公开(公告)号：WO2017172059A1

公开(公告)日：2017-10-05

申请号：PCT/US2017/017226

申请日：2017-02-09

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios C. ,  EID, Feras ,  ELSHERBINI, Adel A. ,  NAIR, Vijay K. ,  KAMGAING, Telesphor ,  RAO, Valluri R. ,  SWAN, Johanna M.

IPC: H01H57/00 ,  H01L41/09 ,  H01L41/047 ,  H01L41/083

CPC classification number: B81C1/0015 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04

Abstract: Embodiments of the invention include a switching device that includes an electrode, a piezoelectric material coupled to the electrode, and a movable structure (e.g., cantilever, beam) coupled to the piezoelectric material. The movable structure includes a first end coupled to an anchor of a package substrate having organic layers and a second released end positioned within a cavity of the package substrate.

Abstract translation: 本发明的实施例包括开关装置，其包括电极，耦合到电极的压电材料以及耦合到压电材料的可移动结构（例如，悬臂梁）。 可移动结构包括耦合到具有有机层的封装衬底的锚的第一端和位于封装衬底的空腔内的第二释放端。

公开(公告)号：WO2017105472A1

公开(公告)日：2017-06-22

申请号：PCT/US2015/066523

申请日：2015-12-17

Applicant: INTEL CORPORATION

Inventor： EID, Feras ,  BRAUNISCH, Henning ,  DOGIAMIS, Georgios C. ,  OSTER, Sasha N.

IPC: B81B7/02 ,  B81B3/00 ,  G01P15/08 ,  G01P15/097

CPC classification number: G01P15/097 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/0023 ,  G01P15/0802

Abstract: Embodiments of the invention include a microelectronic device having a sensing device and methods of forming the sensing device. In an embodiment, the sensing device includes a mass and a plurality of beams to suspend the mass. Each beam comprises first and second conductive layers and an insulating layer positioned between the first and second conductive layers to electrically isolate the first and second conductive layers. The first conductive layer is associated with drive signals and the second conductive layer is associated with sense signals of the sensing device.

Abstract translation: 本发明的实施例包括具有感测装置的微电子装置以及形成感测装置的方法。 在一个实施例中，感测装置包括质量块和多个梁以悬挂质量块。 每个梁包括第一和第二导电层以及位于第一和第二导电层之间以绝缘第一和第二导电层的绝缘层。 第一导电层与驱动信号相关联，并且第二导电层与感测设备的感测信号相关联。

公开(公告)号：WO2017052660A1

公开(公告)日：2017-03-30

申请号：PCT/US2015/052496

申请日：2015-09-25

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  OSTER, Sasha N. ,  RAWLINGS, Brandon M. ,  DOGIAMIS, Georgios C.

IPC: H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q1/2283 ,  H01Q9/0457 ,  H01Q13/02

Abstract: Antennas are described for platform level wireless interconnects. In one example, a substantially flat package substrate has an attached radio. A conductive transmission line on the package substrate is electrically connected to the radio and an antenna is attached to the package substrate connected to the conductive transmission line, the antenna radiating to the side of the package.

Abstract translation: 天线被描述为平台级无线互连。 在一个示例中，基本平坦的封装衬底具有连接的无线电装置。 封装衬底上的导电传输线电连接到无线电装置，并且天线附接到连接到导电传输线的封装衬底，天线辐射到封装的侧面。

公开(公告)号：EP4356174A1

公开(公告)日：2024-04-24

申请号：EP22825489.2

申请日：2022-03-28

Applicant: INTEL Corporation

Inventor： ALEKSOV, Aleksandar ,  KAMGAING, Telesphor ,  STRONG, Veronica ,  PRABHU GAUNKAR, Neelam ,  DOGIAMIS, Georgios C.

IPC: G02B6/42

CPC classification number: G02B2006/1203820130101 ,  G02B6/122 ,  G02B6/4246 ,  G02B6/4214 ,  G02B6/4259 ,  G02B6/12002 ,  G02B6/4274 ,  G02B6/4292 ,  G02B6/428 ,  G02B6/42

公开(公告)号：EP4106099A1

公开(公告)日：2022-12-21

申请号：EP22163739.0

申请日：2022-03-23

Applicant: INTEL Corporation

Inventor： KAMGAING, Telesphor ,  ALEKSOV, Aleksandar ,  DOGIAMIS, Georgios C. ,  STRONG, Veronica ,  PRABHU GAUNKAR, Neelam

IPC: H01P1/203 ,  H01P7/08 ,  H01P11/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related creating millimeter wave components within a glass core of a substrate within a semiconductor package. These millimeter wave components, which include resonators, isolators, directional couplers, and circulators, may be combined to form other structures such as filters or multiplexers. Other embodiments may be described and/or claimed.

公开(公告)号：EP3394928A1

公开(公告)日：2018-10-31

申请号：EP15911606.0

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K.

IPC: H01Q3/34 ,  H01Q21/06

CPC classification number: H04B1/44 ,  H01Q3/36 ,  H01Q3/42 ,  H01Q21/06 ,  H01Q21/22 ,  H01Q23/00 ,  H04B1/401

Abstract: Embodiments of the invention include a communication module that includes a die having a transceiver and a phase shifter die that is coupled to the die. The phase shifter includes a power combiner and splitter. The communication module also includes a substrate that is coupled to the phase shifter die. The substrate includes an antenna unit with steerable beam forming capability for transmitting and receiving communications.

公开(公告)号：EP3764466A1

公开(公告)日：2021-01-13

申请号：EP20175888.5

申请日：2015-12-22

Applicant: INTEL Corporation

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K.

IPC: H01Q1/22 ,  H01Q1/40 ,  H01Q3/26 ,  H01Q1/28 ,  H01Q23/00 ,  H01Q25/00 ,  G06F1/16 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q21/00 ,  H01Q21/28

Abstract: Embodiments of the invention include a microelectronic device comprising a package substrate; an antenna within the package substrate, wherein the antenna is configured to transmit or receive wireless communications with a frequency of at least 24 gigahertz; and a die physically coupled with the package substrate within the microelectronic device, wherein the die includes circuitry related to transmission or reception of a wireless communication.

公开(公告)号：EP3732785A1

公开(公告)日：2020-11-04

申请号：EP17936634.9

申请日：2017-12-28

Applicant: INTEL Corporation

Inventor： EID, Feras ,  KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K. ,  SWAN, Johanna M.

IPC: H03H9/64 ,  H03H9/25 ,  H03H9/145

公开(公告)号：EP3506418A1

公开(公告)日：2019-07-03

申请号：EP18209354.2

申请日：2018-11-29

Applicant: INTEL Corporation

Inventor： ELSHERBINI, Adel A. ,  DOGIAMIS, Georgios C. ,  OSTER, Sasha N. ,  EWY, Erich N. ,  KAMGAING, Telesphor ,  SWAN, Johanna M.

IPC: H01P5/107 ,  H04W4/38 ,  H04W4/40 ,  G05D1/00 ,  H01Q1/32 ,  H04L12/40

Abstract: Embodiments include a sensor node, a method of forming the sensor node, and a vehicle with a communication system that includes sensor nodes. A sensor node includes an interconnect with an input connector, an output connector, and an opening on one or more sidewalls. The sensor node also includes a package with one or more sidewalls, a top surface, and a bottom surface, where at least one of the sidewalls of the package is disposed on the opening of interconnect. The sensor node may have a control circuit on the package, a first millimeter-wave launcher on the package, and a sensor coupled to the control circuit, where the sensor is coupled to the control circuit with an electrical cable. The sensor node may include that at least one of the sidewalls of the package is crimped by the opening and adjacent and co-planar to an inner wall of the interconnect.

公开(公告)号：EP4202961A1

公开(公告)日：2023-06-28

申请号：EP22208283.6

申请日：2022-11-18

Applicant: INTEL Corporation

Inventor： KAMGAING, Telesphor ,  ALEKSOV, Aleksandar ,  RAWLINGS, Brandon ,  DOGIAMIS, Georgios C. ,  STRONG, Veronica ,  PRABHU GAUNKAR, Neelam

IPC: H01F17/00 ,  H01F41/04

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a magnetic ring is embedded in the substrate. In an embodiment, a loop is around the magnetic ring. In an embodiment, the loop is conductive and comprises a first via through the substrate, a second via through the substrate, and a trace over a surface of the substrate, where the trace electrically couples the first via to the second via.