公开(公告)号：JP2002208595A

公开(公告)日：2002-07-26

申请号：JP2001352373

申请日：2001-11-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OFNER GERALD ,  HAGEN ROBERT CHRISTIAN

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L21/822 ,  H01L23/48 ,  H01L23/552 ,  H01L27/04 ,  H05K1/02 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide an electronic component whose coupling by a stray electromagnetic field is prevented. SOLUTION: The electronic component 1 is equipped with a shielding body 2 comprising a semiconductor chip 3 equipped with a semiconductor substrate 4. A conductive buried layer 7 is arranged and installed in the region on the rear 6 of the semiconductor substrate 4. The buried layer 7 is connected to a contact face 8 and an external ground potential via a grounding conductor 10 arranged and installed on the inside of the semiconductor substrate 4.

公开(公告)号：WO2005045931A3

公开(公告)日：2005-08-11

申请号：PCT/DE2004002440

申请日：2004-11-03

Applicant: INFINEON TECHNOLOGIES AG ,  OFNER GERALD ,  TEO MARY ,  TAN AI MIN

Inventor： OFNER GERALD ,  TEO MARY ,  TAN AI MIN

IPC: H01L21/56 ,  H01L23/485 ,  H01L23/498

CPC classification number: H01L24/10 ,  H01L21/563 ,  H01L23/3171 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13006 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01014 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00

Abstract: The invention relates to a semiconductor chip (1) having flip-chip contacts (2), whereby the flip-chip contacts (2) are placed on contact surfaces (3) of the active top side (4) of the semiconductor chip (1). The contact surfaces (3) are surrounded by a passivation layer (5) that covers the active top side (4) while leaving the contact surfaces (3) exposed. The passivation layer (5) comprises thickenings (6) that encircle the contact surfaces (3). A semiconductor layer (1) of this type with thickenings (6) encircling the contact surfaces (3) is protected from delamination when packing the semiconductor chip (1) to form a semiconductor component.

Abstract translation: 本发明涉及一种半导体芯片（1）与倒装片触点（2），其中，所述倒装芯片触点（2）接触的区域（3）的有源顶部侧（4）的半导体芯片（1）的布置。 的接触表面（3）是含有活性顶侧（4）覆盖，而留下的接触区域所包围的钝化层（5）的（3）。 钝化层（5）具有加厚部分（6），其围绕所述接触区域（3）。 这样的半导体芯片（1）具有加厚部分（6）周围的接触面（3）在剥离前的半导体芯片（1）的包装被保护的半导体器件。

公开(公告)号：WO2004070382A2

公开(公告)日：2004-08-19

申请号：PCT/DE2004000165

申请日：2004-02-03

Applicant: INFINEON TECHNOLOGIES AG ,  GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  BAUER MICHAEL ,  WOERNER HOLGER

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  BAUER MICHAEL ,  WOERNER HOLGER

IPC: B01L3/00 ,  B01L9/00 ,  G01N33/487 ,  G01N27/327

CPC classification number: G01N33/48785 ,  B01L3/502715 ,  B01L9/52 ,  B01L2200/027 ,  B01L2300/0819 ,  B01L2300/0877 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to a measuring instrument and a measuring method for chip card-shaped biosensors (1), and methods for the production thereof. The biosensor (1) is provided with a semiconductor chip (2) having a bioactive structure (3) and contact areas (4). The biosensor (1) is covered by a rewiring substrate (6) which protrudes from the semiconductor chip (2) such that outer contact surfaces of the rewiring substrate (6) are freely accessible. Both the biosensor (1) and the measuring instrument that is adapted thereto are designed as disposable products.

Abstract translation: 本发明涉及一种测量仪器和用于芯片卡状生物传感器（1）和方法的测量方法用于制造相同的。 为了这个目的，一个半导体芯片（2）在生物传感器上（1）与生物活性结构（3）和接触区（4）。 所述的生物传感器（1）由再布线基板盖住。 内插基板（6）超过半导体芯片的项目（2），以使内插基板的外接触表面（6）的自由接近。 无论是生物传感器（1）和适于此计被设计为一次性产品。

公开(公告)号：WO03015165A3

公开(公告)日：2003-07-31

申请号：PCT/DE0202811

申请日：2002-07-31

Applicant: INFINEON TECHNOLOGIES AG ,  GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER ,  THUMBS JOSEF

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER ,  THUMBS JOSEF

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31

CPC classification number: H01L21/561 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/0508 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/83104 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/11

Abstract: The invention relates to an electronic component, in which a semiconductor chip (3) is arranged, with a plastic housing (2) and method for production thereof. The lower side (6) of the plastic housing (2) comprises external contacts (7). The external contacts (7) are connected to contact surfaces (11) on the active upper side (12) of the semiconductor chip (3) by means of contact pegs (8) on the semiconductor chip (3) and by interconnecting lines (10) arranged on the plastic housing body (9). The contact pegs (8) thus represent an electrically-conducting projection of the contact surfaces (11).

Abstract translation: 本发明涉及一种具有塑料壳体（2）的电子部件及其制造方法，其中布置有半导体芯片（3）。 塑料外壳（2）的下侧（6）具有外部触点（7）。 外触点（7）通过接触柱连接在所述半导体芯片的（8）（3），并且在塑料外壳的组合物（9），布置连接到接触上的半导体芯片（3）的有源顶部侧（12）的表面（11）重新布线线（10）。 接触柱（8）表示接触表面（11）的导电高度。

公开(公告)号：DE102017217595A1

公开(公告)日：2018-04-05

申请号：DE102017217595

申请日：2017-10-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  OFNER GERALD ,  SCHERL PETER ,  BRADL STEPHAN ,  MIETHANER STEFAN ,  HEINRICH ALEXANDER ,  THEUSS HORST

IPC: H01L21/50

Abstract: Ein Verfahren zum Produzieren von Halbleitervorrichtungen im Gehäuse enthält Bereitstellen einer ersten Gehäusesubstratplatte. Eine zweite Gehäusesubstratplatte wird bereitgestellt. Die erste und die zweite Gehäusesubstratplatte werden unter Verwendung eines Steuermechanismus durch eine Fertigungsstraße bewegt, die mehrere Gehäusefertigungswerkzeuge enthält. Halbleitervorrichtungen im Gehäuse vom ersten Typ werden auf der ersten Gehäusesubstratplatte gebildet, und Halbleitervorrichtungen im Gehäuse vom zweiten Typ werden auf der zweiten Gehäusesubstratplatte gebildet. Die Halbleitervorrichtung im Gehäuse vom zweiten Typ ist von der Halbleitervorrichtung im Gehäuse vom ersten Typ verschieden. Der Steuermechanismus bewegt sowohl die erste als auch die zweite Gehäusesubstratplatte auf nichtlineare Weise durch die Fertigungsstraße.

公开(公告)号：DE102009029873A1

公开(公告)日：2010-01-14

申请号：DE102009029873

申请日：2009-06-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  OFNER GERALD

IPC: H01L21/60 ,  H01L23/50

公开(公告)号：DE10137184B4

公开(公告)日：2007-09-06

申请号：DE10137184

申请日：2001-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/12 ,  H01L23/50 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31

Abstract: An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

公开(公告)号：DE112004002722T5

公开(公告)日：2007-06-21

申请号：DE112004002722

申请日：2004-02-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRWIN ABERIN ,  OFNER GERALD ,  YEO SWAIN HONG ,  ZHU WEN HUI

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H05K3/28 ,  H05K3/30

公开(公告)号：DE10352349A1

公开(公告)日：2005-06-23

申请号：DE10352349

申请日：2003-11-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OFNER GERALD ,  TAN AI MIN ,  TEO MARY

IPC: H01L21/56 ,  H01L23/485 ,  H01L23/498 ,  H01L23/50 ,  H01L23/28 ,  H01L21/50

Abstract: A semiconductor chip includes flip chip contacts that are arranged on contact surfaces of an active top side of the semiconductor chip. The contact surfaces are surrounded by a passivation layer that covers the active top side while leaving exposed the contact surfaces. The passivation layer includes thickened portions that surround the contact surfaces. The semiconductor chip formed with thickened portions around the contact surfaces is protected from delamination during packaging of the semiconductor chip to form a semiconductor device.

公开(公告)号：DE10240461A1

公开(公告)日：2004-03-11

申请号：DE10240461

申请日：2002-08-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L21/60 ,  H01L25/065

Abstract: Electronic component comprises a semiconductor chip (3) having chip contacts (4) on its contact surfaces. The chip contacts are mechanically fixed on contact connecting surfaces (5) of a rewiring structure (6) and electrically connected to the rewiring structure. The rewiring structure is formed as a region of a structured metal plate or structured metal layer of a metal-laminated base plate. Independent claims are also included for the following: (1) Process for the production of an electronic component; and (2) Panel for the electronic component having a shape-stable plastic plate.