号：DE102006046851B4

公开(公告)日：2011-02-10

申请号：DE102006046851

申请日：2006-10-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  STUEMPFL CHRISTIAN ,  HEITZER LUDWIG

IPC: H01L23/488 ,  H01L21/60 ,  H01L23/28 ,  H01L23/50