Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition useful as an excellent chemical amplification type resist which prevents a change of the line width of a resist pattern and the formation of T shape due to the time elapsed from exposure until heating after exposure [post-exposure delay(PED)], is not affected by a stationary wave due to reflection from a substrate and can be applied even in a very small pattern size. SOLUTION: The radiation sensitive resin composition contains (A) a copolymer containing repeating units of formula 1 (where R1 is H or methyl; and R2 is an acid releasable >=11C alicyclic alkyl having a tertiary carbon atom> and repeating units derived from hydroxystyrenes and (B) a radiation sensitive acid generating agent.
Abstract:
PROBLEM TO BE SOLVED: To obtain the subject polymer capable of manifesting favorable orientation characteristics, and useful as a liquid crystal orientation agent capable of forming highly reliable liquid crystal orientation membranes with short afterimage vanishing time in liquid crystal display devices by reaction between specific tetracarboxylic acid anhydrides and a specific diamine. SOLUTION: This polymer is obtained by reaction between (A) at least one kind of acid dianhydride selected from respective compounds of formula I and formula II (R1 and R2 are each a tetravalent organic group; respective acid anhydride groups situated left and right relative to R1 as the center form the corresponding six-membered rings together with R1 to which they are bound, and an acid anhydride group situated right relative to R2 as the center forms a five-membered ring together with R2 to which it is bound, while an acid anhydride group situated left relative to R2 form a six-membered ring together with R2 to which it is bound), (B) at least one kind of acid dianhydride of formula III (R3 is a tetravalent organic group, and respective acid anhydride groups situated left and right relative to R3 as the center form the corresponding five-membered rings together with R3 to which they are bound) and (C) a compound of the formula H2N-R4-NH2 (R4 is a bivalent organic group).
Abstract:
PROBLEM TO BE SOLVED: To obtain a liquid crystal orienting agent, in which orientation ability of a liquid crystal molecule is surely imparted by rubbing treatment, capable of providing a liquid crystal orienting film having excellent liquid crystal orientation property by including polyamic acid and/or polyimide and a specific compound. SOLUTION: This liquid crystal orienting agent is obtained by including (A) 0.1-20 wt.% (i) polyamic acid and/or (ii) polyimide, preferably having 0.05-10 dl/g intrinsic viscosity and (B) 0.01-1 wt.% compound of the formula [R is H or an aliphatic hydrocarbon having (n) valence; (n) is >=1; when R is H, (n) is 1]. The component (i) is prepared by reacting a tetracarboxylic dianhydride with a diamine compound. The component (ii) is prepared by a method heating, e.g. the component (i) to carry out cyclodehydration, or the like. The component B includes water, methanol, ethanol, butanediol or ethylene glycol.
Abstract:
PROBLEM TO BE SOLVED: To obtain a new cyclic compound having a high molecular weight, a relatively high refractive index by making the compound include sulfur, useful as a material for an optical member. SOLUTION: This compound is a cyclic thioaryl ester of formula I. The cyclic compound is obtained by reacting 4,4'-thiobisbenzenethiol with a phenylenedicarboxylic acid halide. The cyclic compound of formula I is reacted with a sulfide compound of formula II [X is a CH2 -O-R (R is a 1-6C alkyl or phenyl); Y is H or is bonded to X to form a 2-6C alkylene] to give a sulfur atom-containing cyclic compound of formula III of macrocyclic structure. A sulfur atom-containing cyclic compound of macrocyclic structure can be obtained by carrying out the reaction in the more excessive ratio of the sulfide compound of formula II based on the cyclic compound of formula I.
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate-processing method capable of forming a temporary fixing material without floatation between a substrate or a support and a temporary fixing material when laminating a substrate and a support in a method for temporary fixing via a temporary fixing material having an adhesive layer and a peeling layer partially formed.SOLUTION: A substrate-temporary fixing method has steps of: (1) forming an adhesive layer and a peeling layer, in this order, on a substrate with a temporary fixing composition having a polymer (A) and a compound (B) substantially immiscible with the polymer (A); (2) temporarily fixing the above substrate and a support via an adhesive layer, except for a part of the above peeling layer; (4) forming the rest of the adhesive layer, the rest of the peeling layer and the support, in this order, on the substrate, except for a part of the above adhesive layer; and (5) peeling the substrate after processing from the support; in this order.
Abstract:
PROBLEM TO BE SOLVED: To provide a novel radiation sensitive resin composition having high transparency to radiation, excellent basic physical properties for a resist pattern such as in sensitivity, resolution, and pattern shapes, without causing development defects during fine machining, to manufacture semiconductor elements at a high yield. SOLUTION: The radiation-sensitive resin compositions comprises (A) a resin containing an acid dissociable group obtained by the open ring polymerization of the norbornene derivative having a structure shown by the following general formula (1), and (B) a radiation-sensitive acid generator. In the general formula (1), R 1 represents a hydrogen atom and a univalent acid dissociation group, X 1 a low-grade fluorinated alkyl group, and R 2 a hydrogen atom, an alkyl group or a fluorinated alkyl group. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition capable of forming a chemically amplified negative resist film, which composition is effectively sensitive to EB (electron beam) or EUV (extreme ultraviolet radiation) and excellent in roughness, etching resistance, and sensitivity and which composition stably forms a highly precise fine pattern. SOLUTION: The negative radiation-sensitive resin composition comprises an arene-based compound (A) represented by general formula (1) or (2) (wherein R is mutually independently a hydrogen atom or a 1-8C alkyl group, X is mutually independently a 1-8C alkylene group, and at least any of Rs is a 1-8C alkyl group), a crosslinking agent (B), an acid generator (C), an acid-diffusion controller (D), and a solvent (E). COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a resorcinol derivative, by which the resorcinol derivative suitable as a compound constituting a radiation-sensitive composition can easily be obtained. SOLUTION: This method for producing the resorcinol derivative comprises reacting a compound represented by general formula (1) with a compound represented by general formula (2), mixing the reaction solution with an organic solvent, and then separating the product from the organic solvent by decantation to obtain the resorcinol derivative. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition suitable as a resist having sensitivity with respect to far ultraviolet rays, represented by active radiation (for example, ArF excimer laser, EUV, electron beam, and so forth), a substrate with resist film, and a pattern forming method. SOLUTION: The radiation-sensitive resin composition for use in a lithography process includes (A) a polymer, containing a structure represented by Formulae (1) and (B) a solvent. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a negative radiation-sensitive resin composition which is applicable to a conventional developer of normal concentration without problems, exhibits high resolution in a normal line-and-space pattern, can form a rectangular resist pattern, reduces resist pattern defects such as bridging after development, and is suitable for use as a chemically amplified negative resist excellent also in sensitivity, developability and dimensional faithfulness. SOLUTION: The negative radiation-sensitive resin composition contains a resin (A) containing a repeating unit represented by formula [1] and having a weight average molecular weight (expressed in terms of polystyrene) of 1,000-100,000 by gel permeation chromatography (GPC), a radiation-sensitive acid generator (B) and an acid crosslinking agent (C), wherein R 1 is hydrogen atom, methyl group, ethyl group or a 1-4C perfluoroalkyl group; one of R 2 and R 3 is RfSO 2 NHCH 2 -group (where Rf represents a 1-4C perfluoroalkyl group) and the remainder is hydrogen atom. The negative radiation-sensitive resin composition preferably contains an acid diffusion control agent (D) in combination with the resin (A), the radiation-sensitive acid generator (B) and the acid crosslinking agent (C). COPYRIGHT: (C)2007,JPO&INPIT