公开(公告)号：WO03015165A3

公开(公告)日：2003-07-31

申请号：PCT/DE0202811

申请日：2002-07-31

Applicant: INFINEON TECHNOLOGIES AG ,  GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER ,  THUMBS JOSEF

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER ,  THUMBS JOSEF

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31

CPC classification number: H01L21/561 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/0508 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/83104 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/11

Abstract: The invention relates to an electronic component, in which a semiconductor chip (3) is arranged, with a plastic housing (2) and method for production thereof. The lower side (6) of the plastic housing (2) comprises external contacts (7). The external contacts (7) are connected to contact surfaces (11) on the active upper side (12) of the semiconductor chip (3) by means of contact pegs (8) on the semiconductor chip (3) and by interconnecting lines (10) arranged on the plastic housing body (9). The contact pegs (8) thus represent an electrically-conducting projection of the contact surfaces (11).

Abstract translation: 本发明涉及一种具有塑料壳体（2）的电子部件及其制造方法，其中布置有半导体芯片（3）。 塑料外壳（2）的下侧（6）具有外部触点（7）。 外触点（7）通过接触柱连接在所述半导体芯片的（8）（3），并且在塑料外壳的组合物（9），布置连接到接触上的半导体芯片（3）的有源顶部侧（12）的表面（11）重新布线线（10）。 接触柱（8）表示接触表面（11）的导电高度。

公开(公告)号：DE10137184B4

公开(公告)日：2007-09-06

申请号：DE10137184

申请日：2001-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/12 ,  H01L23/50 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31

Abstract: An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

公开(公告)号：DE10155139A1

公开(公告)日：2003-02-27

申请号：DE10155139

申请日：2001-11-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER ,  HEINDL WERNER

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50

Abstract: Electronic component comprises a semiconductor element (4) mounted in a plastic housing (8) having horizontally running flat conductor connections (10); and electrical connections arranged between the contact surfaces (43) on one active surface (41) of the element and contact connecting surfaces (105) of the conductor connections using bonding wires (12). The conductor connections are each structured and are vertically and/or horizontally flexible. An Independent claim is also included for a process for the production of the electronic component. Preferably the conductor connections each have a recess (101). The semiconductor element is mounted with its passive rear side (42) on a support substrate (6).

公开(公告)号：DE10137184A1

公开(公告)日：2003-02-27

申请号：DE10137184

申请日：2001-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/50 ,  H01L21/60 ,  H01L21/58

Abstract: An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

公开(公告)号：DE10142118B4

公开(公告)日：2007-07-12

申请号：DE10142118

申请日：2001-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L25/065 ,  H01L23/50

Abstract: An electronic component has a carrier substrate to accommodate two semiconductor chips that are connected to each other. The second semiconductor chip rests with two opposite marginal supporting regions on an upper side of the carrier substrate. The first semiconductor chip is disposed at a distance from a frame of the carrier substrate, in a central recess in the latter. A process for the production of the electronic component is further described.

公开(公告)号：DE10243947B4

公开(公告)日：2007-02-01

申请号：DE10243947

申请日：2002-09-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/31 ,  H01L23/49

Abstract: The electronic component (2) comprises a flat chip carrier (6) assigned to a semiconductor chip (4). The contact areas (43) on active chip surface (41) and the contact terminal areas (63) on an upper side (61) of the chip carrier, are formed by elastic strips (81) of material that can undergo microstructuring. The strips are provided with an electrically conductive coating. An Independent claim is also included for electronic component manufacturing method.

公开(公告)号：DE50214717D1

公开(公告)日：2010-11-25

申请号：DE50214717

申请日：2002-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER ,  THUMBS JOSEF

IPC: H01L23/12 ,  H01L23/31 ,  H01L21/56 ,  H01L21/68

公开(公告)号：DE10142119B4

公开(公告)日：2007-07-26

申请号：DE10142119

申请日：2001-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L25/065 ,  H01L23/50

公开(公告)号：DE10142119A1

公开(公告)日：2003-03-27

申请号：DE10142119

申请日：2001-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L25/065 ,  H01L23/50

公开(公告)号：DE10142117A1

公开(公告)日：2003-03-27

申请号：DE10142117

申请日：2001-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L25/065 ,  H01L23/50